Lasers

Lasers PDF Author: Charles Blain
Publisher: Nova Publishers
ISBN: 9781590332252
Category : Technology & Engineering
Languages : en
Pages : 214

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Book Description
Developments in lasers continue to enable progress in many areas such as eye surgery, the recording industry and dozens of others. This book presents citations from the book literature for the last 25 years and groups them for ease of access which is also provided by subject, author and titles indexes.

Lasers

Lasers PDF Author: Charles Blain
Publisher: Nova Publishers
ISBN: 9781590332252
Category : Technology & Engineering
Languages : en
Pages : 214

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Book Description
Developments in lasers continue to enable progress in many areas such as eye surgery, the recording industry and dozens of others. This book presents citations from the book literature for the last 25 years and groups them for ease of access which is also provided by subject, author and titles indexes.

Proceedings of the Symposium on Reliability of Metals in Electronics

Proceedings of the Symposium on Reliability of Metals in Electronics PDF Author: Hazara S. Rathore
Publisher: The Electrochemical Society
ISBN: 9781566770972
Category : Technology & Engineering
Languages : en
Pages : 258

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Book Description


Energy Research Abstracts

Energy Research Abstracts PDF Author:
Publisher:
ISBN:
Category : Power resources
Languages : en
Pages : 1364

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Book Description


Proceedings of the ... International Symposium on Microelectronics

Proceedings of the ... International Symposium on Microelectronics PDF Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 992

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Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies

Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies PDF Author: Y. Pauleau
Publisher: Springer Science & Business Media
ISBN: 9781402005244
Category : Science
Languages : en
Pages : 392

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Book Description
Proceedings of the NATO Advanced Study Institute, held in Kaunas, Lithuania, from 3-14 September 2001

Proceedings of the 1987 International Symposium on Microelectronics, September 28-30, 1987, Minneapolis Auditorium and Convention Center, Minneapolis, Minnesota

Proceedings of the 1987 International Symposium on Microelectronics, September 28-30, 1987, Minneapolis Auditorium and Convention Center, Minneapolis, Minnesota PDF Author: International Society for Hybrid Microelectronics
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 746

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Lasers in Surface Engineering

Lasers in Surface Engineering PDF Author: Narendra B. Dahotre
Publisher: ASM International
ISBN: 9781615032235
Category : Technology & Engineering
Languages : en
Pages : 622

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Book Description
Presents various facets of laser surface treatment, emphasizing technologies that are expected to be important soon. The topics include fundamentals and types, surface texturing, heat treatment, metallic and intermetallic coating, the laser deposition of ceramic coatings, polymeric coatings, the cor

国立国会図書館所蔵科学技術関係欧文会議錄目錄

国立国会図書館所蔵科学技術関係欧文会議錄目錄 PDF Author: 国立国会図書館 (Japan)
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1528

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Book Description


Metallized Plastics 2

Metallized Plastics 2 PDF Author: K.L. Mittal
Publisher: Springer Science & Business Media
ISBN: 9780306441073
Category : Science
Languages : en
Pages : 496

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Book Description
This volume documents the proceedings of the Second Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the aegis of the Dielectric Science and Technology Division of the Electrochemical Society in Montreal, Canada, May 7-10, 1990. The first symposium on this topic was held in Chicago, October 10-12, 1988 and the proceedings of l which have been chronicled in a hard-bound volume l As pointed out in the Preface to the proceedings of the first symposium the metallized plastics find scores of applications ranging from very mundane to very sophisticated. Even a cursory look at the literature will convince that this field has sprouted; and there is every reason to believe that with all the research and development activities taking place, new and exciting applications of metallized plastics will emerge. The program for the second symposium was very comprehensive as it included 46 papers covering many aspects of metallized plastics. This symposium was a testimonial to the brisk research activity and keen interest in the topic of metallized plastics. The success of this symposium reinforced our earlier belief that there was a definite need to hold symposia on this topic on a regular basis. Concomitantly, the third symposium in this vein was held in Phoenix, Arizona, October 13-18, 1991 and the fourth is planned for May 16-21, 1993 in Honolulu, Hawaii. As regards the present volume, it contains a total of 35 papers covering a variety of topics ranging from very fundamental to very applied.

Microelectronics Packaging Handbook

Microelectronics Packaging Handbook PDF Author: R.R. Tummala
Publisher: Springer Science & Business Media
ISBN: 1461560373
Category : Computers
Languages : en
Pages : 1060

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Book Description
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.