Author: Grace M. Davidson
Publisher: ASM International
ISBN: 1615030824
Category : Technology & Engineering
Languages : en
Pages : 310
Book Description
ISTFA 1997: International Symposium for Testing and Failure Analysis
Author: Grace M. Davidson
Publisher: ASM International
ISBN: 1615030824
Category : Technology & Engineering
Languages : en
Pages : 310
Book Description
Publisher: ASM International
ISBN: 1615030824
Category : Technology & Engineering
Languages : en
Pages : 310
Book Description
ISTFA '97
Author: ASM International
Publisher: Asm International
ISBN: 9780871706195
Category : Medical
Languages : en
Pages : 346
Book Description
Proceedings of the October 1997 symposium, of interest to engineers involved in testing and failure analysis of semiconductor devices. Contains sections on testing and signature analysis, techniques, micro-electric-mechanical systems, discretes, packaging/E-beam, FIB/E- beam, and case histories. Specific topics include gain reduction in silicon pho
Publisher: Asm International
ISBN: 9780871706195
Category : Medical
Languages : en
Pages : 346
Book Description
Proceedings of the October 1997 symposium, of interest to engineers involved in testing and failure analysis of semiconductor devices. Contains sections on testing and signature analysis, techniques, micro-electric-mechanical systems, discretes, packaging/E-beam, FIB/E- beam, and case histories. Specific topics include gain reduction in silicon pho
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author:
Publisher: ASM International
ISBN: 1627080996
Category :
Languages : en
Pages :
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Publisher: ASM International
ISBN: 1627080996
Category :
Languages : en
Pages :
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
ISTFA 2014
Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080740
Category : Technology & Engineering
Languages : en
Pages : 561
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Publisher: ASM International
ISBN: 1627080740
Category : Technology & Engineering
Languages : en
Pages : 561
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
ISTFA 2017 Proceedings from the 43rd International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher:
ISBN: 9781627081504
Category :
Languages : en
Pages : 660
Book Description
The theme for the November 2017 conference is Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Publisher:
ISBN: 9781627081504
Category :
Languages : en
Pages : 660
Book Description
The theme for the November 2017 conference is Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Istfa 2001
Author: ASM International
Publisher: ASM International
ISBN: 1615030859
Category : Technology & Engineering
Languages : en
Pages : 456
Book Description
Publisher: ASM International
ISBN: 1615030859
Category : Technology & Engineering
Languages : en
Pages : 456
Book Description
ISTFA 2011
Author:
Publisher: ASM International
ISBN: 1615038507
Category : Technology & Engineering
Languages : en
Pages : 479
Book Description
Publisher: ASM International
ISBN: 1615038507
Category : Technology & Engineering
Languages : en
Pages : 479
Book Description
ISTFA 2010
Author:
Publisher: ASM International
ISBN: 1615037276
Category : Technology & Engineering
Languages : en
Pages : 487
Book Description
Publisher: ASM International
ISBN: 1615037276
Category : Technology & Engineering
Languages : en
Pages : 487
Book Description
ISTFA 2003
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages :
Book Description
Contains complete text of the conference proceedings.
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages :
Book Description
Contains complete text of the conference proceedings.
ISTFA 2005
Author: ASM International
Publisher: ASM International(OH)
ISBN: 9780871708236
Category : Science
Languages : en
Pages : 523
Book Description
Publisher: ASM International(OH)
ISBN: 9780871708236
Category : Science
Languages : en
Pages : 523
Book Description