Multilayered Low Temperature Cofired Ceramics (LTCC) Technology PDF Download
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Author: Yoshihiko Imanaka
Publisher: Springer Science & Business Media
ISBN: 0387233148
Category : Technology & Engineering
Languages : en
Pages : 252
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Book Description
The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Author: Yoshihiko Imanaka
Publisher: Springer Science & Business Media
ISBN: 0387233148
Category : Technology & Engineering
Languages : en
Pages : 252
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Book Description
The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556635
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: Mailadil T. Sebastian
Publisher: John Wiley & Sons
ISBN: 1119208556
Category : Technology & Engineering
Languages : de
Pages : 1000
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Book Description
The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.
Author: Narottam P. Bansal
Publisher: John Wiley & Sons
ISBN: 0470553448
Category : Technology & Engineering
Languages : en
Pages : 598
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Book Description
Examines the latest processing and fabrication methods There is increasing interest in the application of advanced ceramic materials in diverse areas such as transportation, energy, environmental protection and remediation, communications, health, and aerospace. This book guides readers through a broad selection of key processing techniques for ceramics and their composites, enabling them to manufacture ceramic products and components with the properties needed for various industrial applications. With chapters contributed by internationally recognized experts in the field of ceramics, the book includes traditional fabrication routes as well as new and emerging approaches in order to meet the increasing demand for more reliable ceramic materials. Ceramics and Composites Processing Methods is divided into three sections: * Densification, covering the fundamentals and practice of sintering, pulsed electric current sintering, and viscous phase silicate processing * Chemical Methods, examining colloidal methods, sol-gel, gel casting, polymer processing, chemical vapor deposition, chemical vapor infiltration, reactive melt infiltration, and combustion synthesis * Physical Methods, including directional solidification, solid free-form fabrication, microwave processing, electrophoretic deposition, and plasma spraying Each chapter focuses on a particular processing method or approach. Collectively, these chapters offer readers comprehensive, state-of-the-science information on the many approaches, techniques, and methods for the processing and fabrication of advanced ceramics and ceramic composites. With its coverage of the latest processing methods, Ceramics and Composites Processing Methods is recommended for researchers and students in ceramics, materials science, structural materials, biomedical engineering, and nanotechnology.
Author: I M Low
Publisher: Woodhead Publishing
ISBN: 0081021674
Category : Technology & Engineering
Languages : en
Pages : 844
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Book Description
Advances in Ceramic Matrix Composites, Second Edition, delivers an innovative approach to ceramic matrix composites, focusing on the latest advances and materials developments. As advanced ceramics and composite materials are increasingly utilized as components in batteries, fuel cells, sensors, high-temperature electronics, membranes and high-end biomedical devices, and in seals, valves, implants, and high-temperature and wear components, this book explores the substantial progress in new applications. Users will gain knowledge of the latest advances in CMCs, with an update on the role of ceramics in the fabrication of Solid Oxide Fuel Cells for energy generation, and on natural fiber-reinforced eco-friendly geopolymer and cement composites. The specialized information contained in this book will be highly valuable to researchers and graduate students in ceramic science, engineering and ceramic composites technology, and engineers and scientists in the aerospace, energy, building and construction, biomedical and automotive industries. - Provides detailed coverage of parts and processing, properties and applications - Includes new developments in the field, such as natural fiber-reinforced composites and the use of CMCs in Solid Oxide Fuel Cells (SOFCs) - Presents state-of-the-art research, enabling the reader to understand the latest applications for CMCs
Author: Bhutani, Akanksha
Publisher: KIT Scientific Publishing
ISBN: 3731509458
Category : Technology & Engineering
Languages : en
Pages : 254
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Book Description
Author: Vesna Crnojević-Bengin
Publisher: Cambridge University Press
ISBN: 1107081971
Category : Technology & Engineering
Languages : en
Pages : 331
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Book Description
The first of its kind, this comprehensive work details the theory and practical design of new multi-band filters.
Author: Arunachalam Lakshmanan
Publisher: BoD – Books on Demand
ISBN: 9535100173
Category : Technology & Engineering
Languages : en
Pages : 628
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Book Description
The chapters covered in this book include emerging new techniques on sintering. Major experts in this field contributed to this book and presented their research. Topics covered in this publication include Spark plasma sintering, Magnetic Pulsed compaction, Low Temperature Co-fired Ceramic technology for the preparation of 3-dimesinal circuits, Microwave sintering of thermistor ceramics, Synthesis of Bio-compatible ceramics, Sintering of Rare Earth Doped Bismuth Titanate Ceramics prepared by Soft Combustion, nanostructured ceramics, alternative solid-state reaction routes yielding densified bulk ceramics and nanopowders, Sintering of intermetallic superconductors such as MgB2, impurity doping in luminescence phosphors synthesized using soft techniques, etc. Other advanced sintering techniques such as radiation thermal sintering for the manufacture of thin film solid oxide fuel cells are also described.
Author: Ralf Riedel
Publisher: John Wiley & Sons
ISBN: 3527631968
Category : Technology & Engineering
Languages : en
Pages : 554
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Book Description
Although ceramics have been known to mankind literally for millennia, research has never ceased. Apart from the classic uses as a bulk material in pottery, construction, and decoration, the latter half of the twentieth century saw an explosive growth of application fields, such as electrical and thermal insulators, wear-resistant bearings, surface coatings, lightweight armour, or aerospace materials. In addition to plain, hard solids, modern ceramics come in many new guises such as fabrics, ultrathin films, microstructures and hybrid composites. Built on the solid foundations laid down by the 20-volume series Materials Science and Technology, Ceramics Science and Technology picks out this exciting material class and illuminates it from all sides. Materials scientists, engineers, chemists, biochemists, physicists and medical researchers alike will find this work a treasure trove for a wide range of ceramics knowledge from theory and fundamentals to practical approaches and problem solutions.
Author: Fred D. Barlow, III
Publisher: CRC Press
ISBN: 9780849335570
Category : Technology & Engineering
Languages : en
Pages : 472
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Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
