IEEE Std 1268-2005 (Revision of IEEE Std 1268-1997) PDF Download
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Languages : en
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ISBN: 9780738147451
Category : Electric currents
Languages : en
Pages : 23
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Languages : en
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ISBN: 9780738170770
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Author: Yo-Sung Ho
Publisher: Springer Science & Business Media
ISBN: 3540300406
Category : Computers
Languages : en
Pages : 1115
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Book Description
The two volume set LNCS 3767 and LNCS 3768 constitutes the refereed proceedings of the 6th Pacific Rim Conference on Multimedia, PCM 2005, held in Jeju Island, Korea in November 2005. The 181 revised papers presented were carefully reviewed and selected from a total of 570 submissions. The papers cover a wide range of topics, including all aspects of multimedia, both technical and artistic perspectives and both theoretical and practical issues. Besides papers that focus on traditional topics, such as multimedia communications, audio-visual compressions, multimedia security, image and signal processing techniques, and multimedia data processing, there are also artistic papers which need not to be strictly technical.
Author: Xiaohua Jia
Publisher: Springer
ISBN: 3540322760
Category : Computers
Languages : en
Pages : 1154
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This book constitutes the refereed proceedings of the First International Conference on Mobile Ad-hoc and Sensor Networks, MSN 2005, held in Wuhan, China in December 2005. The volume also contains 12 papers of the MSN workshop on Modeling and the Security in the Next Generation Mobile Information Systems (MSNG 2005). The 112 revised full papers were carefully reviewed and selected from a total of 512 submissions. The papers address all current topical areas in mobile ad hoc and sensor networks such as network architecture and protocols, software platforms and development tools, self-organization and synchronization, routing and data dissemination, failure resilience and fault isolation, energy management, data, information, and signal processing, security and privacy, network planning, provisioning, and deployment, network modeling and performance evaluation, developments and applications, as well as integration with other systems.
Author: American Public Health Association
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1254
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Author: Rogério de Lemos
Publisher: Springer Science & Business Media
ISBN: 3642102476
Category : Computers
Languages : en
Pages : 346
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This volume contains papers based on contributions to two workshops: the Workshop on Architecting Dependable Systems (WADS 2008)and the Third International Workshop on Views On Designing Complex Architectures (VODCA 2008).
Author: Dieter K. Schroder
Publisher: John Wiley & Sons
ISBN: 0471739065
Category : Technology & Engineering
Languages : en
Pages : 800
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Book Description
This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.
