Author: Sangeeta Singh
Publisher: Springer Nature
ISBN: 981974623X
Category :
Languages : en
Pages : 331
Book Description
Beyond Si-Based CMOS Devices
Author: Sangeeta Singh
Publisher: Springer Nature
ISBN: 981974623X
Category :
Languages : en
Pages : 331
Book Description
Publisher: Springer Nature
ISBN: 981974623X
Category :
Languages : en
Pages : 331
Book Description
Atomic-Scale Electronics Beyond CMOS
Author: Mircea Dragoman
Publisher: Springer Nature
ISBN: 3030605639
Category : Technology & Engineering
Languages : en
Pages : 221
Book Description
This book explores emerging topics in atomic- and nano-scale electronics after the era of Moore’s Law, covering both the physical principles behind, and technological implementations for many devices that are now expected to become key elements of the future of nanoelectronics beyond traditional complementary metal-oxide semiconductors (CMOS). Moore’s law is not a physical law itself, but rather a visionary prediction that has worked well for more than 50 years but is rapidly coming to its end as the gate length of CMOS transistors approaches the length-scale of only a few atoms. Thus, the key question here is: “What is the future for nanoelectronics beyond CMOS?” The possible answers are found in this book. Introducing novel quantum devices such as atomic–scale electronic devices, ballistic devices, memristors, superconducting devices, this book also presents the reader with the physical principles underlying new ways of computing, as well as their practical implementation. Topics such as quantum computing, neuromorphic computing are highlighted here as some of the most promising candidates for ushering in a new era of atomic-scale electronics beyond CMOS.
Publisher: Springer Nature
ISBN: 3030605639
Category : Technology & Engineering
Languages : en
Pages : 221
Book Description
This book explores emerging topics in atomic- and nano-scale electronics after the era of Moore’s Law, covering both the physical principles behind, and technological implementations for many devices that are now expected to become key elements of the future of nanoelectronics beyond traditional complementary metal-oxide semiconductors (CMOS). Moore’s law is not a physical law itself, but rather a visionary prediction that has worked well for more than 50 years but is rapidly coming to its end as the gate length of CMOS transistors approaches the length-scale of only a few atoms. Thus, the key question here is: “What is the future for nanoelectronics beyond CMOS?” The possible answers are found in this book. Introducing novel quantum devices such as atomic–scale electronic devices, ballistic devices, memristors, superconducting devices, this book also presents the reader with the physical principles underlying new ways of computing, as well as their practical implementation. Topics such as quantum computing, neuromorphic computing are highlighted here as some of the most promising candidates for ushering in a new era of atomic-scale electronics beyond CMOS.
CMOS and Beyond
Author: Tsu-Jae King Liu
Publisher: Cambridge University Press
ISBN: 1107043182
Category : Computers
Languages : en
Pages : 439
Book Description
Get up to speed with the future of logic switch design with this indispensable introduction to post-CMOS technologies.
Publisher: Cambridge University Press
ISBN: 1107043182
Category : Computers
Languages : en
Pages : 439
Book Description
Get up to speed with the future of logic switch design with this indispensable introduction to post-CMOS technologies.
Nanoscale Materials and Devices for Electronics, Photonics and Solar Energy
Author: Anatoli Korkin
Publisher: Springer
ISBN: 3319186337
Category : Technology & Engineering
Languages : en
Pages : 291
Book Description
This book presents research dedicated to solving scientific and technological problems in many areas of electronics, photonics and renewable energy. Progress in information and renewable energy technologies requires miniaturization of devices and reduction of costs, energy and material consumption. The latest generation of electronic devices is now approaching nanometer scale dimensions; new materials are being introduced into electronics manufacturing at an unprecedented rate; and alternative technologies to mainstream CMOS are evolving. The low cost of natural energy sources have created economic barriers to the development of alternative and more efficient solar energy systems, fuel cells and batteries. Nanotechnology is widely accepted as a source of potential solutions in securing future progress for information and energy technologies. Nanoscale Materials and Devices for Electronics, Photonics and Solar Energy features chapters that cover the following areas: atomic scale materials design, bio- and molecular electronics, high frequency electronics, fabrication of nanodevices, magnetic materials and spintronics, materials and processes for integrated and subwave optoelectronics, nanoCMOS, new materials for FETs and other devices, nanoelectronics system architecture, nano optics and lasers, non-silicon materials and devices, chemical and biosensors,quantum effects in devices, nano science and technology applications in the development of novel solar energy devices, and fuel cells and batteries.
Publisher: Springer
ISBN: 3319186337
Category : Technology & Engineering
Languages : en
Pages : 291
Book Description
This book presents research dedicated to solving scientific and technological problems in many areas of electronics, photonics and renewable energy. Progress in information and renewable energy technologies requires miniaturization of devices and reduction of costs, energy and material consumption. The latest generation of electronic devices is now approaching nanometer scale dimensions; new materials are being introduced into electronics manufacturing at an unprecedented rate; and alternative technologies to mainstream CMOS are evolving. The low cost of natural energy sources have created economic barriers to the development of alternative and more efficient solar energy systems, fuel cells and batteries. Nanotechnology is widely accepted as a source of potential solutions in securing future progress for information and energy technologies. Nanoscale Materials and Devices for Electronics, Photonics and Solar Energy features chapters that cover the following areas: atomic scale materials design, bio- and molecular electronics, high frequency electronics, fabrication of nanodevices, magnetic materials and spintronics, materials and processes for integrated and subwave optoelectronics, nanoCMOS, new materials for FETs and other devices, nanoelectronics system architecture, nano optics and lasers, non-silicon materials and devices, chemical and biosensors,quantum effects in devices, nano science and technology applications in the development of novel solar energy devices, and fuel cells and batteries.
Scaling And Integration Of High-speed Electronics And Optomechanical Systems
Author: Magnus Willander
Publisher: World Scientific
ISBN: 9813225416
Category : Technology & Engineering
Languages : en
Pages : 150
Book Description
Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development.In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems.
Publisher: World Scientific
ISBN: 9813225416
Category : Technology & Engineering
Languages : en
Pages : 150
Book Description
Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development.In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems.
3D IC Stacking Technology
Author: Banqiu Wu
Publisher: McGraw Hill Professional
ISBN: 0071741968
Category : Technology & Engineering
Languages : en
Pages : 543
Book Description
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology
Publisher: McGraw Hill Professional
ISBN: 0071741968
Category : Technology & Engineering
Languages : en
Pages : 543
Book Description
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology
Micro- and Nanoelectronics
Author: Tomasz Brozek
Publisher: CRC Press
ISBN: 1482214911
Category : Technology & Engineering
Languages : en
Pages : 383
Book Description
Micro- and Nanoelectronics: Emerging Device Challenges and Solutions presents a comprehensive overview of the current state of the art of micro- and nanoelectronics, covering the field from fundamental science and material properties to novel ways of making nanodevices. Containing contributions from experts in both industry and academia, this cutting-edge text: Discusses emerging silicon devices for CMOS technologies, fully depleted device architectures, characteristics, and scaling Explains the specifics of silicon compound devices (SiGe, SiC) and their unique properties Explores various options for post-CMOS nanoelectronics, such as spintronic devices and nanoionic switches Describes the latest developments in carbon nanotubes, iii-v devices structures, and more Micro- and Nanoelectronics: Emerging Device Challenges and Solutions provides an excellent representation of a complex engineering field, examining emerging materials and device architecture alternatives with the potential to shape the future of nanotechnology.
Publisher: CRC Press
ISBN: 1482214911
Category : Technology & Engineering
Languages : en
Pages : 383
Book Description
Micro- and Nanoelectronics: Emerging Device Challenges and Solutions presents a comprehensive overview of the current state of the art of micro- and nanoelectronics, covering the field from fundamental science and material properties to novel ways of making nanodevices. Containing contributions from experts in both industry and academia, this cutting-edge text: Discusses emerging silicon devices for CMOS technologies, fully depleted device architectures, characteristics, and scaling Explains the specifics of silicon compound devices (SiGe, SiC) and their unique properties Explores various options for post-CMOS nanoelectronics, such as spintronic devices and nanoionic switches Describes the latest developments in carbon nanotubes, iii-v devices structures, and more Micro- and Nanoelectronics: Emerging Device Challenges and Solutions provides an excellent representation of a complex engineering field, examining emerging materials and device architecture alternatives with the potential to shape the future of nanotechnology.
Convergence of More Moore, More than Moore and Beyond Moore
Author: Simon Deleonibus
Publisher: CRC Press
ISBN: 100006459X
Category : Science
Languages : en
Pages : 302
Book Description
The era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems has come. The research and development on Scalable and 3D integrated Diversified functions together with new computing architectures is in full swing. Besides data processing, data storage, new sensing modes and communication capabilities need the revision of process architecture to enable the Heterogeneous co integration of add-on devices with CMOS: the new defined functions and paradigms open the way to Augmented Nanosystems. The choices for future breakthroughs will request the study of new devices, circuits and computing architectures and to take new unexplored paths including as well new materials and integration schmes. This book reviews in two sections, including seven chapters, essential modules to build Diversified Nanosystems based on Nanoelectronics and finally how they pave the way to the definition of Nanofunctions for Augmented Nanosystems.
Publisher: CRC Press
ISBN: 100006459X
Category : Science
Languages : en
Pages : 302
Book Description
The era of Sustainable and Energy Efficient Nanoelectronics and Nanosystems has come. The research and development on Scalable and 3D integrated Diversified functions together with new computing architectures is in full swing. Besides data processing, data storage, new sensing modes and communication capabilities need the revision of process architecture to enable the Heterogeneous co integration of add-on devices with CMOS: the new defined functions and paradigms open the way to Augmented Nanosystems. The choices for future breakthroughs will request the study of new devices, circuits and computing architectures and to take new unexplored paths including as well new materials and integration schmes. This book reviews in two sections, including seven chapters, essential modules to build Diversified Nanosystems based on Nanoelectronics and finally how they pave the way to the definition of Nanofunctions for Augmented Nanosystems.
Beyond-CMOS
Author: Alessandro Cresti
Publisher: John Wiley & Sons
ISBN: 1789451272
Category : Technology & Engineering
Languages : en
Pages : 453
Book Description
Publisher: John Wiley & Sons
ISBN: 1789451272
Category : Technology & Engineering
Languages : en
Pages : 453
Book Description
Springer Handbook of Semiconductor Devices
Author: Massimo Rudan
Publisher: Springer Nature
ISBN: 3030798275
Category : Technology & Engineering
Languages : en
Pages : 1680
Book Description
This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
Publisher: Springer Nature
ISBN: 3030798275
Category : Technology & Engineering
Languages : en
Pages : 1680
Book Description
This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.