Handbook of Thick Film Hybrid Microelectronics PDF Download
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Author: Charles A. Harper
Publisher: McGraw-Hill Companies
ISBN:
Category : Science
Languages : en
Pages : 712
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Book Description
Author: Charles A. Harper
Publisher: McGraw-Hill Companies
ISBN:
Category : Science
Languages : en
Pages : 712
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Book Description
Author: Tapan Gupta
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
This is the first handbook on the fabrication and design of hybrid microelectronic circuits. * Deals with all aspects of the technology, design, layout and processing of materials. * Fills the need for a comprehensive survey of a widely-used technology.
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Jerry C. Whitaker
Publisher: CRC Press
ISBN: 9780849383458
Category : Technology & Engineering
Languages : en
Pages : 2626
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Book Description
The superb organization of The Electronics Handbook means that it is not only a comprehensive and fascinating reference, but also a pleasure to use. Some of these organizational features include:
Author: Fred D. Barlow, III
Publisher: CRC Press
ISBN: 1420018965
Category : Technology & Engineering
Languages : en
Pages : 458
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Book Description
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 660
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Book Description
Author: Relva C. Buchanan
Publisher: CRC Press
ISBN: 1482293048
Category : Technology & Engineering
Languages : en
Pages : 693
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Book Description
The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.
Author: Donald M. Mattox
Publisher: William Andrew
ISBN: 0128130857
Category : Technology & Engineering
Languages : en
Pages : 383
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Book Description
The Foundations of Vacuum Coating Technology, Second Edition, is a revised and expanded version of the first edition, which was published in 2003. The book reviews the histories of the various vacuum coating technologies and expands on the history of the enabling technologies of vacuum technology, plasma technology, power supplies, and low-pressure plasma-enhanced chemical vapor deposition. The melding of these technologies has resulted in new processes and products that have greatly expanded the application of vacuum coatings for use in our everyday lives. The book is unique in that it makes extensive reference to the patent literature (mostly US) and how it relates to the history of vacuum coating. The book includes a Historical Timeline of Vacuum Coating Technology and a Historical Timeline of Vacuum/Plasma Technology, as well as a Glossary of Terms used in the vacuum coating and surface engineering industries. - History and detailed descriptions of Vacuum Deposition Technologies - Review of Enabling Technologies and their importance to current applications - Extensively referenced text - Patents are referenced as part of the history - Historical Timelines for Vacuum Coating Technology and Vacuum/Plasma Technology - Glossary of Terms for vacuum coating
Author: John L. B. Walker
Publisher: Cambridge University Press
ISBN: 0521760100
Category : Technology & Engineering
Languages : en
Pages : 705
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Book Description
This is a one-stop guide for circuit designers and system/device engineers, covering everything from CAD to reliability.
Author: William W. Sheng
Publisher: CRC Press
ISBN: 0203507304
Category : Technology & Engineering
Languages : en
Pages : 293
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Book Description
Designing and building power semiconductor modules requires a broad, interdisciplinary base of knowledge and experience, ranging from semiconductor materials and technologies, thermal management, and soldering to environmental constraints, inspection techniques, and statistical process control. This diversity poses a significant challenge to engine
