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Author: Naveed A. Sherwani
Publisher: John Wiley & Sons
ISBN: 9780780310896
Category : Education
Languages : en
Pages : 386
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Book Description
This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
Author: Naveed A. Sherwani
Publisher: John Wiley & Sons
ISBN: 9780780310896
Category : Education
Languages : en
Pages : 386
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Book Description
This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
Author: Christian Harder
Publisher: ESRI Press
ISBN: 9781589484870
Category : Computers
Languages : en
Pages : 172
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Book Description
This is a hands-on book about ArcGIS that you work with as much as read. By the end, using Learn ArcGIS lessons, you'll be able to say you made a story map, conducted geographic analysis, edited geographic data, worked in a 3D web scene, built a 3D model of Venice, and more.
Author: Vinod Pangracious
Publisher: Springer
ISBN: 3319191748
Category : Technology & Engineering
Languages : en
Pages : 239
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Book Description
This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770
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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: Charles J. Alpert
Publisher: CRC Press
ISBN: 1000654192
Category : Computers
Languages : en
Pages : 1044
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Book Description
The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in
Author: John H. Lau
Publisher: McGraw Hill Professional
ISBN: 0071785159
Category : Technology & Engineering
Languages : en
Pages : 513
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Book Description
A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging
Author: Alias Abdul-Rahman
Publisher: Springer Science & Business Media
ISBN: 3540741674
Category : Science
Languages : en
Pages : 291
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Book Description
This book covers fundamental aspects of spatial data modelling specifically on the aspect of three-dimensional (3D) modelling and structuring. Realisation of "true" 3D GIS spatial system needs a lot of effort, and the process is taking place in various research centres and universities in some countries. The development of spatial data modelling for 3D objects is the focus of this book.
Author: Hideharu Amano
Publisher: Springer
ISBN: 9811308241
Category : Computers
Languages : en
Pages : 234
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Book Description
This comprehensive textbook on the field programmable gate array (FPGA) covers its history, fundamental knowledge, architectures, device technologies, computer-aided design technologies, design tools, examples of application, and future trends. Programmable logic devices represented by FPGAs have been rapidly developed in recent years and have become key electronic devices used in most IT products. This book provides both complete introductions suitable for students and beginners, and high-level techniques useful for engineers and researchers in this field. Differently developed from usual integrated circuits, the FPGA has unique structures, design methodologies, and application techniques. Allowing programming by users, the device can dramatically reduce the rising cost of development in advanced semiconductor chips. The FPGA is now driving the most advanced semiconductor processes and is an all-in-one platform combining memory, CPUs, and various peripheral interfaces. This book introduces the FPGA from various aspects for readers of different levels. Novice learners can acquire a fundamental knowledge of the FPGA, including its history, from Chapter 1; the first half of Chapter 2; and Chapter 4. Professionals who are already familiar with the device will gain a deeper understanding of the structures and design methodologies from Chapters 3 and 5. Chapters 6–8 also provide advanced techniques and cutting-edge applications and trends useful for professionals. Although the first parts are mainly suitable for students, the advanced sections of the book will be valuable for professionals in acquiring an in-depth understanding of the FPGA to maximize the performance of the device.
Author: Philip Garrou
Publisher: John Wiley & Sons
ISBN: 352762306X
Category : Technology & Engineering
Languages : en
Pages : 798
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Book Description
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Author: Antonis Papanikolaou
Publisher: Springer Science & Business Media
ISBN: 1441909621
Category : Architecture
Languages : en
Pages : 251
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Book Description
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
