Author: Dim-Lee Kwong
Publisher: The Electrochemical Society
ISBN: 9781566773157
Category : Technology & Engineering
Languages : en
Pages : 458
Book Description
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
Rapid Thermal and Other Short-time Processing Technologies II
Author: Dim-Lee Kwong
Publisher: The Electrochemical Society
ISBN: 9781566773157
Category : Technology & Engineering
Languages : en
Pages : 458
Book Description
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
Publisher: The Electrochemical Society
ISBN: 9781566773157
Category : Technology & Engineering
Languages : en
Pages : 458
Book Description
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
Rapid Thermal and Other Short-time Processing Technologies III
Author: Paul J. Timans
Publisher: The Electrochemical Society
ISBN: 9781566773348
Category : Technology & Engineering
Languages : en
Pages : 500
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566773348
Category : Technology & Engineering
Languages : en
Pages : 500
Book Description
Rapid Thermal and Other Short-time Processing Technologies
Author: Fred Roozeboom
Publisher: The Electrochemical Society
ISBN: 9781566772747
Category : Technology & Engineering
Languages : en
Pages : 482
Book Description
The proceedings from this May 2000 symposium illustrate the range of applications in Rapid Thermal Processing (RTP). The refereed papers cover a variety of issues, such as ultra-shallow junctions; contacts for nanoscale CMOS; gate stacks; new applications of RTP, such as for the enhanced crystalization of amorphous silicon thin films; and advances on RTP systems and process monitoring, including optimizing and controlling gas flows in an RTCVD reactor. Most presentations are supported by charts and other graphical data. c. Book News Inc.
Publisher: The Electrochemical Society
ISBN: 9781566772747
Category : Technology & Engineering
Languages : en
Pages : 482
Book Description
The proceedings from this May 2000 symposium illustrate the range of applications in Rapid Thermal Processing (RTP). The refereed papers cover a variety of issues, such as ultra-shallow junctions; contacts for nanoscale CMOS; gate stacks; new applications of RTP, such as for the enhanced crystalization of amorphous silicon thin films; and advances on RTP systems and process monitoring, including optimizing and controlling gas flows in an RTCVD reactor. Most presentations are supported by charts and other graphical data. c. Book News Inc.
Advanced Short-time Thermal Processing for Si-based CMOS Devices 2
Author: Mehmet C. Öztürk
Publisher: The Electrochemical Society
ISBN: 9781566774062
Category : Technology & Engineering
Languages : en
Pages : 444
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566774062
Category : Technology & Engineering
Languages : en
Pages : 444
Book Description
Ion Beams in Materials Processing and Analysis
Author: Bernd Schmidt
Publisher: Springer Science & Business Media
ISBN: 3211993568
Category : Technology & Engineering
Languages : en
Pages : 425
Book Description
A comprehensive review of ion beam application in modern materials research is provided, including the basics of ion beam physics and technology. The physics of ion-solid interactions for ion implantation, ion beam synthesis, sputtering and nano-patterning is treated in detail. Its applications in materials research, development and analysis, developments of special techniques and interaction mechanisms of ion beams with solid state matter result in the optimization of new material properties, which are discussed thoroughly. Solid-state properties optimization for functional materials such as doped semiconductors and metal layers for nano-electronics, metal alloys, and nano-patterned surfaces is demonstrated. The ion beam is an important tool for both materials processing and analysis. Researchers engaged in solid-state physics and materials research, engineers and technologists in the field of modern functional materials will welcome this text.
Publisher: Springer Science & Business Media
ISBN: 3211993568
Category : Technology & Engineering
Languages : en
Pages : 425
Book Description
A comprehensive review of ion beam application in modern materials research is provided, including the basics of ion beam physics and technology. The physics of ion-solid interactions for ion implantation, ion beam synthesis, sputtering and nano-patterning is treated in detail. Its applications in materials research, development and analysis, developments of special techniques and interaction mechanisms of ion beams with solid state matter result in the optimization of new material properties, which are discussed thoroughly. Solid-state properties optimization for functional materials such as doped semiconductors and metal layers for nano-electronics, metal alloys, and nano-patterned surfaces is demonstrated. The ion beam is an important tool for both materials processing and analysis. Researchers engaged in solid-state physics and materials research, engineers and technologists in the field of modern functional materials will welcome this text.
Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
ULSI Process Integration III
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566773768
Category : Technology & Engineering
Languages : en
Pages : 620
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566773768
Category : Technology & Engineering
Languages : en
Pages : 620
Book Description
Rapid Thermal Processing for Future Semiconductor Devices
Author: H. Fukuda
Publisher: Elsevier
ISBN: 0080540260
Category : Science
Languages : en
Pages : 161
Book Description
This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.
Publisher: Elsevier
ISBN: 0080540260
Category : Science
Languages : en
Pages : 161
Book Description
This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.
ULSI Process Integration II
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 9781566773089
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566773089
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Rapid Thermal Processing and Beyond
Author: Wilfried Lerch
Publisher: Trans-Tech Publications
ISBN: 9780878493913
Category : Materials
Languages : en
Pages : 0
Book Description
Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.
Publisher: Trans-Tech Publications
ISBN: 9780878493913
Category : Materials
Languages : en
Pages : 0
Book Description
Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.