Large-Size AlGaN/GaN HEMT Large-Signal Electrothermal Characterization and Modeling for Wireless Digital Communications PDF Download
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Author: Samir Dahmani
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Languages : de
Pages : 0
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Author: Samir Dahmani
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Languages : de
Pages : 0
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Author: Anwar Hasan Jarndal
Publisher: kassel university press GmbH
ISBN: 3899582586
Category :
Languages : en
Pages : 136
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Author: Gunter Kompa
Publisher: Artech House
ISBN: 1630817457
Category : Technology & Engineering
Languages : en
Pages : 610
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All model parameters are fundamentally coupled together, so that directly measured individual parameters, although widely used and accepted, may initially only serve as good estimates. This comprehensive resource presents all aspects concerning the modeling of semiconductor field-effect device parameters based on gallium-arsenide (GaAs) and gallium nitride (GaN) technology. Metal-semiconductor field-effect transistors (MESFETs), high electron mobility transistors (HEMTs) and heterojunction bipolar transistors (HBTs), their structures and functions, and existing transistor models are also classified. The Shockley model is presented in order to give insight into semiconductor field-effect transistor (FET) device physics and explain the relationship between geometric and material parameters and device performance. Extraction of trapping and thermal time constants is discussed. A special section is devoted to standard nonlinear FET models applied to large-signal measurements, including static-/pulsed-DC and single-/two-tone stimulation. High power measurement setups for signal waveform measurement, wideband source-/load-pull measurement (including envelope source-/load pull) are also included, along with high-power intermodulation distortion (IMD) measurement setup (including envelope load-pull). Written by a world-renowned expert in the field, this book is the first to cover of all aspects of semiconductor FET device modeling in a single volume.
Author: M. Berroth
Publisher:
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Languages : en
Pages : 9
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For improved non-linear modeling of AlGaN/GaN high electron mobility transistors, a large- signal model originally developed for GaAs-based devices has been extended by introduction of a thermal sub-circuit to account for self-heating. Thereby, DC output characteristics which typically show negative output conductance at a high dissipating power level are well reproduced. Since self-heating also effects the transconductance, which is related to S(sub 21 at RF conditions, the comparison of broadband S-parameter simulations and measurements revealed significant improvement when using the extended model. First experimental and theoretical investigations on the transient behavior at pulsed conditions are finally presented.
Author: Chieh Kai Yang
Publisher:
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Languages : en
Pages : 109
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Abstract: Any defect site existing in the AlGaN/GaN HEMTs can be electrically active during device operation. The activated defect site not only could lead to a degradation in the output characteristics but may introduce additional nonlinearity which seriously downgrades the values of devices for various applications. This motivates us to study the detailed path experimentally and theoretically how an electrically-activated defect site could impact the device performances during practical device operation. In this study, the g oal is (1) to give device engineers ideas on how further improvements can be devised to strengthen the existing GaN technology and (2) to provide circuit designers with better understanding on how to use GaN devices more efficiently for the development of reliable commercial GaN products for higher power applications in wireless systems. Single tone characterization results of AlGaN/GaN HEMTs for Class A operation are presented and compared. A new combined large signal network analyzer / deep level optical spectroscopy system is utilized to study the impact of illumination on the CW large-signal load line and small-signal S-parameters variations to identify the possible energy level of the trapping center responsible for the degradation of the device performance. A new pulsed-IV pulsed-RF "coldFET" technique is introduced to extract parasitic elements existing in the access regions of AlGaN/GaN HEMTs. The observation of bias-dependence is detailed and a simple semi-physical model is proposed which provides a satisfactory description of experimental results. The low-frequency noise, an important figure of merit in terms of reliability, is briefly-reviewed. Additive phase noise measurements are presented and the effects of illumination and load impedance are examined. A physical expression is derived and simulated which successfully establishes a relationship between the access resistance and the low-frequency noise and provides a qualitative description of the measurement results.
Author: Mohamad Alsabbagh
Publisher:
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Category :
Languages : en
Pages :
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Electrical equivalent circuit modeling of active components is one of the most important approaches for modeling high-frequency high-power devices. Amongst the most used microwave devices, AlGaN/GaN HEMTs demonstrated their superior performance, making them highly suitable for 5G, wireless and satellite communications. Despite the remarkable performance of AlGaN/GaN HEMTs, these devices reside on substrates that invoke limitations on the operating-frequency, power-efficiency, and current dispersion phenomenon. Also, there is a limitation in present parameters extraction techniques being not able to consider both the substrate effect (Silicon, Silicon Carbide, and Diamond) and the asymmetrical GaN HEMT structure. In this thesis work, a single extrinsic parameters extraction technique using a single small-signal topology takes into account both the asymmetrical GaN HEMT structure and the different substrate types with their parasitic conduction will be developed and studied for the first time. Moreover, large-signal modeling using Quasi-Physical Zone Division technique has been applied to both GaN/D and GaN/SiC to model the isothermal-trapping free drain current, and combined with a new simple technique for comparing performance between active devices in terms of current-dispersion. The models were verified by simulating the small-signal S-parameters, large-signal IV characteristics, and single-tone load-pull. High accuracy was achieved compared to the measurement data available in the technical literature and obtained from fabricated devices.
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Languages : en
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Languages : en
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The large signal characteristics of 1 Pm long S-gate AlGaN/GaN HEMTs on resistive silicon substrates have been measured and analyzed. The HEMTs demonstrated maximum transconductance and current density values of 350 mS/mm and 1,200 mA/mm respectively. High current gain and maximum power gain frequencies ft and fmax were measured at 25 GHz and 43 GHz .Large signal gain and power density values of 16 dBand 1.7 W/mm for a two-finger 1x75 Pm 2 HEMT respectively were observed at 5 GHz. The device also exhibited PAE values as high as 40%with P1dB around +2.0 dBm for Class AB operation.
Author: Abel Fontserè Recuenco
Publisher:
ISBN:
Category :
Languages : en
Pages : 240
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Nowadays, the microelectronics technology is based on the mature and very well established silicon (Si) technology. However, Si exhibits some important limitations regarding its voltage blocking capability, operation temperature and switching frequency. In this sense, Gallium Nitride (GaN)-based high electron mobility transistors (HEMTs) devices have the potential to make this change possible. The unique combination of the high-breakdown field, the high-channel electron mobility of the two dimensional electron gas (2DEG), and high-temperature of operation has attracted enormous interest from social, academia and industry and in this context this PhD dissertation has been made. This thesis has focused on improving the device performance through the advanced design, fabrication and characterization of AlGaN/GaN HEMTs, primarily grown on Si templates. The first milestone of this PhD dissertation has been the establishment of a know-how on GaN HEMT technology from several points of view: the device design, the device modeling, the process fabrication and the advanced characterization primarily using devices fabricated at Centre de Recherche sur l'Hétéro-Epitaxie (CRHEA-CNRS) (France) in the framework of a collaborative project. In this project, the main workhorse of this dissertation was the explorative analysis performed on the AlGaN/GaN HEMTs by innovative electrical and physical characterization methods. A relevant objective of this thesis was also to merge the nanotechnology approach with the conventional characterization techniques at the device scale to understand the device performance. A number of physical characterization techniques have been imaginatively used during this PhD determine the main physical parameters of our devices such as the morphology, the composition, the threading dislocations density, the nanoscale conductive pattern and others. The conductive atomic force microscopy (CAFM) tool have been widely described and used to understand the conduction mechanisms through the AlGaN/GaN Ohmic contact by performing simultaneously topography and electrical conductivity measurements. As it occurs with the most of the electronic switches, the gate stack is maybe the critical part of the device in terms of performance and longtime reliability. For this reason, how the AlGaN/GaN HEMT gate contact affects the overall HEMT behaviour by means of advanced characterization and modeling has been intensively investigated. It is worth mentioning that the high-temperature characterization is also a cornerstone of this PhD. It has been reported the elevated temperature impact on the forward and the reverse leakage currents for analogous Schottky gate HEMTs grown on different substrates: Si, sapphire and free-standing GaN (FS-GaN). The HEMT' forward-current temperature coefficients (T̂a) as well as the thermal activation energies have been determined in the range of 25-300 oC. Besides, the impact of the elevated temperature on the Ohmic and gate contacts has also been investigated. The main results of the gold-free AlGaN/GaN HEMTs high-voltage devices fabricated with a 4 inch Si CMOS compatible technology at the clean room of the CNM in the framework of the industrial contract with ON semiconductor were presented. We have shown that the fabricated devices are in the state-of-the-art (gold-free Ohmic and Schottky contacts) taking into account their power device figure-of-merit ((VB̂2)/Ron) of 4.05×10̂8 W/cm̂2. Basically, two different families of AlGaN/GaN-on-Si MIS-HEMTs devices were fabricated on commercial 4 inch wafers: (i) using a thin ALD HfO2 (deposited on the CNM clean room) and (ii) thin in-situ grown Si3N4, as a gate insulator (grown by the vendor). The scientific impact of this PhD in terms of science indicators is of 17 journal papers (8 as first author) and 10 contributions at international conferences.
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Languages : en
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