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Author: Harry A. Atwater
Publisher: Cambridge University Press
ISBN: 9781107409408
Category : Technology & Engineering
Languages : en
Pages : 146
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Book Description
Advances in thin-film layer transfer processes have opened new routes to multimaterial integration for monolithically integrated heterogeneous components and microsystems, circumventing many of the constraints for epitaxial growth of heterogeneous materials systems. Several methods for wafer bonding and lift-off are now in use for commercial production of silicon-on-insulator wafers. As the range of materials and device complexity increases, the need grows for a fundamental understanding of mechanical, electrical and chemical processes at bonded interfaces and within the components of multimaterial laminated structures. Details of layer exfoliation and transfer mechanisms also require investigation. This book, first published in 2003, addresses the science, engineering innovations and applications of multimaterial integration. Topics range from heteroepitaxy to wafer bonding and layer transfer.
Author: Harry A. Atwater
Publisher: Cambridge University Press
ISBN: 9781107409408
Category : Technology & Engineering
Languages : en
Pages : 146
Get Book
Book Description
Advances in thin-film layer transfer processes have opened new routes to multimaterial integration for monolithically integrated heterogeneous components and microsystems, circumventing many of the constraints for epitaxial growth of heterogeneous materials systems. Several methods for wafer bonding and lift-off are now in use for commercial production of silicon-on-insulator wafers. As the range of materials and device complexity increases, the need grows for a fundamental understanding of mechanical, electrical and chemical processes at bonded interfaces and within the components of multimaterial laminated structures. Details of layer exfoliation and transfer mechanisms also require investigation. This book, first published in 2003, addresses the science, engineering innovations and applications of multimaterial integration. Topics range from heteroepitaxy to wafer bonding and layer transfer.
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 152
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2003, addresses the science, engineering innovations and applications of multimaterial integration. Topics range from heteroepitaxy to wafer bonding and layer transfer.
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 192
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 616
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, offers scientific and technological information on ferroelectric thin films from an international mix of academia, industry and government organizations.
Author:
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 616
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 616
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Book Description
Author: Sean G. Corcoran
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 616
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Book Description
This work contains experimental, theoretical, and modeling research papers from a December 2003 symposium on the mechanical behavior of thin films, touching on topics in stress evolution, modeling stresses and film instability, deformation and adhesion, film fracture and fatigue, processing and structure, indentation testing, mechanical properties, properties and performance, and multilayers and nanolaminates. Some specific topics include fracture patterns in thin films and multilayers, thin film herringbone buckling patterns, the effect of oxygen on adhesion of thin copper films to silicon nitride, and the effects of stress amplitude on the fatigue of polysilicon. Annotation : 2004 Book News, Inc., Portland, OR (booknews.com)
Author:
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ISBN:
Category : Electronic packaging
Languages : en
Pages : 256
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Book Description
Author: Materials Research Society. Fall Meeting
Publisher:
ISBN:
Category : Detectors
Languages : en
Pages : 552
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Book Description
Author: Alexander W Chao
Publisher: World Scientific
ISBN: 9814452793
Category : Science
Languages : en
Pages : 300
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Book Description
Since their debut in the late 1920s, particle accelerators have evolved into a backbone for the development of science and technology in modern society. Of about 30,000 accelerators at work in the world today, a majority is for applications in industry (about 20,000 systems worldwide). There are two major categories of industrial applications: materials processing and treatment, and materials analysis. Materials processing and treatment includes ion implantation (semi-conductor materials, metals, ceramics, etc.) and electron beam irradiation (sterilization of medical devices, food pasteurization, treatment of carcasses and tires, cross-linking of polymers, cutting and welding, curing of composites, etc.). Materials analysis covers ion beam analysis (IBA), non-destructive detection using photons and neutrons, as well as accelerator mass spectrometry (AMS). All the products that are processed, treated and inspected using beams from particle accelerators are estimated to have a collective value of US$500 billion per annum worldwide. Accelerators are also applied for environment protection, such as purifying drinking water, treating waste water, disinfecting sewage sludge and removing pollutants from flue gases. Industrial accelerators continue to evolve, in terms of new applications, qualities and capabilities, and reduction of their costs. Breakthroughs are encountered whenever a new product is made, or an existing product becomes more cost effective. Their impact on our society continues to grow with the potential to address key issues in economics or the society of today. This volume contains fourteen articles, all authored by renowned scientists in their respective fields. Contents:Trends for Electron Beam Accelerator Applications in Industry (Sueo Machi)Ion Implantation for Semiconductor Doping and Materials Modification (Lawrence A Larson, Justin M Williams and Michael I Current)Ion Beam Analysis: A Century of Exploiting the Electronic and Nuclear Structure of the Atom for Materials Characterisation (Chris Jeynes, Roger P Webb and Annika Lohstroh)Neutrons and Photons in Non-Destructive Detection (J F Harmon, D P Wells and A W Hunt)Review of Cyclotrons for the Production of Radioactive Isotopes for Medical and Industrial Applications (Paul Schmor)Development of Accelerator Mass Spectrometry and Its Applications (Jiaer Chen, Zhiyu Guo, Kexin Liu and Liping Zhou)Electron Accelerators for Environment Protection (Andrzej G Chmielewski)Studying Radiation Damage in Structural Materials by Using Ion Accelerators (Peter Hosemann)Direct Current Accelerators for Industrial Applications (Ragnar Hellborg and Harry J Whitlow)Radio-Frequency Electron Accelerators for Industrial Applications (Marshall R Cleland)Accelerators for Neutron Generation and Their Applications (Guenter Mank, Guenter Bauer and Françoise Mulhauser)Prospects for Accelerator Technology (Alan Todd)CERN: From Birth to Success (Herwig Schopper)Simon van der Meer (1925–2011): A Modest Genius of Accelerator Science (Vinod C Chohan) Readership: Physicists and engineers in accelerator science and industry. Keywords:Particle Accelerators;Materials Processing and Treatment;Materials Analysis;Industrial Accelerators;LHC;EnvironmentReviews: "The book is a very helpful way to be introduced in the world of accelerators as powerful tools to carry out quite a big number of applications that play a significant role in common life." IL Nuovo Saggiatore