1999 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop PDF Download
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Author: Mass.) I. E. E. E./S. E. M. I. Advanced Semiconductor Manufacturing Conference and Workshop (10th : 1999 : Boston
Publisher:
ISBN:
Category :
Languages : en
Pages : 455
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Book Description
Author: Mass.) I. E. E. E./S. E. M. I. Advanced Semiconductor Manufacturing Conference and Workshop (10th : 1999 : Boston
Publisher:
ISBN:
Category :
Languages : en
Pages : 455
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Book Description
Author:
Publisher:
ISBN: 9780780354036
Category : Computer integrated manufacturing systems
Languages : en
Pages : 0
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Author: IEEE Electron Devices Society
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780352179
Category :
Languages : en
Pages : 468
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Author: IEEE Aerospace & Electronics Systems Society
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780354036
Category : Computer integrated manufacturing systems
Languages : en
Pages : 0
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Book Description
These proceedings cover: factory design; manufacturing strategy, control and execution; defect reduction and yield enhancement; ultra clean technology; process and metrology equipment; process and material optimization; and environemnt, safety and health.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 140
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Author: Kjell O. Jeppson
Publisher:
ISBN:
Category :
Languages : en
Pages : 140
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Author: Mass.). I.E.E.E./S.E.M.I. Advanced Semiconductor Manufacturing Conference and Workshop (1st : 1990 : Danvers
Publisher:
ISBN:
Category :
Languages : en
Pages : 164
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Author: Chinmay K. Maiti
Publisher: CRC Press
ISBN: 1000638111
Category : Technology & Engineering
Languages : en
Pages : 314
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Book Description
This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.
Author: IEEE, Electron Devices Society and Components, Packaging and Manufacturing Technology Society Staff
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author: Ming Yang
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 688
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