Modeling of Pattern Dependencies in the Fabrication of Multilevel Copper Metallization PDF Download
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Author: Hong Cai (Ph. D.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 303
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Book Description
(Cont.) The CMP model integrates contact wear and density-step-height approaches, so that a consistent and coherent chip-scale model framework can be used for copper bulk polishing, copper over-polishing, and barrier layer polishing stages. A variant of this CMP model is developed which explicitly considers the pad topography properties. Finally, ECD and CMP parts are combined into an integrated model applicable to single level and multilevel metallization cases. The integrated multilevel copper metallization model is applied to the co-optimization of the plating and CMP processes. An alternative in-pattern (rather than between-pattern) dummy fill strategy is proposed. The integrated ECD/CMP model is applied to the optimization of the in-pattern fill, to achieve improved ECD uniformity and final post-CMP topography.
Author: Hong Cai (Ph. D.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 303
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Book Description
(Cont.) The CMP model integrates contact wear and density-step-height approaches, so that a consistent and coherent chip-scale model framework can be used for copper bulk polishing, copper over-polishing, and barrier layer polishing stages. A variant of this CMP model is developed which explicitly considers the pad topography properties. Finally, ECD and CMP parts are combined into an integrated model applicable to single level and multilevel metallization cases. The integrated multilevel copper metallization model is applied to the co-optimization of the plating and CMP processes. An alternative in-pattern (rather than between-pattern) dummy fill strategy is proposed. The integrated ECD/CMP model is applied to the optimization of the in-pattern fill, to achieve improved ECD uniformity and final post-CMP topography.
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 652
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Book Description
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 318
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).
Author: Jens Lienig
Publisher: Springer
ISBN: 3319735586
Category : Technology & Engineering
Languages : en
Pages : 171
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Book Description
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Author: Mohindar Seehra
Publisher: BoD – Books on Demand
ISBN: 1789232929
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
The use of copper, silver, gold and platinum in jewelry as a measure of wealth is well known. This book contains 19 chapters written by international authors on other uses and applications of noble and precious metals (copper, silver, gold, platinum, palladium, iridium, osmium, rhodium, ruthenium, and rhenium). The topics covered include surface-enhanced Raman scattering, quantum dots, synthesis and properties of nanostructures, and its applications in the diverse fields such as high-tech engineering, nanotechnology, catalysis, and biomedical applications. The basis for these applications is their high-free electron concentrations combined with high-temperature stability and corrosion resistance and methods developed for synthesizing nanostructures. Recent developments in all these areas with up-to-date references are emphasized.
Author: P.K. Swamee
Publisher: Springer
ISBN: 8132223225
Category : Science
Languages : en
Pages : 188
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Book Description
The book presents firsthand material from the authors on design of hydraulic canals. The book discusses elements of design based on principles of hydraulic flow through canals. It covers optimization of design based on usage requirements and economic constraints. The book includes explicit design equations and design procedures along with design examples for varied cases. With its comprehensive coverage of the principles of hydraulic canal design, this book will prove useful to students, researchers and practicing engineers. End-of-chapter pedagogical elements make it ideal for use in graduate courses on hydraulic structures offered by most civil engineering departments across the world.
Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 9783540431817
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Author: Hubert Kaeslin
Publisher: Cambridge University Press
ISBN: 0521882672
Category : Technology & Engineering
Languages : en
Pages : 878
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Book Description
This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more.
Author: Tapan Gupta
Publisher: Springer Science & Business Media
ISBN: 1441900764
Category : Technology & Engineering
Languages : en
Pages : 433
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Book Description
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Author: Bruce W. Smith
Publisher: CRC Press
ISBN: 1351643444
Category : Technology & Engineering
Languages : en
Pages : 770
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Book Description
The completely revised Third Edition to the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from fundamental principles to advanced topics of nanoscale lithography. The book is divided into chapters covering all important aspects related to the imaging, materials, and processes that have been necessary to drive semiconductor lithography toward nanometer-scale generations. Renowned experts from the world’s leading academic and industrial organizations have provided in-depth coverage of the technologies involved in optical, deep-ultraviolet (DUV), immersion, multiple patterning, extreme ultraviolet (EUV), maskless, nanoimprint, and directed self-assembly lithography, together with comprehensive descriptions of the advanced materials and processes involved. New in the Third Edition In addition to the full revision of existing chapters, this new Third Edition features coverage of the technologies that have emerged over the past several years, including multiple patterning lithography, design for manufacturing, design process technology co-optimization, maskless lithography, and directed self-assembly. New advances in lithography modeling are covered as well as fully updated information detailing the new technologies, systems, materials, and processes for optical UV, DUV, immersion, and EUV lithography. The Third Edition of Microlithography: Science and Technology authoritatively covers the science and engineering involved in the latest generations of microlithography and looks ahead to the future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current technology, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to better understand the complex world of microlithography science and technology.
