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Author: W.K. Jones
Publisher: Springer Science & Business Media
ISBN: 9401100799
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
Author: W.K. Jones
Publisher: Springer Science & Business Media
ISBN: 9401100799
Category : Technology & Engineering
Languages : en
Pages : 312
Get Book Here
Book Description
Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
Author: Edwin Bradley
Publisher: John Wiley & Sons
ISBN: 9780470171462
Category : Technology & Engineering
Languages : en
Pages : 472
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Book Description
Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
Author: W.K. Jones
Publisher: Springer
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 342
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Book Description
Proceedings of the May 1995 workshop. Contains 33 papers which review advances in Multichip Modules (MCM) technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. The authors address new materials development, characterized methods, and high level integration of sensors into electronic packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1330
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Book Description
Author:
Publisher: International Society for Hybrid Microelectronics
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 738
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Book Description
Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).
Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 992
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Book Description
Author: G.G. Harman
Publisher: Springer Science & Business Media
ISBN: 9401151350
Category : Technology & Engineering
Languages : en
Pages : 295
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Book Description
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Author:
Publisher:
ISBN:
Category : Canada
Languages : en
Pages : 932
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Book Description
Author:
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 862
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Book Description
Author: Ian Grout
Publisher: Elsevier
ISBN: 008055850X
Category : Computers
Languages : en
Pages : 763
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Book Description
Digital Systems Design with FPGAs and CPLDs explains how to design and develop digital electronic systems using programmable logic devices (PLDs). Totally practical in nature, the book features numerous (quantify when known) case study designs using a variety of Field Programmable Gate Array (FPGA) and Complex Programmable Logic Devices (CPLD), for a range of applications from control and instrumentation to semiconductor automatic test equipment.Key features include:* Case studies that provide a walk through of the design process, highlighting the trade-offs involved.* Discussion of real world issues such as choice of device, pin-out, power supply, power supply decoupling, signal integrity- for embedding FPGAs within a PCB based design.With this book engineers will be able to:* Use PLD technology to develop digital and mixed signal electronic systems* Develop PLD based designs using both schematic capture and VHDL synthesis techniques* Interface a PLD to digital and mixed-signal systems* Undertake complete design exercises from design concept through to the build and test of PLD based electronic hardwareThis book will be ideal for electronic and computer engineering students taking a practical or Lab based course on digital systems development using PLDs and for engineers in industry looking for concrete advice on developing a digital system using a FPGA or CPLD as its core. - Case studies that provide a walk through of the design process, highlighting the trade-offs involved. - Discussion of real world issues such as choice of device, pin-out, power supply, power supply decoupling, signal integrity- for embedding FPGAs within a PCB based design.
