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Author: Subhash L. Shinde
Publisher: Springer Science & Business Media
ISBN: 0387251006
Category : Science
Languages : en
Pages : 285
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Book Description
The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes. The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries. Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.
Author: Subhash L. Shinde
Publisher: Springer Science & Business Media
ISBN: 0387251006
Category : Science
Languages : en
Pages : 285
Get Book
Book Description
The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes. The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries. Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.
Author: Subhash L. Shinde
Publisher: Springer Science & Business Media
ISBN: 9780387220215
Category : Science
Languages : en
Pages : 302
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Book Description
Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth’s atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm , and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di?cult to eliminate “hot spots” completely. This is where high thermal conductivity materials ?nd most of their appli- tions, as “heat spreaders”. The high thermal conductivity of these materials allows the heat to be carried away from the “hot spots” very quickly in all directions thereby “spreading” the heat. Heat spreading reduces the heat ?ux density, and thus makes it possible to cool systems using standard cooling solutions like ?nned heat sinks with forced air cooling.
Author: Terry M. Tritt
Publisher: Springer Science & Business Media
ISBN: 038726017X
Category : Science
Languages : en
Pages : 306
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Book Description
It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.
Author: Deborah D.L. Chung
Publisher: Springer Science & Business Media
ISBN: 1447137329
Category : Technology & Engineering
Languages : en
Pages : 297
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Book Description
Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal management, smart structures and other timely technologies rarely covered in existing books on composites. It also treats materials with polymer, metal, cement, carbon and ceramics matrices, contrasting with others that emphasise polymer-matrix composites. This functional approach will be useful to both practitioners and students. A good selection of example problems, solutions and figures, together with a new and vibrant approach, provides a valuable reference source for all engineers working with composite materials.
Author: Horatio Scott Carslaw
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 0
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Book Description
Author: Fran Cverna
Publisher: ASM International
ISBN: 0871707683
Category : Technology & Engineering
Languages : en
Pages : 564
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Book Description
A quick and easy to use source for qualified thermal properties of metals and alloys. The data tables are arranged by material hierarchy, with summary tables sorted by property value. Values are given for a range of high and low temperatures. Short technical discussions at the beginning of each chapter are designed to refresh the reader's understanding of the properties and units covered in that section
Author: Aamir Shahzad
Publisher: BoD – Books on Demand
ISBN: 178923672X
Category : Technology & Engineering
Languages : en
Pages : 210
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Book Description
This book is intended to provide a deep understanding on the advanced treatments of thermal properties of materials through experimental, theoretical, and computational techniques. This area of interest is being taught in most universities and institutions at the graduate and postgraduate levels. Moreover, the increasing modern technical and social interest in energy has made the study of thermal properties more significant and exciting in the recent years. This book shares with the international community a sense of global motivation and collaboration on the subject of thermal conductivity and its wide spread applications in modern technologies. This book presents new results from leading laboratories and researchers on topics including materials, thermal insulation, modeling, steady and transient measurements, and thermal expansion. The materials of interest range from nanometers to meters, bringing together ideas and results from across the research field.
Author: Kenneth E. Wilkes
Publisher: CRC Press
ISBN: 9781566764773
Category : Technology & Engineering
Languages : en
Pages : 760
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Book Description
This book contains keynote lectures and 54 technical papers, presented at the 23rd International Thermal Conductivity Conference, on various topics, including techniques, coatings and films, theory, composites, fluids, metals, ceramics, and organics, related to thermal conductivity.
Author: Xingcun Colin Tong
Publisher: Springer Science & Business Media
ISBN: 1441977597
Category : Technology & Engineering
Languages : en
Pages : 633
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Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author: P. Klemens
Publisher: Springer
ISBN: 148993751X
Category : Technology & Engineering
Languages : en
Pages : 571
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Book Description
It was seven years ago this month when I had the pleasure of writing the Foreword to the Proceedings of the Eighth Conference on Thermal Conductivity hosted by TPRC/ Purdue University in 1968. Since then this Conference has developed to the point where one can say it has just entered a new phase. At its meeting in June 1975, the Board of Governors of the International Thermal Conductivity Conferences passed a resolution which formalizes two main policies that were felt to be desirable for a number of years, A key item of the resolution was for CINDAS/Purdue University to become the permanent Sponsor of the Conferences and in this capacity assist the Conferences in all matters which will result in the effective implementation of its goals and mission. In short, CINDAS will serve as a home base for the Conferences thus providing continuity and a permanent point of contact. CINDAS/Purdue University is pleased to accept this respons ibility as it is well within its mission to promote the advancement and dissemination of knowledge on thermophysica! properties of matter. A second important aspect of the Conference resolution was the establishment of a policy to publish the Proceedings of future conferences on a continuing and uniform basis effective with this, the Fourteenth Conference.
