Harmonized System of Quality Assessment for Electronic Components. Code of Practice for the Use of the Ppm Approach in Association with the CECC System PDF Download
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Author: British Standards Institute Staff
Publisher:
ISBN: 9780580164439
Category :
Languages : en
Pages : 20
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Book Description
Electronic equipment and components, Quality, Quality assurance systems, Quality assurance, Quality control, Statistical quality control, Assessed quality, Defect counting, Rejects, Fitness for purpose
Author: British Standards Institute Staff
Publisher:
ISBN: 9780580164439
Category :
Languages : en
Pages : 20
Get Book Here
Book Description
Electronic equipment and components, Quality, Quality assurance systems, Quality assurance, Quality control, Statistical quality control, Assessed quality, Defect counting, Rejects, Fitness for purpose
Author: British Standards Institution
Publisher:
ISBN:
Category :
Languages : en
Pages : 16
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Book Description
Author: Keith Brindley
Publisher: Elsevier
ISBN: 1483105377
Category : Technology & Engineering
Languages : en
Pages : 354
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Book Description
Newnes Electronics Assembly Handbook
Author: MIKE JUDD
Publisher: Elsevier
ISBN: 008051734X
Category : Technology & Engineering
Languages : en
Pages : 385
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Book Description
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. A practical guide for the industry covering all the main soldering processes currently in use Cleaning, faults, troubleshooting and standards are all major topics Considers safety and solder process quality assessment
Author:
Publisher:
ISBN:
Category : Catalogs, Publishers'
Languages : en
Pages : 990
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Book Description
Author:
Publisher:
ISBN:
Category : Catalogs, Publishers'
Languages : en
Pages : 1114
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Book Description
Author:
Publisher:
ISBN:
Category : Standardization
Languages : en
Pages : 1110
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Book Description
Author: British Standards Institute Staff
Publisher:
ISBN: 9780580234705
Category :
Languages : en
Pages : 28
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Book Description
Electronic equipment and components, Surfaces, Fixing, Assembling, Assessed quality, Quality assurance systems, Specification (approval), Approval testing, Inspection, Marking, Clearances, Soldering, Temperature, Cleaning, Classification systems, Testing conditions, Solderability testing, Test specimens, Accelerated testing, Shear testing, Bend testing
Author: British Standards Institute Staff
Publisher:
ISBN: 9780580203572
Category :
Languages : en
Pages : 16
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Book Description
Statistical quality control, Quality control, Statistical methods of analysis, Assessed quality, Process control, Quality assurance systems, Electronic equipment and components
Author:
Publisher:
ISBN:
Category : Catalogs, Publishers'
Languages : en
Pages : 1228
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Book Description
