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Author:
Publisher:
ISBN:
Category : Electronic circuit design
Languages : en
Pages : 540
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Author:
Publisher:
ISBN:
Category : Electronic circuit design
Languages : en
Pages : 540
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Author: William H. Arnold
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 648
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Author: Michael T. Postek
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 716
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Author: Kevin M. Monahan
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 556
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Author: Kevin M. Monahan
Publisher:
ISBN:
Category : Mathematics
Languages : en
Pages : 476
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Author: Kevin M. Monahan
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 340
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Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Society of Photo-optical Instrumentation Engineers
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author: L.F Pau
Publisher: Springer Science & Business Media
ISBN: 1461305071
Category : Computers
Languages : en
Pages : 324
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DEFECT PROPORTION OF DETECTION INITIAL RATE DETECTION RATE INSPECTOR 3 COMPLEXITY OF TIMES PAN OF PERFORMING o~ ________________________ o~ ______________________ __ -;. INSPECTION TASK -;. VISUAL INSPECTION Fagure 1. Trends in relations between the complexity of inspection tasks, defect detection rates (absolute and relative), and inspection time. Irrespective of the necessities described above, and with the excep tion of specific generic application systems (e.g., bare-board PCB inspection, wafer inspection, solder joint inspection, linewidth measure ment), vision systems are still not found frequently in today's electronics factories. Besides cost, some major reasons for this absence are: 1. The detection robustness or accuracy is still insufficient. 2. The total inspection time is often too high, although this can frequently be attributed to mechanical handling or sensing. 3. There are persistent gaps among process engineers, CAD en gineers, manufacturing engineers, test specialists, and computer vision specialists, as problems dominate the day-to-day interac tions and prevent the establishment of trust. 4. Computer vision specialists sometimes still believe that their contributions are universal, so that adaptation to each real problem becomes tedious, or stumbles over the insufficient availabIlity of multidisciplinary expertise. Whether we like it or not, we must still use appropriate sensors, lighting, and combina tions of algorithms for each class of applications; likewise, we cannot design mechanical handling, illumination, and sensing in isolation from each other.
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 406
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