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Author:
Publisher: The Electrochemical Society
ISBN: 9781566772969
Category : Magnetic disks
Languages : en
Pages : 636
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 9781566772969
Category : Magnetic disks
Languages : en
Pages : 636
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Book Description
Author: S. Krongelb
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 736
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Book Description
Author: S. Krongelb
Publisher: The Electrochemical Society
ISBN: 1566777305
Category : Science
Languages : en
Pages : 318
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Book Description
This issue of ECS Transactions brings together the work of electrochemists, physicists, engineers, and device designers working in the area of magnetic thin-film technology. Topics include electrochemical and electroless plating systems, etching, process chemistry, tool design, process control, film nucleation and growth, structure of deposits, stress, physics and micromagnetics of films, thermal and magnetic annealing. Applications include the fabrication of data recording systems, sensors, microelectrochemical systems (MEMS) and other magnetic devices.
Author: Lubomyr Taras Romankiw
Publisher: The Electrochemical Society
ISBN: 9781566771139
Category : Computers
Languages : en
Pages : 820
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Author: S. Krongelb
Publisher: The Electrochemical Society
ISBN: 1566778921
Category : Science
Languages : en
Pages : 127
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Book Description
The Eleventh International Symposium on Magnetic Materials, Processes and Devices was held on Monday and Tuesday, October 11 and 12, 2010 as part of the 218th Meeting of Electrochemical Society in Las Vegas, Nevada. This international Symposium included presentations by 59 authors and co-authors from Canada, Germany, Italy, Japan, Korea, Norway and the United States.
Author: Lubomyr Taras Romankiw
Publisher: The Electrochemical Society
ISBN: 9781566772143
Category : Computers
Languages : en
Pages : 730
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Book Description
Author: Kazuo Kondo
Publisher: The Electrochemical Society
ISBN:
Category : Copper plating
Languages : en
Pages : 422
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Book Description
Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.
Author: B. D. Cullity
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Author:
Publisher:
ISBN:
Category : Research
Languages : en
Pages : 600
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Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 628
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Book Description
