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Author: Kit L. Yam
Publisher: John Wiley & Sons
ISBN: 0470541385
Category : Technology & Engineering
Languages : en
Pages : 1368
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Book Description
The complete and authoritative guide to modern packaging technologies —updated and expanded From A to Z, The Wiley Encyclopedia of Packaging Technology, Third Edition covers all aspects of packaging technologies essential to the food and pharmaceutical industries, among others. This edition has been thoroughly updated and expanded to include important innovations and changes in materials, processes, and technologies that have occurred over the past decade. It is an invaluable resource for packaging technologists, scientists and engineers, students and educators, packaging material suppliers, packaging converters, packaging machinery manufacturers, processors, retailers, and regulatory agencies. In addition to updating and improving articles from the previous edition, new articles are also added to cover the recent advances and developments in packaging. Content new to this edition includes: Advanced packaging materials such as antimicrobial materials, biobased materials, nanocomposite materials, ceramic-coated films, and perforated films Advanced packaging technologies such as active and intelligent packaging, radio frequency identification (RFID), controlled release packaging, smart blending, nanotechnology, biosensor technology, and package integrity inspection Various aspects important to packaging such as sustainable packaging, migration, lipid oxidation, light protection, and intellectual property Contributions from experts in all-important aspects of packaging Extensive cross-referencing and easy-to-access information on all subjects Large, double-column format for easy reference
Author: Kit L. Yam
Publisher: John Wiley & Sons
ISBN: 0470541385
Category : Technology & Engineering
Languages : en
Pages : 1368
Get Book Here
Book Description
The complete and authoritative guide to modern packaging technologies —updated and expanded From A to Z, The Wiley Encyclopedia of Packaging Technology, Third Edition covers all aspects of packaging technologies essential to the food and pharmaceutical industries, among others. This edition has been thoroughly updated and expanded to include important innovations and changes in materials, processes, and technologies that have occurred over the past decade. It is an invaluable resource for packaging technologists, scientists and engineers, students and educators, packaging material suppliers, packaging converters, packaging machinery manufacturers, processors, retailers, and regulatory agencies. In addition to updating and improving articles from the previous edition, new articles are also added to cover the recent advances and developments in packaging. Content new to this edition includes: Advanced packaging materials such as antimicrobial materials, biobased materials, nanocomposite materials, ceramic-coated films, and perforated films Advanced packaging technologies such as active and intelligent packaging, radio frequency identification (RFID), controlled release packaging, smart blending, nanotechnology, biosensor technology, and package integrity inspection Various aspects important to packaging such as sustainable packaging, migration, lipid oxidation, light protection, and intellectual property Contributions from experts in all-important aspects of packaging Extensive cross-referencing and easy-to-access information on all subjects Large, double-column format for easy reference
Author:
Publisher:
ISBN:
Category : Cartons
Languages : en
Pages : 628
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Book Description
Author:
Publisher: World Scientific
ISBN: 9811209642
Category : Technology & Engineering
Languages : en
Pages : 1079
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Book Description
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Author: Avram Bar-Cohen
Publisher: World Scientific
ISBN: 9814313785
Category : Technology & Engineering
Languages : en
Pages : 1582
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Book Description
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Author: Kata Galic
Publisher: John Wiley & Sons
ISBN: 1119825075
Category : Technology & Engineering
Languages : en
Pages : 400
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Book Description
This book provides valuable information on a range of food packaging topics. It serves as a source for students, professionals and packaging engineers who need to know more about the characteristics, applications and consequences of different packaging materials in food-packaging interactions. This book is divided into 13 chapters and focuses on the agro-food, cosmetics and pharmaceutical sectors. The first four chapters cover traditional packaging materials: wood, paper and cardboard, glass and metal. The next two deal, respectively, with plastics and laminates. Biobased materials are then covered, followed by a presentation of active and smart packaging. Some chapters are also dedicated to providing information on caps and closures as well as auxiliary materials. Different food packaging methods are presented, followed by an investigation into the design and labelling of packaging. The book ends with a chapter presenting information on how the choice of packaging material is dependent on the characteristics of the food products to be packaged.
Author: Otto G. Piringer
Publisher: John Wiley & Sons
ISBN: 3527613293
Category : Science
Languages : de
Pages : 606
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Book Description
Plastics have developed into the most important class of packaging materials. Their relative impermeability for substances from the surroundings has great influence on the shelf life and the quality of the packed goods. At the same time the interaction between the contents and the various components of the packaging plays a decisive role. This particular book is indispensable in the search for the optimal plastic packaging. It facilitates the estimation of the influence on the goods which come from the surroundings and from the packaging. The authors do not restrict themselves only to the description of the phenomena of diffusion or transport in theory, but they show what they mean for practical applications. Food represents the central theme as main area of application for plastic packaging. It can be considered to be the "model substance" and the findings are to be applied to many other products and systems. The main rules and regulations for food packaging of the European Community and the United States are presented in this book. Furthermore the authors emphasize the testing methods for proving the mass transport and the sensory check of the quality of the products.
Author: Aaron L. Brody
Publisher: CRC Press
ISBN: 9781420031812
Category : Technology & Engineering
Languages : en
Pages : 244
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Book Description
Based on thousands of citations from peer-reviewed, trade, commercial, and patent literature and interviews with those who have worked in the laboratory, in pilot plants, and in production, Active Packaging for Food Applications provides a state-of-the-art guide to understanding and utilizing these technologies. The book highlights technologies that are currently in commercial use or have the potential to become commercial, including oxygen scavenging, moisture control, ethylene removal from fresh food, antimicrobials, odor removal, and aroma emission. In addition, it explores the pros and cons involved in using antimicrobial agents in package materials. Active Packaging for Food Applications provides you with a detailed guide and reference to the technologies - and their applications - involved in enhancing food and beverage preservation.
Author: Avram Bar-cohen
Publisher: World Scientific
ISBN: 9813239689
Category : Technology & Engineering
Languages : en
Pages : 904
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Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 2, please visit Set 1: Thermal Packaging Techniques and Set 2: Thermal Packaging Tools /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.Set 3: Thermal Packaging ApplicationsThe third set in the Encyclopedia includes two volumes in the planned focus on Thermal Packaging Applications and a single volume on the use of Phase Change Materials (PCM), a most important Thermal Management Technique, not previously addressed in the Encyclopedia. Set 3 opens with Heat Transfer in Avionic Equipment, authored by Dr Boris Abramzon, offering a comprehensive, in-depth treatment of compact heat exchangers and cold plates for avionics cooling, as well as discussion on recent developments in these heat transfer units that are widely used in the thermal control of military and civilian airborne electronics. Along with a detailed presentation of the relevant thermofluid physics and governing equations, and the supporting mathematical design and optimization techniques, the book offers a practical guide for thermal engineers designing avionics cooling equipment, based on the author's 20+ years of experience as a thermal analyst and a practical design engineer for Avionics and related systems.The Set continues with Thermal Management of RF Systems, which addresses sequentially the history, present practice, and future thermal management strategies for electronically-steered RF systems, in the context of the RF operational requirements, as well as device-, module-, and system-level electronic, thermal, and mechanical considerations. This unique text was written by 3 authors, Dr John D Albrecht, Mr David H Altman, Dr Joseph J Maurer, with extensive US Department of Defense and aerospace industry experience in the design, development, and fielding of RF systems. Their combined efforts have resulted in a text, which is well-grounded in the relevant past, present, and future RF systems and technologies. Thus, this volume will provide the designers of advanced radars and other electronic RF systems with the tools and the knowledge to address the thermal management challenges of today's technologies, as well as of advanced technologies, such as wide bandgap semiconductors, heterogeneously integrated devices, and 3D chipsets and stacks.The third volume in Set 3, Phase Change Materials for Thermal Management of Electronic Components, co-authored by Prof Gennady Ziskind and Dr Yoram Kozak, provides a detailed description of the numerical methods used in PCM analysis and a detailed explanation of the processes that accompany and characterize solid-liquid phase-change in popular basic and advanced geometries. These provide a foundation for an in-depth exploration of specific electronics thermal management applications of Phase Change Materials. This volume is anchored in the unique PCM knowledge and experience of the senior author and placed in the context of the extensive solid-liquid phase-change literature in such diverse fields as material science, mathematical modeling, experimental and numerical methods, and thermofluid science and engineering.Related Link(s)
Author: Joseph Kerry
Publisher: John Wiley & Sons
ISBN: 9780470753682
Category : Technology & Engineering
Languages : en
Pages : 356
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Book Description
Smart Packaging Technologies for Fast Moving Consumer Goods approaches the subject of smart packaging from an innovative, thematic perspective: Part 1 looks at smart packaging technologies for food quality and safety Part 2 addresses smart packaging issues for the supply chain Part 3 focuses on smart packaging for brand protection and enhancement Part 4 centres on smart packaging for user convenience. Each chapter starts with a definition of the technology, and proceeds with an analysis of its workings and components before concluding with snapshots of potential applications of the technology. The Editors, brought together from academia and industry, provide readers with a cohesive account of the smart packaging phenomenon. Chapter authors are a mixture of industry professionals and academic researchers from the UK, USA, EU and Australasia.
Author: Cornelia Vasile
Publisher: MDPI
ISBN: 3038977667
Category : Technology & Engineering
Languages : en
Pages : 216
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Book Description
Because of the increasing pressure on both food safety and packaging/food waste, the topic is important both for academics, applied research, industry and also for environment protection. Different materials, such as glass, metals, paper and paperboards, and non-degradable and degradable polymers, with versatile properties, are attractive for potential uses in food packaging. Food packaging is the largest area of application within the food sector. Only the nanotechnology-enabled products in the food sector account for ~50% of the market value, with and the annual growth rate is 11.65%. Technological developments are also of great interest. In the food sector, nanotechnology is involved in packaging materials with extremely high gas barriers, antimicrobial properties, and also in nanoencapsulants for the delivery of nutrients, flavors, or aromas, antimicrobial, and antioxidant compounds. Applications of materials, including nanomaterials in packaging and food safety, are in forms of: edible films, polymer nanocomposites, as high barrier packaging materials, nanocoatings, surface biocides, silver nanoparticles as potent antimicrobial agents, nutrition and neutraceuticals, active/bioactive packaging, intelligent packaging, nanosensors and nanomaterial-based assays for the detection of food relevant analytes (gasses, small organic molecules and food-borne pathogens) and bioplastics.
