Silicon Carbide and Related Materials 2019 PDF Download
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Author: Hiroshi Yano
Publisher: Trans Tech Publications Ltd
ISBN: 3035735794
Category : Science
Languages : en
Pages : 1196
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Book Description
Selected peer-reviewed papers from International Conference on Silicon Carbide and Related Materials 2019 (ICSCRM 2019) Selected, peer-reviewed papers from the 18th International Conference on Silicon Carbide and Related Materials 2019 (ICSCRM 2019), September 29 - October 4, 2019, Kyoto, Japan
Author: Hiroshi Yano
Publisher: Trans Tech Publications Ltd
ISBN: 3035735794
Category : Science
Languages : en
Pages : 1196
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Book Description
Selected peer-reviewed papers from International Conference on Silicon Carbide and Related Materials 2019 (ICSCRM 2019) Selected, peer-reviewed papers from the 18th International Conference on Silicon Carbide and Related Materials 2019 (ICSCRM 2019), September 29 - October 4, 2019, Kyoto, Japan
Author: Hiroshi Yano
Publisher:
ISBN: 9781523135653
Category : Bipolar Devices
Languages : en
Pages : 1169
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Book Description
Author: Min Lu
Publisher: Trans Tech Publications Ltd
ISBN: 3035736421
Category : Science
Languages : en
Pages : 180
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Book Description
Selected peer-reviewed full text papers from the Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2019) Selected peer-reviewed papers from the Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2019), July 17-20, 2019, Beijing, China
Author: Min Lu
Publisher:
ISBN: 9783035716429
Category : Semiconductors
Languages : en
Pages : 0
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Book Description
Selected peer-reviewed full text papers from the Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2019) Selected peer-reviewed papers from the Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2019), July 17-20, 2019, Beijing, China
Author: Zhe Chuan Feng
Publisher: CRC Press
ISBN: 0429583958
Category : Science
Languages : en
Pages : 465
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Book Description
This handbook presents the key properties of silicon carbide (SiC), the power semiconductor for the 21st century. It describes related technologies, reports the rapid developments and achievements in recent years, and discusses the remaining challenging issues in the field. The book consists of 15 chapters, beginning with a chapter by Professor W. J. Choyke, the leading authority in the field, and is divided into four sections. The topics include presolar SiC history, vapor-liquid-solid growth, spectroscopic investigations of 3C-SiC/Si, developments and challenges in the 21st century; CVD principles and techniques, homoepitaxy of 4H-SiC, cubic SiC grown on 4H-SiC, SiC thermal oxidation processes and MOS interface, Raman scattering, NIR luminescent studies, Mueller matrix ellipsometry, Raman microscopy and imaging, 4H-SiC UV photodiodes, radiation detectors, and short wavelength and synchrotron X-ray diffraction. This comprehensive work provides a strong contribution to the engineering, materials, and basic science knowledge of the 21st century, and will be of interest to material growers, designers, engineers, scientists, postgraduate students, and entrepreneurs.
Author: Min Lu
Publisher: Trans Tech Publications Ltd
ISBN: 3035733856
Category : Technology & Engineering
Languages : en
Pages : 226
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Book Description
Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2018) Selected, peer reviewed papers from the Asia-Pacific Conference on Silicon Carbide and Related Materials (APCSCRM 2018), July 9-12, 2018, Beijing, China
Author: Roland Madar
Publisher: Trans Tech Publications Ltd
ISBN: 3035706298
Category : Technology & Engineering
Languages : en
Pages : 1548
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Book Description
Because of their many superior properties, including a wide band-gap and high breakdown field, which are different to those of conventional semiconductors such as Si and GaAs, compounds such as SiC, III-Nitrides and related materials are currently attracting increasing attention and are being targeted as possible solutions in a variety of problematic fields of electronic application: including high temperature, high power, radiation-resistant and microwave use. Volume is indexed by Thomson Reuters CPCI-S (WoS).
Author: Konstantinos Zekentes
Publisher: Trans Tech Publications Ltd
ISBN: 3035730431
Category : Technology & Engineering
Languages : en
Pages : 796
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Book Description
Selected, peer reviewed papers from the 11th European Conference on Silicon Carbide and Related Materials 2016 (ECSCRM 2016), September 25-29, 2016, Halkidiki, Greece
Author: Nicholas G. Wright
Publisher: Trans Tech Publications Ltd
ISBN: 3038131164
Category : Technology & Engineering
Languages : en
Pages : 1100
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Book Description
Volume is indexed by Thomson Reuters CPCI-S (WoS). Silicon Carbide (SiC), Gallium Nitride (GaN) and Diamond are wide-bandgap semiconductors which also possess extraordinary chemical, electrical and optical properties that make them uniquely attractive for the fabrication of high-power and high-frequency electronic devices, as well as of light-emitters and sensors which have to survive harsh operating conditions.
Author: Hajime Okumura
Publisher: Trans Tech Publications Ltd
ISBN: 3038263915
Category : Technology & Engineering
Languages : en
Pages : 1246
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Book Description
The papers cover most of the current research efforts on the wide bandgap semiconductor silicon carbide (SiC) and related materials, and a wide range of topics from crystal growth to their power electronics applications. In these proceedings, the written version of 270 contributed papers and 13 invited papers are included. The major chapters of the proceedings collect papers in the area of bulk growth of SiC, epitaxial growth of SiC, physical properties and characterization, processing, devices and application. There are three shorter chapters on graphene, III-nitrides and related materials. Volume is indexed by Thomson Reuters CPCI-S (WoS). The 283 papers are grouped as follows: Chapter 1: SiC Bulk Growth; Chapter 2: SiC Epitaxial Growth; Chapter 3: Physical Properties and Characterization of SiC; Chapter 4: Processing of SiC; Chapter 5: Devices and Circuits; Chapter 6: Related Materials.
