Author:
Publisher:
ISBN:
Category : Nuclear energy
Languages : en
Pages : 680
Book Description
Nuclear Science Abstracts
Author:
Publisher:
ISBN:
Category : Nuclear energy
Languages : en
Pages : 680
Book Description
Publisher:
ISBN:
Category : Nuclear energy
Languages : en
Pages : 680
Book Description
Scientific and Technical Aerospace Reports
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 702
Book Description
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 702
Book Description
Handbook of 3D Integration, Volume 1
Author: Philip Garrou
Publisher: John Wiley & Sons
ISBN: 352762306X
Category : Technology & Engineering
Languages : en
Pages : 798
Book Description
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Publisher: John Wiley & Sons
ISBN: 352762306X
Category : Technology & Engineering
Languages : en
Pages : 798
Book Description
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Compound Semiconductors 2002
Author: Marc Ilegems
Publisher: CRC Press
ISBN: 9780750309424
Category : Science
Languages : en
Pages : 502
Book Description
A major showcase for the compound semiconductor community, Compound Semiconductors 2002 presents an overview of recent developments in compound semiconductor physics and its technological applications to devices. The topics discussed reflect the significant progress achieved in understanding and mastering compound semiconductor materials and electronic and optoelectronic devices. The book covers heteroepitaxial growth, quantum confined emitters and detectors, quantum wires and dots, ultrafast transistors, and various compound materials.
Publisher: CRC Press
ISBN: 9780750309424
Category : Science
Languages : en
Pages : 502
Book Description
A major showcase for the compound semiconductor community, Compound Semiconductors 2002 presents an overview of recent developments in compound semiconductor physics and its technological applications to devices. The topics discussed reflect the significant progress achieved in understanding and mastering compound semiconductor materials and electronic and optoelectronic devices. The book covers heteroepitaxial growth, quantum confined emitters and detectors, quantum wires and dots, ultrafast transistors, and various compound materials.
American Book Publishing Record
Author:
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 746
Book Description
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 746
Book Description
Technical Abstract Bulletin
Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 752
Book Description
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 752
Book Description
Handbook of Nanostructured Materials and Nanotechnology, Five-Volume Set
Author: Hari Singh Nalwa
Publisher: Academic Press
ISBN: 0080533647
Category : Science
Languages : en
Pages : 3593
Book Description
Nanostructured materials is one of the hottest and fastest growing areas in today's materials science field, along with the related field of solid state physics. Nanostructured materials and their based technologies have opened up exciting new possibilites for future applications in a number of areas including aerospace, automotive, x-ray technology, batteries, sensors, color imaging, printing, computer chips, medical implants, pharmacy, and cosmetics. The ability to change properties on the atomic level promises a revolution in many realms of science and technology. Thus, this book details the high level of activity and significant findings are available for those involved in research and development in the field. It also covers industrial findings and corporate support. This five-volume set summarizes fundamentals of nano-science in a comprehensive way. The contributors enlisted by the editor are at elite institutions worldwide. Key Features * Provides comprehensive coverage of the dominant technology of the 21st century * Written by 127 authors from 16 countries, making this truly international * First and only reference to cover all aspects of nanostructured materials and nanotechnology
Publisher: Academic Press
ISBN: 0080533647
Category : Science
Languages : en
Pages : 3593
Book Description
Nanostructured materials is one of the hottest and fastest growing areas in today's materials science field, along with the related field of solid state physics. Nanostructured materials and their based technologies have opened up exciting new possibilites for future applications in a number of areas including aerospace, automotive, x-ray technology, batteries, sensors, color imaging, printing, computer chips, medical implants, pharmacy, and cosmetics. The ability to change properties on the atomic level promises a revolution in many realms of science and technology. Thus, this book details the high level of activity and significant findings are available for those involved in research and development in the field. It also covers industrial findings and corporate support. This five-volume set summarizes fundamentals of nano-science in a comprehensive way. The contributors enlisted by the editor are at elite institutions worldwide. Key Features * Provides comprehensive coverage of the dominant technology of the 21st century * Written by 127 authors from 16 countries, making this truly international * First and only reference to cover all aspects of nanostructured materials and nanotechnology
Symposium on Radiation Effects on Materials - Volume 1
Author:
Publisher: ASTM International
ISBN:
Category :
Languages : en
Pages : 199
Book Description
Publisher: ASTM International
ISBN:
Category :
Languages : en
Pages : 199
Book Description
National Semiconductor Metrology Program
Author: National Semiconductor Metrology Program (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 82
Book Description
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 82
Book Description
National Semiconductor Metrology Program
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 160
Book Description
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 160
Book Description