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Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 392
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 392
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Book Description
Author:
Publisher:
ISBN:
Category : Computer architecture
Languages : en
Pages : 392
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Book Description
Author: Koen De Bosschere
Publisher: Springer
ISBN: 3540693386
Category : Computers
Languages : en
Pages : 298
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Book Description
This book constitutes the refereed proceedings of the Second International Conference on High Performance Embedded Architectures and Compilers, HiPEAC 2007, held in Ghent, Belgium, in January 2007. The 19 revised full papers presented together with one invited keynote paper were carefully reviewed and selected from 65 submissions. The papers are organized in topical sections.
Author: Christoforos Kachris
Publisher: Springer Science & Business Media
ISBN: 1461446309
Category : Technology & Engineering
Languages : en
Pages : 179
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Book Description
Optical Interconnects in Future Data Center Networks covers optical networks and how they can be used to provide high bandwidth, energy efficient interconnects for future data centers with increased communication bandwidth requirements. This contributed volume presents an integrated view of the future requirements of the data centers and serves as a reference work for some of the most advanced solutions that have been proposed by major universities and companies. Collecting the most recent and innovative optical interconnects for data center networks that have been presented in the research community by universities and industries, this book is a valuable reference to researchers, students, professors and engineers interested in the domain of high performance interconnects and data center networks. Additionally, Optical Interconnects in Future Data Center Networks provides invaluable insights into the benefits and advantages of optical interconnects and how they can be a promising alternative for future data center networks.
Author: Dennis Abts
Publisher: Morgan & Claypool Publishers
ISBN: 1608454029
Category : Computers
Languages : en
Pages : 117
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Book Description
This book describes the design and engineering tradeoffs of datacenter networks. It describes interconnection networks from topology and network architecture to routing algorithms, and presents opportunities for taking advantage of the emerging technology trends that are influencing router microarchitecture. With the emergence of "many-core" processor chips, it is evident that we will also need "many-port" routing chips to provide a bandwidth-rich network to avoid the performance limiting effects of Amdahl's Law. We provide an overview of conventional topologies and their routing algorithms and show how technology, signaling rates and cost-effective optics are motivating new network topologies that scale up to millions of hosts. The book also provides detailed case studies of two high performance parallel computer systems and their networks. --Book Jacket.
Author:
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Category : Application software
Languages : en
Pages : 0
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Book Description
Author: Guangyu Sun
Publisher: Springer Science & Business Media
ISBN: 3319006819
Category : Technology & Engineering
Languages : en
Pages : 126
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Book Description
This book equips readers with tools for computer architecture of high performance, low power, and high reliability memory hierarchy in computer systems based on emerging memory technologies, such as STTRAM, PCM, FBDRAM, etc. The techniques described offer advantages of high density, near-zero static power, and immunity to soft errors, which have the potential of overcoming the “memory wall.” The authors discuss memory design from various perspectives: emerging memory technologies are employed in the memory hierarchy with novel architecture modification; hybrid memory structure is introduced to leverage advantages from multiple memory technologies; an analytical model named “Moguls” is introduced to explore quantitatively the optimization design of a memory hierarchy; finally, the vulnerability of the CMPs to radiation-based soft errors is improved by replacing different levels of on-chip memory with STT-RAMs.
Author: Yuan Xie
Publisher: Springer Nature
ISBN: 3031017471
Category : Technology & Engineering
Languages : en
Pages : 113
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Book Description
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Author: Ben Abadallah Abderazek
Publisher: Springer Science & Business Media
ISBN: 9491216333
Category : Computers
Languages : en
Pages : 196
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Book Description
Conventional on-chip communication design mostly use ad-hoc approaches that fail to meet the challenges posed by the next-generation MultiCore Systems on-chip (MCSoC) designs. These major challenges include wiring delay, predictability, diverse interconnection architectures, and power dissipation. A Network-on-Chip (NoC) paradigm is emerging as the solution for the problems of interconnecting dozens of cores into a single system on-chip. However, there are many problems associated with the design of such systems. These problems arise from non-scalable global wire delays, failure to achieve global synchronization, and difficulties associated with non-scalable bus-based functional interconnects. The book consists of three parts, with each part being subdivided into four chapters. The first part deals with design and methodology issues. The architectures used in conventional methods of MCSoCs design and custom multiprocessor architectures are not flexible enough to meet the requirements of different application domains and not scalable enough to meet different computation needs and different complexities of various applications. Several chapters of the first part will emphasize on the design techniques and methodologies. The second part covers the most critical part of MCSoCs design — the interconnections. One approach to addressing the design methodologies is to adopt the so-called reusability feature to boost design productivity. In the past years, the primitive design units evolved from transistors to gates, finite state machines, and processor cores. The network-on-chip paradigm offers this attractive property for the future and will be able to close the productivity gap. The last part of this book delves into MCSoCs validations and optimizations. A more qualitative approach of system validation is based on the use of formal techniques for hardware design. The main advantage of formal methods is the possibility to prove the validity of essential design requirements. As formal languages have a mathematical foundation, it is possible to formally extract and verify these desired properties of the complete abstract state space. Online testing techniques for identifying faults that can lead to system failure are also surveyed. Emphasis is given to analytical redundancy-based techniques that have been developed for fault detection and isolation in the automatic control area.
Author: Albert Y. Zomaya
Publisher: John Wiley & Sons
ISBN: 1118342003
Category : Computers
Languages : en
Pages : 605
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Book Description
The energy consumption issue in distributed computing systems raises various monetary, environmental and system performance concerns. Electricity consumption in the US doubled from 2000 to 2005. From a financial and environmental standpoint, reducing the consumption of electricity is important, yet these reforms must not lead to performance degradation of the computing systems. These contradicting constraints create a suite of complex problems that need to be resolved in order to lead to 'greener' distributed computing systems. This book brings together a group of outstanding researchers that investigate the different facets of green and energy efficient distributed computing. Key features: One of the first books of its kind Features latest research findings on emerging topics by well-known scientists Valuable research for grad students, postdocs, and researchers Research will greatly feed into other technologies and application domains
