Large-Signal Modeling of GaN Devices for Designing High Power Amplifiers of Next Generation Wireless Communication Systems PDF Download
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Author: Anwar Jarndal
Publisher:
ISBN: 9789533070421
Category :
Languages : en
Pages :
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Book Description
Author: Anwar Jarndal
Publisher:
ISBN: 9789533070421
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author: Anwar Hasan Jarndal
Publisher: kassel university press GmbH
ISBN: 3899582586
Category :
Languages : en
Pages : 136
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Book Description
Author: Salma Ait Fares
Publisher: BoD – Books on Demand
ISBN: 9533070420
Category : Technology & Engineering
Languages : en
Pages : 418
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Book Description
Mobile and wireless communications applications have a clear impact on improving the humanity wellbeing. From cell phones to wireless internet to home and office devices, most of the applications are converted from wired into wireless communication. Smart and advanced wireless communication environments represent the future technology and evolutionary development step in homes, hospitals, industrial, vehicular and transportation systems. A very appealing research area in these environments has been the wireless ad hoc, sensor and mesh networks. These networks rely on ultra low powered processing nodes that sense surrounding environment temperature, pressure, humidity, motion or chemical hazards, etc. Moreover, the radio frequency (RF) transceiver nodes of such networks require the design of transmitter and receiver equipped with high performance building blocks including antennas, power and low noise amplifiers, mixers and voltage controlled oscillators. Nowadays, the researchers are facing several challenges to design such building blocks while complying with ultra low power consumption, small area and high performance constraints. CMOS technology represents an excellent candidate to facilitate the integration of the whole transceiver on a single chip. However, several challenges have to be tackled while designing and using nanoscale CMOS technologies and require innovative idea from researchers and circuits designers. While major researchers and applications have been focusing on RF wireless communication, optical wireless communication based system has started to draw some attention from researchers for a terrestrial system as well as for aerial and satellite terminals. This renewed interested in optical wireless communications is driven by several advantages such as no licensing requirements policy, no RF radiation hazards, and no need to dig up roads besides its large bandwidth and low power consumption. This second part of the book, Mobile and Wireless Communications: Key Technologies and Future Applications, covers the recent development in ad hoc and sensor networks, the implementation of state of the art of wireless transceivers building blocks and recent development on optical wireless communication systems. We hope that this book will be useful for students, researchers and practitioners in their research studies.
Author: Endalkachew Shewarega Mengistu
Publisher: kassel university press GmbH
ISBN: 3899583817
Category :
Languages : en
Pages : 153
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Book Description
Author: Diego Guerra
Publisher: LAP Lambert Academic Publishing
ISBN: 9783847325673
Category :
Languages : en
Pages : 224
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Book Description
This work initially compares GaN high electron mobility transistors (HEMTs) based on the established Ga-face technology and the emerging N-face technology. An investigation is then carried out on the short channel effects in ultra-scaled GaN and InP HEMTs. The dielectric effects of the passivation layer in millimeter-wave, high-power GaN HEMTs are also investigated by focusing on the effective gate length, the gate fringing capacitance, and the drain-to-gate feedback capacitance. Lastly, efficient Full Band Monte Carlo particle-based device simulations of the large-signal performance of millimeter-wave transistor power amplifiers with high-Q matching networks are reported for the first time. In particular, a Cellular Monte Carlo code is self-consistently coupled with a Harmonic Balance frequency domain circuit solver. This book provides device engineers with an insight about the link between the nano-scale carrier dynamics and the device performance. It also introduces an efficient tool for the device early-stage design for RF power amplifiers.
Author: Jaime Alberto Zamudio Flores
Publisher: kassel university press GmbH
ISBN: 3862193640
Category : Gallium nitride
Languages : en
Pages : 257
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Book Description
This work presents a comprehensive modeling strategy for advanced large-size AlGaN/GaN HEMTs. A 22-element equivalent circuit with 12 extrinsic elements, including 6 capacitances, serves as small-signal model and as basis for a large-signal model. ANalysis of such capacitances leads to original equations, employed to form capacitance ratios. BAsic assumptions of existing parameter extractions for 22-element equivalent circuits are perfected: A) Required capacitance ratios are evaluated with device's top-view images. B) Influences of field plates and source air-bridges on these ratios are considered. The large-signal model contains a gate charge's non-quasi-static model and a dispersive-IDS model. THe extrinsic-to-intrinsic voltage transformation needed to calculate non-quasi-static parameters from small-signal parameters is improved with a new description for the measurement's boundary bias points. ALl IDS-model parameters, including time constants of charge-trapping and self-heating, are extracted using pulsed-DC IV and IDS-transient measurements, highlighting the modeling strategy's empirical character.
Author: Diego Guerra
Publisher:
ISBN:
Category : Modulation-doped field-effect transistors
Languages : en
Pages : 209
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Book Description
The drive towards device scaling and large output power in millimeter and sub-millimeter wave power amplifiers results in a highly non-linear, out-of-equilibrium charge transport regime. Particle-based Full Band Monte Carlo device simulators allow an accurate description of this carrier dynamics at the nanoscale. This work initially compares GaN high electron mobility transistors (HEMTs) based on the established Ga-face technology and the emerging N-face technology, through a modeling approach that allows a fair comparison, indicating that the N-face devices exhibit improved performance with respect to Ga-face ones due to the natural back-barrier confinement that mitigates short-channel-effects. An investigation is then carried out on the minimum aspect ratio (i.e. gate length to gate-to-channel-distance ratio) that limits short channel effects in ultra-scaled GaN and InP HEMTs, indicating that this value in GaN devices is 15 while in InP devices is 7.5. This difference is believed to be related to the different dielectric properties of the two materials, and the corresponding different electric field distributions. The dielectric effects of the passivation layer in millimeter-wave, high-power GaN HEMTs are also investigated, finding that the effective gate length is increased by fringing capacitances, enhanced by the dielectrics in regions adjacent to the gate for layers thicker than 5 nm, strongly affecting the frequency performance of deep sub-micron devices. Lastly, efficient Full Band Monte Carlo particle-based device simulations of the large-signal performance of mm-wave transistor power amplifiers with high-Q matching networks are reported for the first time. In particular, a CellularMonte Carlo (CMC) code is self-consistently coupled with a Harmonic Balance (HB) frequency domain circuit solver. Due to the iterative nature of the HB algorithm, this simulation approach is possible only due to the computational efficiency of the CMC, which uses pre-computed scattering tables. On the other hand, HB allows the direct simulation of the steady-state behavior of circuits with long transient time. This work provides an accurate and efficient tool for the device early-stage design, which allows a computerbased performance evaluation in lieu of the extremely time-consuming and expensive iterations of prototyping and experimental large-signal characterization.
Author: Subhash Chandra Bera
Publisher: Springer Nature
ISBN: 9811962669
Category : Technology & Engineering
Languages : en
Pages : 263
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Book Description
The textbook discusses design and analysis of microwave high power and high efficiency amplifiers for communications, appropriate for undergraduate, post-graduate students, practical circuit designers and researchers in the field of electronics and communication engineering. This book covers basics of III-V group semiconductor materials and GaAs and GaN based High Electron Mobility Transistors (HEMTs) most suitable for microwave and mm wave power amplifiers required for present wireless communication systems and upcoming 4G and 5G mobile base stations. The book describes design and analysis of classical class of amplifier operations such as Class-A, B, AB, C and F. The coverage extends to advanced classes of amplifier operation such as extended continuous Class-B/Class-J, and extended continuous Class-F operations for broadband, high power and high efficiency performance. Analytical expressions are derived for circuit elements and performance parameters for clear understanding and required for practical design of power amplifiers. Each topic is supplemented with suitable schematic diagrams, analytical expressions and plotted results for clear understanding.
Author: Mark Anthony Connor
Publisher:
ISBN:
Category : Amplifiers, Radio frequency
Languages : en
Pages : 102
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Book Description
The need for high power, highly efficient, multi-band and multi-mode radio frequency (RF) and microwave power amplifiers in the commercial and defense wireless industries continues to drive the research and development of gallium nitride (GaN) devices and their implementation in the receiver and transmitter lineups of modern microwave systems. Unlike silicon (Si) or gallium arsenide (GaAs), GaN is a direct wide bandgap semiconductor that permits usage in high voltage and therefore high power applications. Additionally, the increased saturation velocity of GaN allows for operation well into the super high frequency (SHF) portion of the RF spectrum. For the power amplifier designer, active devices utilizing GaN will exhibit power densities almost an order of magnitude greater than comparably sized GaAs devices and almost two orders of magnitude greater than Si devices. Not only does this mean an overall size reduction of an amplifier for a given output power, but it allows GaN to replace specialized components such as the traveling-wave tube (TWT) and other circuits once deemed impossible to realize using solid-state electronics. Designs utilizing GaN in amplifiers, switches, mixers, etc., are able to meet the continually shrinking size, increased power, stringent thermal, and cost requirements of a modern microwave system.There are two relatively straight forward methods used to investigate the intrinsic power scaling properties of a GaN high-electron-mobility transistor (HEMTs) configured as a common source amplifier. The first method involves sweeping the applied drain to source voltage bias and the second method involves scaling the physical size of the transistor. The prior method can be used to evaluate fixed sized transistors while the latter method requires an understanding of the obtainable power density for a given device technology prior to fabrication. Since the power density is also a function of the drain to source voltage bias, an initial iterative component of the design cycle may be required to fully characterize the device technology. If a scalable nonlinear device model is available to the designer, the harmonic balance simulator in most computer aided design (CAD) tools can be used to evaluate device parameters such as the maximum output power and power added efficiency (PAE) using large signal load pull simulations.The circuits presented in this thesis address two power amplifier design approaches commonly used in industry. The first approach utilizes commercially available bare die GaN transistors that can be wire-bonded to matching circuitry on a printed circuit board (PCB). This technique is known as hybrid packaging. The second approach utilizes a fully integrated design or monolithic microwave integrated circuit (MMIC) and the process design kit (PDK) used to design, simulate and layout the power amplifier circuitry before submission to a foundry for fabrication. In both cases, the nonlinear transistor models are used to investigate the power scalability of class E mode GaN power amplifiers and the techniques used to implement such circuits. The design, results, and challenges of each approach are discussed and future work is presented.
Author: Farid Medjdoub
Publisher: MDPI
ISBN: 3036505660
Category : Technology & Engineering
Languages : en
Pages : 242
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Book Description
Emerging wide bandgap (WBG) semiconductors hold the potential to advance the global industry in the same way that, more than 50 years ago, the invention of the silicon (Si) chip enabled the modern computer era. SiC- and GaN-based devices are starting to become more commercially available. Smaller, faster, and more efficient than their counterpart Si-based components, these WBG devices also offer greater expected reliability in tougher operating conditions. Furthermore, in this frame, a new class of microelectronic-grade semiconducting materials that have an even larger bandgap than the previously established wide bandgap semiconductors, such as GaN and SiC, have been created, and are thus referred to as “ultra-wide bandgap” materials. These materials, which include AlGaN, AlN, diamond, Ga2O3, and BN, offer theoretically superior properties, including a higher critical breakdown field, higher temperature operation, and potentially higher radiation tolerance. These attributes, in turn, make it possible to use revolutionary new devices for extreme environments, such as high-efficiency power transistors, because of the improved Baliga figure of merit, ultra-high voltage pulsed power switches, high-efficiency UV-LEDs, and electronics. This Special Issue aims to collect high quality research papers, short communications, and review articles that focus on wide bandgap device design, fabrication, and advanced characterization. The Special Issue will also publish selected papers from the 43rd Workshop on Compound Semiconductor Devices and Integrated Circuits, held in France (WOCSDICE 2019), which brings together scientists and engineers working in the area of III–V, and other compound semiconductor devices and integrated circuits. In particular, the following topics are addressed: – GaN- and SiC-based devices for power and optoelectronic applications – Ga2O3 substrate development, and Ga2O3 thin film growth, doping, and devices – AlN-based emerging material and devices – BN epitaxial growth, characterization, and devices
