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Author: Rao Tummala
Publisher: Mcgraw-hill
ISBN: 9780071459068
Category : Technology
Languages : en
Pages : 0
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Book Description
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Author: Rao Tummala
Publisher: Mcgraw-hill
ISBN: 9780071459068
Category : Technology
Languages : en
Pages : 0
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Book Description
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Author:
Publisher:
ISBN: 9780071603157
Category : Microelectronic packaging
Languages : en
Pages : 785
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Book Description
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems8221; used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat gener.
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071593322
Category : Technology & Engineering
Languages : en
Pages : 807
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Book Description
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Author: Shichun Qu
Publisher: Springer
ISBN: 1493915568
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Author: Hiren D. Patel
Publisher: Springer Science & Business Media
ISBN: 1402084722
Category : Technology & Engineering
Languages : en
Pages : 212
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Book Description
ESL or “Electronic System Level” is a buzz word these days, in the electronic design automation (EDA) industry, in design houses, and in the academia. Even though numerous trade magazine articles have been written, quite a few books have been published that have attempted to de?ne ESL, it is still not clear what exactly it entails. However, what seems clear to every one is that the “Register Transfer Level” (RTL) languages are not adequate any more to be the design entry point for today’s and tomorrow’s complex electronic system design. There are multiple reasons for such thoughts. First, the c- tinued progression of the miniaturization of the silicon technology has led to the ability of putting almost a billion transistors on a single chip. Second, applications are becoming more and more complex, and integrated with c- munication, control, ubiquitous and pervasive computing, and hence the need for ever faster, ever more reliable, and more robust electronic systems is pu- ing designers towards a productivity demand that is not sustainable without a fundamental change in the design methodologies. Also, the hardware and software functionalities are getting interchangeable and ability to model and design both in the same manner is gaining importance. Given this context, we assume that any methodology that allows us to model an entire electronic system from a system perspective, rather than just hardware with discrete-event or cycle based semantics is an ESL method- ogy of some kind.
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119793777
Category : Technology & Engineering
Languages : en
Pages : 324
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Book Description
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Author: Chaudhery Mustansar Hussain
Publisher: Elsevier
ISBN: 012822553X
Category : Science
Languages : en
Pages : 368
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Book Description
Handbook on Miniaturization in Analytical Chemistry: Application of Nanotechnology provides a source of authoritative fundamentals, interdisciplinary knowledge and primary literature for researchers who want to fully understand how nano-technologies work. Covering all stages of analysis, from sample preparation to separation and detection, the book discusses the design and manufacturing technology of miniaturization and includes an entire section on safety risks, ethical, legal and social issues (ELSI), the economics of nanotechnologies, and a discussion on sustainability with respect to nano- and lab-on-chip technologies. This guide for students and researchers working on applications of nanotechnology in modern systems for analysis gives readers everything they need to know to bring their current practices up-to-date. Details the impacts of miniaturization and nanotechnology Includes coverage of the current challenges for scaling up nano-miniaturization design and manufacturing technology for analysis Provides the latest reference materials, including websites of interest and details on the latest research in every chapter
Author: Yoshinobu Baba
Publisher: Springer Science & Business Media
ISBN: 9781402010095
Category : Science
Languages : en
Pages : 678
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Book Description
The Sixth International Conference on Miniaturized Chemical and Biochemical Analysis Systems, known as /JTAS2002, will be fully dedicated to the latest scientific and technological developments in the field of miniaturized devices and systems for realizing not only chemical and biochemical analysis but also synthesis. The first /JTAS meeting was held in Enschede in 1994 with approximately 160 participants, bringing together the scientists with background in analytical and biochemistry with those with Micro Electro Mechanical Systems (MEMS) in one workshop. We are grateful to Piet Bergveld and Albert van den Berg of MESA Research Institute of the University of Twente for their great efforts to arrange this exciting first meeting. The policy of the meeting was succeeded by late Prof. Dr. Michael Widmer in the second meeting, /JTAS'96 held in Basel with 275 participants. The first two meetings were held as informal workshops. From the third workshop, /JTAS'98 (420 participants) held in Banff, the workshop had become a worldwide conference. Participants continued to increase in /JTAS2000 (about 500 participants) held in Enschede and /JTAS2001 (about 700 participants) held in Monterey. The number of submitted papers also dramatically increased in this period from 130 in 1998, 230 in 2000 to nearly 400 in 2001. From 2001, /JTAS became an annual symposium. The steering committee meeting held in Monterey, confrrmed the policy of former /JTAS that quality rather than quantity would be the key-point and that the parallel-session format throughout the 3.
Author: Jack Cazes
Publisher: CRC Press
ISBN: 0849390397
Category : Science
Languages : en
Pages : 1066
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Book Description
Compiled by the editor of Dekker's distinguished Chromatographic Science series, this reader-friendly reference is as a unique and stand-alone guide for anyone requiring clear instruction on the most frequently utilized analytical instrumentation techniques. More than just a catalog of commercially available instruments, the chapters are wri
Author: Thomas Laurell
Publisher: Royal Society of Chemistry
ISBN: 9780854048960
Category : Microchemistry
Languages : en
Pages : 644
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Book Description
