Author: Russell A. Lawton
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 162
Book Description
MEMS Reliability for Critical Applications
Author: Russell A. Lawton
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 162
Book Description
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 162
Book Description
MEMS Reliability for Critical and Space Applications
Author: Russell A. Lawton
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 190
Book Description
A selection of scientific papers on the reliability of microelectromechanical systems (MEMS) for critical and space applications.
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 190
Book Description
A selection of scientific papers on the reliability of microelectromechanical systems (MEMS) for critical and space applications.
MEMS Reliability
Author: Allyson L. Hartzell
Publisher: Springer Science & Business Media
ISBN: 144196018X
Category : Technology & Engineering
Languages : en
Pages : 300
Book Description
The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.
Publisher: Springer Science & Business Media
ISBN: 144196018X
Category : Technology & Engineering
Languages : en
Pages : 300
Book Description
The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.
Reliability of MEMS
Author: Osamu Tabata
Publisher: John Wiley & Sons
ISBN: 9783527314942
Category : Technology & Engineering
Languages : en
Pages : 328
Book Description
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Publisher: John Wiley & Sons
ISBN: 9783527314942
Category : Technology & Engineering
Languages : en
Pages : 328
Book Description
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Mems for Biomedical Applications
Author: Shekhar Bhansali
Publisher: Elsevier
ISBN: 0857096273
Category : Technology & Engineering
Languages : en
Pages : 511
Book Description
The application of Micro Electro Mechanical Systems (MEMS) in the biomedical field is leading to a new generation of medical devices. MEMS for biomedical applications reviews the wealth of recent research on fabrication technologies and applications of this exciting technology.The book is divided into four parts: Part one introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms. Part two describes applications of MEMS for biomedical sensing and diagnostic applications. MEMS for in vivo sensing and electrical impedance spectroscopy are investigated, along with ultrasonic transducers, and lab-on-chip devices. MEMS for tissue engineering and clinical applications are the focus of part three, which considers cell culture and tissue scaffolding devices, BioMEMS for drug delivery and minimally invasive medical procedures. Finally, part four reviews emerging biomedical applications of MEMS, from implantable neuroprobes and ocular implants to cellular microinjection and hybrid MEMS.With its distinguished editors and international team of expert contributors, MEMS for biomedical applications provides an authoritative review for scientists and manufacturers involved in the design and development of medical devices as well as clinicians using this important technology. - Reviews the wealth of recent research on fabrication technologies and applications of Micro Electro Mechanical Systems (MEMS) in the biomedical field - Introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms - Considers MEMS for biomedical sensing and diagnostic applications, along with MEMS for in vivo sensing and electrical impedance spectroscopy
Publisher: Elsevier
ISBN: 0857096273
Category : Technology & Engineering
Languages : en
Pages : 511
Book Description
The application of Micro Electro Mechanical Systems (MEMS) in the biomedical field is leading to a new generation of medical devices. MEMS for biomedical applications reviews the wealth of recent research on fabrication technologies and applications of this exciting technology.The book is divided into four parts: Part one introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms. Part two describes applications of MEMS for biomedical sensing and diagnostic applications. MEMS for in vivo sensing and electrical impedance spectroscopy are investigated, along with ultrasonic transducers, and lab-on-chip devices. MEMS for tissue engineering and clinical applications are the focus of part three, which considers cell culture and tissue scaffolding devices, BioMEMS for drug delivery and minimally invasive medical procedures. Finally, part four reviews emerging biomedical applications of MEMS, from implantable neuroprobes and ocular implants to cellular microinjection and hybrid MEMS.With its distinguished editors and international team of expert contributors, MEMS for biomedical applications provides an authoritative review for scientists and manufacturers involved in the design and development of medical devices as well as clinicians using this important technology. - Reviews the wealth of recent research on fabrication technologies and applications of Micro Electro Mechanical Systems (MEMS) in the biomedical field - Introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms - Considers MEMS for biomedical sensing and diagnostic applications, along with MEMS for in vivo sensing and electrical impedance spectroscopy
MEMS and MOEMS Technology and Applications
Author: P. Rai-Choudhury
Publisher: SPIE Press
ISBN: 9780819437167
Category : Technology & Engineering
Languages : en
Pages : 544
Book Description
The silicon age that led the computer revolution has significantly changed the world. The next 30 years will see the incorporation of new types of functionality onto the chip-structures that will enable the chip to reason, to sense, to act and to communicate. Micromachining technologies offer a wide range of possibilities for active and passive devices. Recent developments have produced sensors, actuators and optical systems. Many of these technologies are based on surface micromachining, which has evolved from silicon integrated circuit technology. This book is written by experts in the field. It contains useful details in design and processing and can be utilized as a reference book or as a textbook.
Publisher: SPIE Press
ISBN: 9780819437167
Category : Technology & Engineering
Languages : en
Pages : 544
Book Description
The silicon age that led the computer revolution has significantly changed the world. The next 30 years will see the incorporation of new types of functionality onto the chip-structures that will enable the chip to reason, to sense, to act and to communicate. Micromachining technologies offer a wide range of possibilities for active and passive devices. Recent developments have produced sensors, actuators and optical systems. Many of these technologies are based on surface micromachining, which has evolved from silicon integrated circuit technology. This book is written by experts in the field. It contains useful details in design and processing and can be utilized as a reference book or as a textbook.
Microelectronics Failure Analysis
Author: EDFAS Desk Reference Committee
Publisher: ASM International
ISBN: 1615037268
Category : Technology & Engineering
Languages : en
Pages : 673
Book Description
Includes bibliographical references and index.
Publisher: ASM International
ISBN: 1615037268
Category : Technology & Engineering
Languages : en
Pages : 673
Book Description
Includes bibliographical references and index.
An Introduction to Microelectromechanical Systems Engineering
Author: Nadim Maluf
Publisher: Artech House
ISBN: 9781580535915
Category : Technology & Engineering
Languages : en
Pages : 312
Book Description
Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.
Publisher: Artech House
ISBN: 9781580535915
Category : Technology & Engineering
Languages : en
Pages : 312
Book Description
Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.
Mems Packaging
Author: Yung-cheng Lee
Publisher: World Scientific
ISBN: 9813229373
Category : Technology & Engineering
Languages : en
Pages : 363
Book Description
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Publisher: World Scientific
ISBN: 9813229373
Category : Technology & Engineering
Languages : en
Pages : 363
Book Description
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Wireless MEMS Networks and Applications
Author: Deepak Uttamchandani
Publisher: Elsevier
ISBN: 0081004508
Category : Technology & Engineering
Languages : en
Pages : 290
Book Description
Wireless MEMS Networks and Applications reviews key emerging applications of MEMS in wireless and mobile networks. This book covers the different types of wireless MEMS devices, also exploring MEMS in smartphones, tablets, and the MEMS used for energy harvesting. The book reviews the range of applications of wireless MEMS networks in manufacturing, infrastructure monitoring, environmental monitoring, space applications, agricultural monitoring for food safety, health applications, and systems for smart cities. - Focuses on the use of MEMS in the emerging area of wireless applications - Contains comprehensive coverage of the range of applications of MEMS for wireless networks - Presents an international range of expert contributors who identify key research in the field
Publisher: Elsevier
ISBN: 0081004508
Category : Technology & Engineering
Languages : en
Pages : 290
Book Description
Wireless MEMS Networks and Applications reviews key emerging applications of MEMS in wireless and mobile networks. This book covers the different types of wireless MEMS devices, also exploring MEMS in smartphones, tablets, and the MEMS used for energy harvesting. The book reviews the range of applications of wireless MEMS networks in manufacturing, infrastructure monitoring, environmental monitoring, space applications, agricultural monitoring for food safety, health applications, and systems for smart cities. - Focuses on the use of MEMS in the emerging area of wireless applications - Contains comprehensive coverage of the range of applications of MEMS for wireless networks - Presents an international range of expert contributors who identify key research in the field