Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2011: Volume 1335 PDF Download
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Author: Mikhail R. Baklanov
Publisher: Materials Research Society
ISBN: 9781605113128
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
This volume includes selected papers based on the presentations given at Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics," held at the April 25−29, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.
Author: Mikhail R. Baklanov
Publisher: Materials Research Society
ISBN: 9781605113128
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
This volume includes selected papers based on the presentations given at Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics," held at the April 25−29, 2011 MRS Spring Meeting in San Francisco, California. The symposium included topics relating to low-k dielectrics, integration, reliability, metallization, packaging and emerging technologies.
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 127
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Book Description
Author: Martin Gall
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 216
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author: Kim S. Siow
Publisher: Springer
ISBN: 3319992562
Category : Technology & Engineering
Languages : en
Pages : 279
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Book Description
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Author: James H. Dickerson
Publisher: Springer Science & Business Media
ISBN: 144199730X
Category : Science
Languages : en
Pages : 381
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Book Description
This book provides a comprehensive overview of contemporary basic research, emerging technology, and commercial and industrial applications associated with the electrophoretic deposition of nanomaterials. This presentation of the subject includes an historical survey, the underlying theory of electrophoresis, dielectrophoresis, and the colloidal deposition of materials. This is followed by an assessment of the experimental equipment and procedures for electrophoretic and dielectrophoretic aggregation, manipulation, and deposition of nanoparticles, nanotubes, and other nanomaterials. Additional chapters explore the specific science and technology of electrophoretic film formation, using widely studied and application-driven nanomaterials, such as carbon nanotubes, luminescent nanocrystals, and nano-ceramics. The concluding chapters explore industrial applications and procedures associated with electrophoretic deposition of nanomaterials.
Author: Santhakumar Mohan
Publisher: Springer Nature
ISBN: 9811598096
Category : Technology & Engineering
Languages : en
Pages : 909
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Book Description
This book comprises the select proceedings of the International Conference on Materials, Design and Manufacturing for Sustainable Environment (ICMDMSE 2020). The primary focus is on emerging materials and cutting-edge manufacturing technologies for sustainable environment. The book covers a wide range of topics such as advanced materials, vibration, tribology, finite element method (FEM), heat transfer, fluid mechanics, energy engineering, additive manufacturing, robotics and automation, automobile engineering, industry 4.0, MEMS and nanotechnology, optimization techniques, condition monitoring, and new paradigms in technology management. Contents of this book will be useful to students, researchers, and practitioners alike.
Author: Amit Bandyopadhyay
Publisher: CRC Press
ISBN: 1498766706
Category : Technology & Engineering
Languages : en
Pages : 547
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Book Description
The field of additive manufacturing has seen explosive growth in recent years due largely in part to renewed interest from the manufacturing sector. Conceptually, additive manufacturing, or industrial 3D printing, is a way to build parts without using any part-specific tooling or dies from the computer-aided design (CAD) file of the part. Today, mo
Author: Xinliang Feng
Publisher: John Wiley & Sons
ISBN: 352768008X
Category : Technology & Engineering
Languages : en
Pages : 488
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Book Description
This first volume in the series on nanocarbons for advanced applications presents the latest achievements in the design, synthesis, characterization, and applications of these materials for electrochemical energy storage. The highly renowned series and volume editor, Xinliang Feng, has put together an internationally acclaimed expert team who covers nanocarbons such as carbon nanotubes, fullerenes, graphenes, and porous carbons. The first two parts focus on nanocarbon-based anode and cathode materials for lithium ion batteries, while the third part deals with carbon material-based supercapacitors with various applications in power electronics, automotive engineering and as energy storage elements in portable electric devices. This book will be indispensable for materials scientists, electrochemists, physical chemists, solid state physicists, and those working in the electrotechnical industry.
Author: Welchy Leite Cavalcanti
Publisher: Springer
ISBN: 9783319928098
Category : Technology & Engineering
Languages : en
Pages : 350
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Book Description
This book is open access under a CC BY 4.0 license. It presents the results of the ComBoNDT European project, which aimed at the development of more secure, time- and cost-saving extended non-destructive inspection tools for carbon fiber reinforced plastics, adhered surfaces and bonded joints. The book reports the optimal use of composite materials to allow weight savings, reduction in fuel consumptions, savings during production and higher cost efficiency for ground operations.
