Proceedings of the Fifth Symposium on Automated Integrated Circuits Manufacturing PDF Download
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Author: Vaughn E. Akins
Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 302
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Book Description
Author: Vaughn E. Akins
Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 302
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 326
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Book Description
Author: B-t Chu
Publisher: World Scientific
ISBN: 9814520446
Category : Phase space (Statistical physics)
Languages : en
Pages : 273
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Book Description
This volume demonstrates that the key to the modeling, diagnosis and control of the next generation manufacturing processes is to integrate knowledge-based systems with traditional techniques. An up-to-date study is given here of this relatively recent development.The book is for those working primarily with traditional techniques and those working in the knowledge-based systems field. Both sets of readers will find it to be a source of many specific ideas about the integration of knowledge-based systems with traditional techniques, and carrying a wealth of useful references.
Author: Franz Fasching
Publisher: Springer Science & Business Media
ISBN: 370919315X
Category : Computers
Languages : en
Pages : 313
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Book Description
As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a "virtual fab" S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with "robust", "proven" tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
Author: Vaughn E. Akins
Publisher: The Electrochemical Society
ISBN: 9781566770040
Category : Technology & Engineering
Languages : en
Pages : 308
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Book Description
Author: Ranga Vemuri
Publisher: Springer Nature
ISBN: 3030734455
Category : Technology & Engineering
Languages : en
Pages : 193
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Book Description
Globalization of the integrated circuit (IC) supply chains led to many potential vulnerabilities. Several attack scenarios can exploit these vulnerabilities to reverse engineer IC designs or to insert malicious trojan circuits. Split manufacturing refers to the process of splitting an IC design into multiple parts and fabricating these parts at two or more foundries such that the design is secure even when some or all of those foundries are potentially untrusted. Realizing its security benefits, researchers have proposed split fabrication methods for 2D, 2.5D, and the emerging 3D ICs. Both attack methods against split designs and defense techniques to thwart those attacks while minimizing overheads have steadily progressed over the past decade. This book presents a comprehensive review of the state-of-the-art and emerging directions in design splitting for secure split fabrication, design recognition and recovery attacks against split designs, and design techniques to defend against those attacks. Readers will learn methodologies for secure and trusted IC design and fabrication using split design methods to protect against supply chain vulnerabilities.
Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1351831003
Category : Technology & Engineering
Languages : en
Pages : 893
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Book Description
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Author: Andrew Kusiak
Publisher: John Wiley & Sons
ISBN: 9780471554929
Category : Business & Economics
Languages : en
Pages : 614
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Book Description
Presents a top-down approach to the design, development, testing and recyclability of products, components and systems across a wide range of industries. Starting with the desired result and working back through the details, it shows how to produce goods, taking into account the challenges of actual manufacture, what the reliability requirements should be, quality control, associated costs, customer needs and more. Additional features include case studies and team negotiating. Also well-illustrated with figures, photographs, charts and tables and includes an extensive bibliography.
Author: Hari Vasudevan
Publisher: Springer
ISBN: 9811324905
Category : Technology & Engineering
Languages : en
Pages : 697
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Book Description
This book presents the outcomes of the International Conference on Intelligent Manufacturing and Automation (ICIMA 2018) organized by the Departments of Mechanical Engineering and Production Engineering at Dwarkadas J. Sanghvi College of Engineering, Mumbai, and the Indian Society of Manufacturing Engineers. It includes original research and the latest advances in the field, focusing on automation, mechatronics and robotics; CAD/CAM/CAE/CIM/FMS in manufacturing; product design and development; DFM/DFA/FMEA; MEMS and Nanotechnology; rapid prototyping; computational techniques; industrial engineering; manufacturing process management; modelling and optimization techniques; CRM, MRP and ERP; green, lean, agile and sustainable manufacturing; logistics and supply chain management; quality assurance and environment protection; advanced material processing and characterization; and composite and smart materials.
Author: Electrochemical Society
Publisher:
ISBN:
Category : Electrochemistry
Languages : en
Pages : 1210
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Book Description
