Author: U. KoesterPublisher:
ISBN:
Category :
Languages : en
Pages : 13
Book Description
Influence of Copper Content on Grain Growth in Vapor Deposited Al(cu) Thin Films
Author: U. KoesterPublisher:
ISBN:
Category :
Languages : en
Pages : 13
Book Description
The Influence of Strain Energy on Abnormal Grain Growth in Copper Thin Films
Author: Eden Melody ZielinskiPublisher:
ISBN:
Category :
Languages : en
Pages : 268
Book Description
Interfaces, Superlattices, and Thin Films
Author: John D. DowPublisher:
ISBN:
Category : Science
Languages : en
Pages : 850
Book Description
Effect of Annealing on Copper Thin Films
Author: Parag GadkariPublisher:
ISBN:
Category :
Languages : en
Pages : 80
Book Description
Lastly, it is also observed that the tendency for agglomeration can be reduced by encapsulating the metal film with an oxide overlayer, which in turn improves the resistivity of the thin film due to prolonged grain growth without film breakup.
Grain Growth and Texture Evolution in Copper Thin Films
Author: Petra Sonnweber-RibicPublisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
13th International Conference on Aluminum Alloys (ICAA 13)
Author: Hasso WeilandPublisher: Springer
ISBN: 3319487612
Category : Technology & Engineering
Languages : en
Pages : 1857
Book Description
This is a collection of papers presented at the 13th International Conference on Aluminum Alloys (ICAA-13), the premier global conference for exchanging emerging knowledge on the structure and properties of aluminum materials. The papers are organized around the topics of the science of aluminum alloy design for a range of market applications; the accurate prediction of material properties; novel aluminum products and processes; and emerging developments in recycling and applications using both monolithic and multi-material solutions.
Metals Abstracts Index
Author: Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1622
Book Description
Proceedings
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 978
Book Description
Metals Abstracts
Author: Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1076
Book Description
The Role of Copper on Stress Evolution and Chemical Ordering in Iron-copper-platinum Thin Films
Author: Ross HinsonPublisher:
ISBN:
Category : Electronic dissertations
Languages : en
Pages : 97
Book Description
The chemical ordering of FePt requires an annealing temperature>500 °C. At these temperatures, grain growth attributed to thermal annealing lowers the areal density in computer hard drives. Multiple paths have been proposed to lower the ordering temperature in order to decrease the grain growth. Ternary additions show promise as a way to lower the ordering temperature and decrease the grain growth. Though multiple studies have been conducted on the incorporation of Cu into FePt, these studies have produced contradictory results on the ordering temperature. Currently, there is no literature on the in situ growth stresses during deposition of FePtCu as a function of ordering temperature. InsituFe_44.5 Pt_51 Cu_4.5 and Fe_50 Pt_50 (for comparison) thin films were produced in order to determine how stress and ordering are affected by the incorporation of Cu. The incorporation of Cu at the amounts studied did not change the stress behavior of FePt when compared to Fe_50 Pt_50 . The addition of Cu raised the ordering temperature and had little to no effect on the grain size as compared to the Fe_50 Pt_50 . This retardation of ordering has been explained by the placement of Cu at lattice sites which minimize the bond distance to Pt and maximize the bond distance to Fe.
