Proceedings / International Test Conference. 1993. Designing, testing, and diagnostics - join them : October 17 - 21, 1993, Convention Center, Baltimore, Maryland, USA PDF Download
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Author: International Test Conference
Publisher:
ISBN: 9780780314290
Category :
Languages : en
Pages :
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Book Description
Author: International Test Conference
Publisher:
ISBN: 9780780314290
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author:
Publisher: Conference
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 1090
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Book Description
Annotation Proceedings of the 24th International Test Conference held in Baltimore, October 1993--the premier conference for the testing of electronic devices, assemblies, and systems, including design for testability and diagnostics. This year's leading edge topics are mixed-signal testing, multichip modules, systems test, automatic synthesis of test structures in design, boundary scan, and Iddq. Core topics represented included ATPG, modeling, test equipment hardware, delay fault testing, software testing, DFT, applied BIST, board testing, memory and microprocessor testing, test economics, and test quality and reliability. Annotation copyright by Book News, Inc., Portland, OR.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 1065
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Book Description
Author: Institute of Electrical and Electronics Engineers
Publisher: Conference
ISBN:
Category : Automatic checkout equipment
Languages : en
Pages : 1032
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Book Description
Annotation The proceedings of the 23rd edition of the premier technical conference on electronic testing, held in Baltimore, Maryland, September 1992, comprise papers, panels, and tutorials in the areas of design and test integration; test management; software; test hardware; device, assembly, and system test; and IEEE test standards. ITC's 1992 theme, Discover the New World of Test and Design, reflects the growing emphasis on tighter integration of test and design to assure the highest quality products. No subject index. Ruggedly bound for heavy use. Annotation copyrighted by Book News, Inc., Portland, OR.
Author:
Publisher:
ISBN: 9780780314306
Category : Automatic checkout equipment
Languages : en
Pages : 1065
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Book Description
Author:
Publisher:
ISBN:
Category : Automatic test equipment
Languages : en
Pages : 1065
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 1065
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Book Description
Author: S. Chakravarty
Publisher: Springer Science & Business Media
ISBN: 146156137X
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
Testing techniques for VLSI circuits are undergoing many exciting changes. The predominant method for testing digital circuits consists of applying a set of input stimuli to the IC and monitoring the logic levels at primary outputs. If, for one or more inputs, there is a discrepancy between the observed output and the expected output then the IC is declared to be defective. A new approach to testing digital circuits, which has come to be known as IDDQ testing, has been actively researched for the last fifteen years. In IDDQ testing, the steady state supply current, rather than the logic levels at the primary outputs, is monitored. Years of research suggests that IDDQ testing can significantly improve the quality and reliability of fabricated circuits. This has prompted many semiconductor manufacturers to adopt this testing technique, among them Philips Semiconductors, Ford Microelectronics, Intel, Texas Instruments, LSI Logic, Hewlett-Packard, SUN microsystems, Alcatel, and SGS Thomson. This increase in the use of IDDQ testing should be of interest to three groups of individuals associated with the IC business: Product Managers and Test Engineers, CAD Tool Vendors and Circuit Designers. Introduction to IDDQ Testing is designed to educate this community. The authors have summarized in one volume the main findings of more than fifteen years of research in this area.
Author: Yervant Zorian
Publisher: Springer Science & Business Media
ISBN: 1461561078
Category : Technology & Engineering
Languages : en
Pages : 161
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Book Description
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
