Layered Materials for Structural Applications: Volume 434 PDF Download
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Author: J. J. Lewandowski
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
Layered materials and systems based on metallic, intermetallic, polymeric and ceramic constituents have become increasingly important in meeting the structural requirements of current and future high-performance products. This book brings together investigators from industry, academia and government to focus on the structural applications of layered systems. Thermal barrier coatings, aircraft structural components and wear-resistant coatings for a wide variety of applications are highlighted. Processing techniques such as EB deposition, reactive sputter deposition, sedimentation processing, pressureless cosintering and rapid prototyping via laminated object manufacturing are also covered. And while microstability issues are addressed, they appear to be a critical area where further investigation is required. The largest number of papers focus on the mechanical behavior and modelling of layered systems and reveal significant effects of layer thickness, spacing and constituent properties on the fracture and fatigue behavior of such systems. Topics include: applications; processing; stability issues and mechanical behavior.
Author: J. J. Lewandowski
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 336
Get Book Here
Book Description
Layered materials and systems based on metallic, intermetallic, polymeric and ceramic constituents have become increasingly important in meeting the structural requirements of current and future high-performance products. This book brings together investigators from industry, academia and government to focus on the structural applications of layered systems. Thermal barrier coatings, aircraft structural components and wear-resistant coatings for a wide variety of applications are highlighted. Processing techniques such as EB deposition, reactive sputter deposition, sedimentation processing, pressureless cosintering and rapid prototyping via laminated object manufacturing are also covered. And while microstability issues are addressed, they appear to be a critical area where further investigation is required. The largest number of papers focus on the mechanical behavior and modelling of layered systems and reveal significant effects of layer thickness, spacing and constituent properties on the fracture and fatigue behavior of such systems. Topics include: applications; processing; stability issues and mechanical behavior.
Author: Robert C. Cammarata
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 536
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Book Description
This book brings together an interdisciplinary group of surface physicists, chemists and materials scientists to present the most current advances in the area of surface science. Both scientific and technological issues are addressed. Topics include: surface and step structure; morphology, roughness and instabilities; kinetic processes; nucleation on surfaces and interfaces; mechanics of surfaces; self-assembled and Langmuir-Blodgett films; thin-film surfaces and growth; chemistry and modification of surfaces and metal-semiconductor interfaces.
Author: R. J. Shul
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 480
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Book Description
III-V semiconductors have continued to find new applications in optical data transmission, full-color displays, automotive electronics and personal communication systems. Complex epitaxial growth, processing, device design and circuit architecture are all necessary for realization of these elements. This book brings together the diverse group of scientists and researchers that are required to develop the next-generation devices. The wide bandgap nitrides, GaN, AlN, InN and their alloys are featured. The commercial availability of blue- and green-light-emitting diodes based on the InGaN/AlGaN system, and the recent announcement of pulsed operation of a laser diode, have stimulated interest in the growth, characterization and processing of these materials. Potential applications in high-temperature/high-power electronics appear promising because of the good transport properties of these nitrides. Topics include: growth and characterization; photonics and processing; electronics and processing; wide bandgap semiconductors and novel devices and processing.
Author:
Publisher:
ISBN:
Category : Ion implantation
Languages : en
Pages : 760
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Book Description
Author: Fernando A. Ponce
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1290
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Book Description
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 616
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Book Description
Author: Michael L. Reed
Publisher:
ISBN:
Category : Mathematics
Languages : en
Pages : 264
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Book Description
A selection of 33 reviewed papers explore the materials aspects of microsystems, especially those involving mechanical, optical, and thermal components. The topics include technology for micro- assembling, selective electroless copper metallization of epoxy substrates, an improved auto-adhesion measurement method for micro-machines polysilicon beams, patterned sol-gel structures by micro-molding in capillaries, the experimental analysis of the process of anodic bonding using an evaporated glass layer, the effect of inorganic thin film material processing and properties on stress in silicon piezoresistive pressure sensors, and photoconductivity in vacuum-deposited films of silicon-based polymers. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Timothy J. Bunning
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 368
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Book Description
Liquid crystals have emerged as a class of organic materials with potential applications to optics, photonics and optoelectronics. Although a large number of liquid crystals have been discovered or synthesized, fundamental understanding of structure-property relationships at the molecular level is still lacking. Regardless, liquid-crystalline materials have found use in many areas of technology and their scope has been extended with the development of liquid-crystalline polymers, elastomers and composite systems. In addition, emerging advanced technologies, such as flat-panel displays, optical computing and communications, and imaging will call for improved materials as well as novel multifunctional materials. This book presents recent advances in both the fundamental science and application-specific research of LC technology. New synthetic approaches are featured, as are developments in novel glass forming, low-molecular-weight liquid crystals and their utility in both display and optical applications. Topics include: PDLC composites; display and optical applications of LC-based compounds; modelling; rheology; chiral smectics and thermosets.
Author: William F. Filter
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 616
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Book Description
MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.
Author: André Lagendijk
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 224
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Book Description
Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.
