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Author: Ravinder S. Dahiya
Publisher: Springer Science & Business Media
ISBN: 9400705794
Category : Technology & Engineering
Languages : en
Pages : 258
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Book Description
Future robots are expected to work closely and interact safely with real-world objects and humans alike. Sense of touch is important in this context, as it helps estimate properties such as shape, texture, hardness, material type and many more; provides action related information, such as slip detection; and helps carrying out actions such as rolling an object between fingers without dropping it. This book presents an in-depth description of the solutions available for gathering tactile data, obtaining aforementioned tactile information from the data and effectively using the same in various robotic tasks. The efforts during last four decades or so have yielded a wide spectrum of tactile sensing technologies and engineered solutions for both intrinsic and extrinsic touch sensors. Nowadays, new materials and structures are being explored for obtaining robotic skin with physical features like bendable, conformable, and stretchable. Such features are important for covering various body parts of robots or 3D surfaces. Nonetheless, there exist many more hardware, software and application related issues that must be considered to make tactile sensing an effective component of future robotic platforms. This book presents an in-depth analysis of various system related issues and presents the trade-offs one may face while developing an effective tactile sensing system. For this purpose, human touch sensing has also been explored. The design hints coming out of the investigations into human sense of touch can be useful in improving the effectiveness of tactile sensory modality in robotics and other machines. Better integration of tactile sensors on a robot’s body is prerequisite for the effective utilization of tactile data. The concept of semiconductor devices based sensors is an interesting one, as it allows compact and fast tactile sensing systems with capabilities such as human-like spatio-temporal resolution. This book presents a comprehensive description of semiconductor devices based tactile sensing. In particular, novel Piezo Oxide Semiconductor Field Effect Transistor (POSFET) based approach for high resolution tactile sensing has been discussed in detail. Finally, the extension of semiconductors devices based sensors concept to large and flexile areas has been discussed for obtaining robotic or electronic skin. With its multidisciplinary scope, this book is suitable for graduate students and researchers coming from diverse areas such robotics (bio-robots, humanoids, rehabilitation etc.), applied materials, humans touch sensing, electronics, microsystems, and instrumentation. To better explain the concepts the text is supported by large number of figures.
Author: Ravinder S. Dahiya
Publisher: Springer Science & Business Media
ISBN: 9400705794
Category : Technology & Engineering
Languages : en
Pages : 258
Get Book Here
Book Description
Future robots are expected to work closely and interact safely with real-world objects and humans alike. Sense of touch is important in this context, as it helps estimate properties such as shape, texture, hardness, material type and many more; provides action related information, such as slip detection; and helps carrying out actions such as rolling an object between fingers without dropping it. This book presents an in-depth description of the solutions available for gathering tactile data, obtaining aforementioned tactile information from the data and effectively using the same in various robotic tasks. The efforts during last four decades or so have yielded a wide spectrum of tactile sensing technologies and engineered solutions for both intrinsic and extrinsic touch sensors. Nowadays, new materials and structures are being explored for obtaining robotic skin with physical features like bendable, conformable, and stretchable. Such features are important for covering various body parts of robots or 3D surfaces. Nonetheless, there exist many more hardware, software and application related issues that must be considered to make tactile sensing an effective component of future robotic platforms. This book presents an in-depth analysis of various system related issues and presents the trade-offs one may face while developing an effective tactile sensing system. For this purpose, human touch sensing has also been explored. The design hints coming out of the investigations into human sense of touch can be useful in improving the effectiveness of tactile sensory modality in robotics and other machines. Better integration of tactile sensors on a robot’s body is prerequisite for the effective utilization of tactile data. The concept of semiconductor devices based sensors is an interesting one, as it allows compact and fast tactile sensing systems with capabilities such as human-like spatio-temporal resolution. This book presents a comprehensive description of semiconductor devices based tactile sensing. In particular, novel Piezo Oxide Semiconductor Field Effect Transistor (POSFET) based approach for high resolution tactile sensing has been discussed in detail. Finally, the extension of semiconductors devices based sensors concept to large and flexile areas has been discussed for obtaining robotic or electronic skin. With its multidisciplinary scope, this book is suitable for graduate students and researchers coming from diverse areas such robotics (bio-robots, humanoids, rehabilitation etc.), applied materials, humans touch sensing, electronics, microsystems, and instrumentation. To better explain the concepts the text is supported by large number of figures.
Author: Sandro Carrara
Publisher: Cambridge University Press
ISBN: 1316240010
Category : Technology & Engineering
Languages : en
Pages : 1157
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Book Description
This wide-ranging summary of bioelectronics provides the state of the art in electronics integrated and interfaced with biological systems in one single book. It is a perfect reference for those involved in developing future distributed diagnostic devices, from smart bio-phones that will monitor our health status to new electronic devices serving our bodies and embedded in our clothes or under our skin. All chapters are written by pioneers and authorities in the key branches of bioelectronics and provide examples of real-word applications and step-by-step design details. Through expert guidance, you will learn how to design complex circuits whilst cutting design time and cost and avoiding mistakes, misunderstandings, and pitfalls. An exhaustive set of recently developed devices is also covered, providing the implementation details and inspiration for innovating new solutions and devices. This all-inclusive reference is ideal for researchers in electronics, bio/nanotechnology, and applied physics, as well as circuit and system-level designers in industry.
Author: Phaedon Avouris
Publisher: Cambridge University Press
ISBN: 1316738132
Category : Technology & Engineering
Languages : en
Pages : 521
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Book Description
Learn about the most recent advances in 2D materials with this comprehensive and accessible text. Providing all the necessary materials science and physics background, leading experts discuss the fundamental properties of a wide range of 2D materials, and their potential applications in electronic, optoelectronic and photonic devices. Several important classes of materials are covered, from more established ones such as graphene, hexagonal boron nitride, and transition metal dichalcogenides, to new and emerging materials such as black phosphorus, silicene, and germanene. Readers will gain an in-depth understanding of the electronic structure and optical, thermal, mechanical, vibrational, spin and plasmonic properties of each material, as well as the different techniques that can be used for their synthesis. Presenting a unified perspective on 2D materials, this is an excellent resource for graduate students, researchers and practitioners working in nanotechnology, nanoelectronics, nanophotonics, condensed matter physics, and chemistry.
Author: Andrea Chen
Publisher: CRC Press
ISBN: 1439862079
Category : Technology & Engineering
Languages : en
Pages : 216
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Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Author: Aline Ferreira
Publisher: John Wiley & Sons
ISBN: 3527344314
Category : Science
Languages : en
Pages : 290
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Book Description
Hybrid organic-inorganic perovskites (HOIPs) have attracted substantial interest due to their chemical variability, structural diversity and favorable physical properties the past decade. This materials class encompasses other important families such as formates, azides, dicyanamides, cyanides and dicyanometallates. The book summarizes the chemical variability and structural diversity of all known hybrid organic-inorganic perovskites subclasses including halides, azides, formates, dicyanamides, cyanides and dicyanometallates. It also presents a comprehensive account of their intriguing physical properties, including photovoltaic, optoelectronic, dielectric, magnetic, ferroelectric, ferroelastic and multiferroic properties. Moreover, the current challenges and future opportunities in this exciting field are also been discussed. This timely book shows the readers a complete landscape of hybrid organic-inorganic pervoskites and associated multifuctionalities.
Author: John W. Balde
Publisher: Springer Science & Business Media
ISBN: 9780792376767
Category : Computers
Languages : en
Pages : 382
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Book Description
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Much of the work in this field has not been widely disseminated other than by papers presented at conferences and workshops. This book is organized to report on the developments in this technology, but with special additional material and emphasis. The intent is to do more than report on present state of the art. It is intended as an advocacy book, pointing out the reasons for 3-D assemblies, the reasons for Silicon-in-a-Package multichip modules, and the commercial availability of the techniques. The contributing authors, all leaders in this technical field, explore the needs, reveal the state of development and production, and point to changes in technology that can bring this technology into wider use for more complex applications. It is an advocacy book in this respect - advocacy for the use of a technology that is already mature, and advocacy for exploring ways to make it even more capable for the future. It will also do more than discuss the present; it will point out the deficiencies of the constructions, the needed availability of good flex material, the use of newer flex materials, such as LCP, and the implications from the use of the Integrated Mesh Power Systems to enhance the capability for future designs. Lastly it will discuss the serious problem of heat removal if multiple microprocessors are included.
Author: Fabian I. Ezema
Publisher: Springer Nature
ISBN: 3030684628
Category : Technology & Engineering
Languages : en
Pages : 926
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Book Description
This book guides beginners in the areas of thin film preparation, characterization, and device making, while providing insight into these areas for experts. As chemically deposited metal oxides are currently gaining attention in development of devices such as solar cells, supercapacitors, batteries, sensors, etc., the book illustrates how the chemical deposition route is emerging as a relatively inexpensive, simple, and convenient solution for large area deposition. The advancement in the nanostructured materials for the development of devices is fully discussed.
Author: Yogeenth Kumaresan
Publisher: Cambridge University Press
ISBN: 1108899587
Category : Technology & Engineering
Languages : en
Pages : 124
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Book Description
Stretchable electronics is one of the transformative pillars of future flexible electronics. As a result, the research on new passive and active materials, novel designs, and engineering approaches has attracted significant interest. Recent studies have highlighted the importance of new approaches that enable the integration of high-performance materials, including, organic and inorganic compounds, carbon-based and layered materials, and composites to serve as conductors, semiconductors or insulators, with the ability to accommodate electronics on stretchable substrates. This Element presents a discussion about the strategies that have been developed for obtaining stretchable systems, with a focus on various stretchable geometries to achieve strain invariant electrical response, and summarises the recent advances in terms of material research, various integration techniques of high-performance electronics. In addition, some of the applications, challenges and opportunities associated with the development of stretchable electronics are discussed.
Author: Andreas Willfahrt
Publisher: Linköping University Electronic Press
ISBN: 9176852741
Category :
Languages : sv
Pages : 115
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Book Description
The technical application of screen and stencil printing has been state of the art for decades. As part of the subtractive production process of printed circuit boards, for instance, screen and stencil printing play an important role. With the end of the 20th century, another field has opened up with organic electronics. Since then, more and more functional layers have been produced using printing methods. Printed electronics devices offer properties that give almost every freedom to the creativity of product development. Flexibility, low weight, use of non-toxic materials, simple disposal and an enormous number of units due to the production process are some of the prominent keywords associated with this field. Screen printing is a widely used process in printed electronics, as this process is very flexible with regard to the materials that can be used. In addition, a minimum resolution of approximately 30 µm is sufficiently high. The ink film thickness, which can be controlled over a wide range, is an extremely important advantage of the process. Depending on the viscosity, layer thicknesses of several hundred nanometres up to several hundred micrometres can be realised. The conversion and storage of energy became an increasingly important topic in recent years. Since regenerative energy sources, such as photovoltaics or wind energy, often supply energy intermittently, appropriate storage systems must be available. This applies to large installations for the power supply of society, but also in the context of autarkic sensors, such as those used in the Internet of Things or domestic/industrial automation. A combination of micro-energy converters and energy storage devices is an adequate concept for providing energy for such applications. In this thesis the above mentioned keywords are addressed and the feasibility of printed thermoelectric energy converters and supercapacitors as energy storage devices are investigated. The efficiency of thermoelectric generators (TEG) is low, but in industrial environments, for example, a large amount of unused low temperature heat energy can be found. If the production costs of TEGs are low, conversion of this unused heat energy can contribute to increasing system efficiency. Additionally, printing of supercapacitor energy storage devices increases the usability of the TEG. It is appropriate to use both components as complementary parts in an energy system. Den tekniska tillämpningen av skärm- och stencilutskrift har varit toppmoderna i årtionden. Som en del av den subtraktiva produktionsprocessen av tryckta kretskort spelar exempelvis skärm- och stencilutskrift en viktig roll. I slutet av 1900-talet har ett annat fält öppnat med organisk elektronik. Sedan dess har allt fler funktionella lager producerats med hjälp av tryckmetoder. Tryckta elektronikanordningar erbjuder egenskaper som ger nästan all frihet till kreativiteten i produktutvecklingen. Flexibilitet, låg vikt, användning av giftfria material, enkelt bortskaffande och ett enormt antal enheter på grund av produktionsprocessen är några av de framträdande nyckelord som hör till detta område. Skärmtryck är en allmänt använd process i tryckt elektronik, eftersom processen är mycket flexibel med avseende på material som kan användas. Dessutom är en minsta upplösning på cirka 30 µm tillräckligt bra. Bläckfilmens tjocklek, som kan styras över ett brett område, är en extremt viktig fördel med processen. Beroende på viskositeten kan skikttjockleken på flera hundra nanometer upp till flera hundra mikrometer realiseras. Energikonvertering och lagring har blivit ett allt viktigare ämne de senaste åren. Eftersom regenerativa energikällor, såsom fotovoltaik eller vindkraft, ofta levererar energi intermittent, måste lämpliga lagringssystem vara tillgängliga. Detta gäller stora installationer för samhällets strömförsörjning, men också inom ramen för autarkiska sensorer, som de som används i saker av saker eller inhemsk / industriell automation. En kombination av mikroenergiomvandlare och energilagringsenheter är ett lämpligt koncept för att tillhandahålla energi för sådana applikationer. I denna avhandling behandlas ovan nämnda nyckelord. Genomförbarhet av tryckta termoelektriska energiomvandlare och superkapacitorer som energilagringsenheter undersöks. Effektiviteten hos termoelektriska generatorer (TEG) är låg, men i industriella miljöer kan exempelvis en stor mängd oanvänd låg temperatur värmeenergi hittas. Om produktionskostnaderna för TEG är låga kan konvertering av denna oanvända värmeenergi bidra till ökad systemeffektivitet. Dessutom ökar utskrift av superkapacitorer användbarheten hos TEG. Det är lämpligt att använda båda komponenterna.
Author: Mehdi Afshari
Publisher: Woodhead Publishing
ISBN: 0081009119
Category : Technology & Engineering
Languages : en
Pages : 650
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Book Description
Electrospun Nanofibers covers advances in the electrospinning process including characterization, testing and modeling of electrospun nanofibers, and electrospinning for particular fiber types and applications. Electrospun Nanofibers offers systematic and comprehensive coverage for academic researchers, industry professionals, and postgraduate students working in the field of fiber science. Electrospinning is the most commercially successful process for the production of nanofibers and rising demand is driving research and development in this field. Rapid progress is being made both in terms of the electrospinning process and in the production of nanofibers with superior chemical and physical properties. Electrospinning is becoming more efficient and more specialized in order to produce particular fiber types such as bicomponent and composite fibers, patterned and 3D nanofibers, carbon nanofibers and nanotubes, and nanofibers derived from chitosan. - Provides systematic and comprehensive coverage of the manufacture, properties, and applications of nanofibers - Covers recent developments in nanofibers materials including electrospinning of bicomponent, chitosan, carbon, and conductive fibers - Brings together expertise from academia and industry to provide comprehensive, up-to-date information on nanofiber research and development - Offers systematic and comprehensive coverage for academic researchers, industry professionals, and postgraduate students working in the field of fiber science
