Micro-optics, VCSELs, and Photonic Interconnects PDF Download
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Author:
Publisher:
ISBN:
Category : Integrated optics
Languages : en
Pages : 328
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated optics
Languages : en
Pages : 328
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Book Description
Author: Rainer Michalzik
Publisher: Springer
ISBN: 3642249868
Category : Science
Languages : en
Pages : 562
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Book Description
The huge progress which has been achieved in the field is covered here, in the first comprehensive monograph on vertical-cavity surface-emitting lasers (VCSELs) since eight years. Apart from chapters reviewing the research field and the laser fundamentals, there are comprehensive updates on red and blue emitting VCSELs, telecommunication VCSELs, optical transceivers, and parallel-optical links for computer interconnects. Entirely new contributions are made to the fields of vectorial three-dimensional optical modeling, single-mode VCSELs, polarization control, polarization dynamics, very-high-speed design, high-power emission, use of high-contrast gratings, GaInNAsSb long-wavelength VCSELs, optical video links, VCSELs for optical mice and sensing, as well as VCSEL-based laser printing. The book appeals to researchers, optical engineers and graduate students.
Author: Alex Mutig
Publisher: Springer Science & Business Media
ISBN: 3642165702
Category : Science
Languages : en
Pages : 179
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Book Description
The transmission speed of data communication systems is forecast to increase exponentially over the next decade. Development of both Si-based high-speed drivers as well as III-V-semiconductor-based high-speed vertical cavity surface emitting lasers (VCSELs) are prerequisites for future ultrahigh data-rate systems. This thesis presents: - a survey of the present state of the art of VCSELs - a systematic investigation of the various effects limiting present VCSELs - a catalogue of solutions to overcome present limits - detailed progress in modelling, fabricating and testing the currently most advanced VCSELs at the two commercially most important wavelengths.
Author:
Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 286
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Book Description
Author: Ivan Kaminow
Publisher: Academic Press
ISBN: 0123972353
Category : Technology & Engineering
Languages : en
Pages : 795
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Book Description
Optical Fiber Telecommunications VI (A&B) is the sixth in a series that has chronicled the progress in the R&D of lightwave communications since the early 1970s. Written by active authorities from academia and industry, this edition brings a fresh look to many essential topics, including devices, subsystems, systems and networks. A central theme is the enabling of high-bandwidth communications in a cost-effective manner for the development of customer applications. These volumes are an ideal reference for R&D engineers and managers, optical systems implementers, university researchers and students, network operators, and investors. Volume A is devoted to components and subsystems, including photonic integrated circuits, multicore and few-mode fibers, photonic crystals, silicon photonics, signal processing, and optical interconnections.
Author: Hongrui Jiang
Publisher: MDPI
ISBN: 3038420506
Category : Microfluidics
Languages : en
Pages : 156
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Book Description
This book is a printed edition of the Special Issue "Microlenses" that was published in Micromachines
Author: Nikos Bamiedakis
Publisher: Elsevier Inc. Chapters
ISBN: 0128060654
Category : Technology & Engineering
Languages : en
Pages : 65
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Book Description
Optical interconnection technologies are increasingly deployed in high-performance electronic systems to address challenges in connectivity, size, bandwidth, latency, and cost. Projected performance requirements are leading to formidable cost and energy efficiency challenges. Hybrid and integrated photonic technologies are currently being developed to reduce assembly complexity and to reduce the numbers of individually packaged parts. This chapter provides an overview of the important challenges that photonics currently face, identifies the various optical technologies that are being considered for use at the different interconnection levels, and presents examples of demonstrated state-of-the-art optical interconnection systems. Finally, the prospects and potential of these technologies in the near future are discussed.
Author: Alexander Kern
Publisher: BoD – Books on Demand
ISBN: 3734720877
Category : Technology & Engineering
Languages : en
Pages : 197
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Book Description
Vertical-cavity surface-emitting lasers (VCSELs) emitting at 850 nm wavelength are known for their attractive optical features and a continuously growing range of applications. The main goal of the present thesis is to demonstrate the feasibility of a monolithical integration of VCSELs with PIN-type photodiodes (PDs) for the operation as transceiver (TRx) chips in optical data links. The project milestones comprise the chip and the epitaxial layer design of the VCSEL–PIN PD device based on a traditional AlGaAs/GaAs material system, its fabrication development, electro-optical characterizations, and data transmission in a bidirectional optical link over a single, two-side butt-coupled standard graded-index (GI) multimode fiber (MMF). The monolithic design lowers the costs in the semiconductor technology as well as in packaging and additionally avoids the use of external optics, even though it is employed with a single 50 μm core diameter GI MMF. Thus, the very compact optical link saves space, weight, and module cost. Deep insights into the electro-optical properties of VCSELs and PIN PDs are given by the theoretical description and measurements. The limitations of small-signal modulation responses are of main interest of this thesis. Thus, the dynamic characteristics including the extraction of modeled parasitics are presented. Also the electrical and optical crosstalk between the integrated devices and both transmission channels as well as the fiber alignment tolerances are covered. The results in optical data transmission consisting of various experiments in half-duplex and full-duplex mode, both free-space and fiber-coupled over a single MMF are comprised. The monolithic TRx design is well suited for low-cost, compact optical links over distances of a few hundred meters. Capable to handle data rates of up to 10 Gbit/s and more, these TRx chips can be employed, e.g., to upgrade existing standard MMF networks to bidirectional operation or in mobile, low-cost, automotive networks.
Author: Neophytos Neo Antoniades
Publisher: Springer Science & Business Media
ISBN: 1461410924
Category : Technology & Engineering
Languages : en
Pages : 536
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Book Description
Modeling, Simulation, Design and Engineering of WDM Systems and Networks provides readers with the basic skills, concepts, and design techniques used to begin design and engineering of optical communication systems and networks at various layers. The latest semi-analytical system simulation techniques are applied to optical WDM systems and networks, and a review of the various current areas of optical communications is presented. Simulation is mixed with experimental verification and engineering to present the industry as well as state-of-the-art research. This contributed volume is divided into three parts, accommodating different readers interested in various types of networks and applications. The first part of the book presents modeling approaches and simulation tools mainly for the physical layer including transmission effects, devices, subsystems, and systems), whereas the second part features more engineering/design issues for various types of optical systems including ULH, access, and in-building systems. The third part of the book covers networking issues related to the design of provisioning and survivability algorithms for impairment-aware and multi-domain networks. Intended for professional scientists, company engineers, and university researchers, the text demonstrates the effectiveness of computer-aided design when it comes to network engineering and prototyping.
Author: Lukas Chrostowski
Publisher: CRC Press
ISBN: 1466516046
Category : Computers
Languages : en
Pages : 217
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Book Description
Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects. From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology. Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.
