Guarded Hot Plate and Heat Flow Meter Methodology PDF Download
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Author: C. J. Shirtliffe
Publisher: ASTM International
ISBN: 9780803104235
Category : Technology & Engineering
Languages : en
Pages : 248
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Book Description
Author: C. J. Shirtliffe
Publisher: ASTM International
ISBN: 9780803104235
Category : Technology & Engineering
Languages : en
Pages : 248
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Book Description
Author: Iris Nandhakumar
Publisher: Royal Society of Chemistry
ISBN: 178262323X
Category : Science
Languages : en
Pages : 269
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Book Description
Authoritative account of recent developments in thermoelectric materials and devices for power energy harvesting applications, ideal for researchers and industrialists in materials science.
Author:
Publisher:
ISBN:
Category : Administrative law
Languages : en
Pages : 430
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Book Description
Author: D. L. McElroy
Publisher: ASTM International
ISBN: 0803112785
Category : Heat
Languages : en
Pages : 758
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Book Description
Proceedings of the symposium held in Bal Harbour, Florida, December 1987. Rising energy prices have been encouraging work on the use of thermal insulation to conserve energy. Here, more than 50 papers discuss new materials, assessments and properties of foams, loose-fill behavior, system performance
Author: José Ignacio Velasco
Publisher: MDPI
ISBN: 3039216325
Category : Science
Languages : en
Pages : 322
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Book Description
Advances in nanotechnology have boosted the development of more efficient materials, with emerging sectors (electronics, energy, aerospace, etc.) demanding novel materials to fulfill the complex technical requirements of their products. This is the case of polymeric foams, which may display good structural properties alongside functional characteristics through a complex composition and (micro)structure in which a gas phase is combined with rigid ones, mainly based on nanoparticles, dispersed throughout the polymer matrix. In recent years, there has been an important impulse in the development of nanocomposite foams, extending the concept of nanocomposites to the field of cellular materials. This, alongside developments in new advanced foaming technologies which have allowed the generation of foams with micro, sub-micro, and even nanocellular structures, has extended the applications of more traditional foams in terms of weight reduction, damping, and thermal and/or acoustic insulation to novel possibilities, such as electromagnetic interference (EMI) shielding. This Special Issue, which consists of a total of 22 articles, including one review article written by research groups of experts in the field, considers recent research on novel polymer-based foams in all their aspects: design, composition, processing and fabrication, microstructure, characterization and analysis, applications and service behavior, recycling and reuse, etc.
Author: André O. Desjarlais
Publisher: ASTM International
ISBN: 0803128983
Category : Insulating materials
Languages : en
Pages : 413
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Book Description
Author: Frank J. Powell
Publisher: ASTM International
ISBN: 0803104936
Category : Conferences
Languages : en
Pages : 750
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Book Description
Author: Kenneth E. Wilkes
Publisher: CRC Press
ISBN: 1000448479
Category : Technology & Engineering
Languages : en
Pages : 760
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Book Description
This book contains keynote lectures and 54 technical papers, presented at the 23rd International Thermal Conductivity Conference, on various topics, including techniques, coatings and films, theory, composites, fluids, metals, ceramics, and organics, related to thermal conductivity.
Author: Ronald S. Graves
Publisher: ASTM International
ISBN: 0803114206
Category : Attics
Languages : en
Pages : 647
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Book Description
Papers presented at the syposium of the same name held in Gatlinburg, Tennessee, October 1991, address issues connected with reflectives, radiant barriers, radiation control coatings; economics and energy impact; long-term thermal performance of foams; assessments and properties of foams; convection
Author: Xingcun Colin Tong
Publisher: Springer Science & Business Media
ISBN: 1441977597
Category : Technology & Engineering
Languages : en
Pages : 633
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Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
