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Author: Albert Chun-Chen Liu
Publisher: John Wiley & Sons
ISBN: 1119810477
Category : Computers
Languages : en
Pages : 244
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Book Description
ARTIFICIAL INTELLIGENCE HARDWARE DESIGN Learn foundational and advanced topics in Neural Processing Unit design with real-world examples from leading voices in the field In Artificial Intelligence Hardware Design: Challenges and Solutions, distinguished researchers and authors Drs. Albert Chun Chen Liu and Oscar Ming Kin Law deliver a rigorous and practical treatment of the design applications of specific circuits and systems for accelerating neural network processing. Beginning with a discussion and explanation of neural networks and their developmental history, the book goes on to describe parallel architectures, streaming graphs for massive parallel computation, and convolution optimization. The authors offer readers an illustration of in-memory computation through Georgia Tech’s Neurocube and Stanford’s Tetris accelerator using the Hybrid Memory Cube, as well as near-memory architecture through the embedded eDRAM of the Institute of Computing Technology, the Chinese Academy of Science, and other institutions. Readers will also find a discussion of 3D neural processing techniques to support multiple layer neural networks, as well as information like: A thorough introduction to neural networks and neural network development history, as well as Convolutional Neural Network (CNN) models Explorations of various parallel architectures, including the Intel CPU, Nvidia GPU, Google TPU, and Microsoft NPU, emphasizing hardware and software integration for performance improvement Discussions of streaming graph for massive parallel computation with the Blaize GSP and Graphcore IPU An examination of how to optimize convolution with UCLA Deep Convolutional Neural Network accelerator filter decomposition Perfect for hardware and software engineers and firmware developers, Artificial Intelligence Hardware Design is an indispensable resource for anyone working with Neural Processing Units in either a hardware or software capacity.
Author: Albert Chun-Chen Liu
Publisher: John Wiley & Sons
ISBN: 1119810477
Category : Computers
Languages : en
Pages : 244
Get Book Here
Book Description
ARTIFICIAL INTELLIGENCE HARDWARE DESIGN Learn foundational and advanced topics in Neural Processing Unit design with real-world examples from leading voices in the field In Artificial Intelligence Hardware Design: Challenges and Solutions, distinguished researchers and authors Drs. Albert Chun Chen Liu and Oscar Ming Kin Law deliver a rigorous and practical treatment of the design applications of specific circuits and systems for accelerating neural network processing. Beginning with a discussion and explanation of neural networks and their developmental history, the book goes on to describe parallel architectures, streaming graphs for massive parallel computation, and convolution optimization. The authors offer readers an illustration of in-memory computation through Georgia Tech’s Neurocube and Stanford’s Tetris accelerator using the Hybrid Memory Cube, as well as near-memory architecture through the embedded eDRAM of the Institute of Computing Technology, the Chinese Academy of Science, and other institutions. Readers will also find a discussion of 3D neural processing techniques to support multiple layer neural networks, as well as information like: A thorough introduction to neural networks and neural network development history, as well as Convolutional Neural Network (CNN) models Explorations of various parallel architectures, including the Intel CPU, Nvidia GPU, Google TPU, and Microsoft NPU, emphasizing hardware and software integration for performance improvement Discussions of streaming graph for massive parallel computation with the Blaize GSP and Graphcore IPU An examination of how to optimize convolution with UCLA Deep Convolutional Neural Network accelerator filter decomposition Perfect for hardware and software engineers and firmware developers, Artificial Intelligence Hardware Design is an indispensable resource for anyone working with Neural Processing Units in either a hardware or software capacity.
Author: Shimeng Yu
Publisher: CRC Press
ISBN: 1000567613
Category : Technology & Engineering
Languages : en
Pages : 249
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Book Description
This book covers semiconductor memory technologies from device bit-cell structures to memory array design with an emphasis on recent industry scaling trends and cutting-edge technologies. The first part of the book discusses the mainstream semiconductor memory technologies. The second part of the book discusses the emerging memory candidates that may have the potential to change the memory hierarchy, and surveys new applications of memory technologies for machine/deep learning applications. This book is intended for graduate students in electrical and computer engineering programs and researchers or industry professionals in semiconductors and microelectronics. Explains the design of basic memory bit-cells including 6-transistor SRAM, 1-transistor-1-capacitor DRAM, and floating gate/charge trap FLASH transistor Examines the design of the peripheral circuits including the sense amplifier and array-level organization for the memory array Examines industry trends of memory technologies such as FinFET based SRAM, High-Bandwidth-Memory (HBM), 3D NAND Flash, and 3D X-point array Discusses the prospects and challenges of emerging memory technologies such as PCM, RRAM, STT-MRAM/SOT-MRAM and FeRAM/FeFET Explores the new applications such as in-memory computing for AI hardware acceleration.
Author: Riko Radojcic
Publisher: Springer
ISBN: 3319525484
Category : Technology & Engineering
Languages : en
Pages : 192
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Book Description
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.
Author: John H. Lau
Publisher: Springer Nature
ISBN: 9811613761
Category : Technology & Engineering
Languages : en
Pages : 513
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Book Description
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Author: John H. Lau
Publisher: Springer
ISBN: 9811372241
Category : Technology & Engineering
Languages : en
Pages : 381
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Book Description
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Author: Bruce Jacob
Publisher: Morgan Kaufmann
ISBN: 0080553842
Category : Computers
Languages : en
Pages : 1017
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Book Description
Is your memory hierarchy stopping your microprocessor from performing at the high level it should be? Memory Systems: Cache, DRAM, Disk shows you how to resolve this problem. The book tells you everything you need to know about the logical design and operation, physical design and operation, performance characteristics and resulting design trade-offs, and the energy consumption of modern memory hierarchies. You learn how to to tackle the challenging optimization problems that result from the side-effects that can appear at any point in the entire hierarchy.As a result you will be able to design and emulate the entire memory hierarchy. - Understand all levels of the system hierarchy -Xcache, DRAM, and disk. - Evaluate the system-level effects of all design choices. - Model performance and energy consumption for each component in the memory hierarchy.
Author: Tho T. Vu
Publisher: World Scientific
ISBN: 9812383115
Category : Technology & Engineering
Languages : en
Pages : 363
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Book Description
This is the book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. Contents: Present and Future of High-Speed Compound Semiconductor IC's (T Otsuji); Transforming MMIC (E J Martinez); Distributed Amplifier for Fiber-Optic Communication Systems (H Shigematsu et al.); Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers (S Manohar et al.); Radiation Effects in High Speed III-V Integrated Circuits (T R Weatherford); Radiation Effects in III-V Semiconductor Electronics (B D Weaver et al.); Reliability and Radiation Hardness of Compound Semiconductors (S A Kayali & A H Johnston); and other papers. Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.
Author: Manho Lee
Publisher: Springer
ISBN: 9789401779494
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Author:
Publisher:
ISBN: 9783030609405
Category : Computer architecture
Languages : en
Pages : 0
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Book Description
This book constitutes the refereed proceedings of the 20th International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation, SAMOS 2020, held in Samos, Greece, in July 2020.* The 16 regular papers presented were carefully reviewed and selected from 35 submissions. In addition, 9 papers from two special sessions were included, which were organized on topics of current interest: innovative architectures for security and European projects on embedded and high performance computing for health applications. * The conference was held virtually due to the COVID-19 pandemic.
Author: Chulwoo Kim
Publisher: Springer Science & Business Media
ISBN: 3319023810
Category : Technology & Engineering
Languages : en
Pages : 94
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Book Description
This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.
