Author: Inderjeet Kaur
Publisher:
ISBN:
Category : Dislocation in crystals
Languages : en
Pages :

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Book Description

Author: Inderjeet Kaur
Publisher: Wiley
ISBN: 9780471938194
Category : Technology & Engineering
Languages : en
Pages : 0

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Book Description
This book is the first comprehensive treatise of one of the key physical processes occurring in various materials at elevated temperatures. The book provides essential background information for materials scientists, metallurgists, solid state physicists and semiconductor technologists carrying out research or development in this and related areas. The first and second editions of the book were published by the University of Stuttgart in 1988 and 1989. In the present third edition the book has been updated and essentially enlarged to cover all recent developments in the area of grain and interphase boundary diffusion. The reader will find more than 100 new text pages, 60 new figures and 100 new references. This unique book is strongly recommended as a textbook for students as well as a reference book for physicists, chemists, metallurgists and engineers.

Author: Jörg Kärger
Publisher: Leipziger Universitätsverlag
ISBN: 9783865830739
Category :
Languages : en
Pages : 634

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Book Description

Author: Paul Heitjans
Publisher: Springer Science & Business Media
ISBN: 3540309705
Category : Science
Languages : en
Pages : 971

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Book Description
This comprehensive, handbook-style survey of diffusion in condensed matter gives detailed insight into diffusion as the process of particle transport due to stochastic movement. It is understood and presented as a phenomenon of crucial relevance for a large variety of processes and materials. In this book, all aspects of the theoretical fundamentals, experimental techniques, highlights of current developments and results for solids, liquids and interfaces are presented.

Author: Eric J. Mittemeijer
Publisher: Springer Nature
ISBN: 3030600564
Category : Technology & Engineering
Languages : en
Pages : 754

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Book Description
This textbook offers a strong introduction to the fundamental concepts of materials science. It conveys the quintessence of this interdisciplinary field, distinguishing it from merely solid-state physics and solid-state chemistry, using metals as model systems to elucidate the relation between microstructure and materials properties. Mittemeijer's Fundamentals of Materials Science provides a consistent treatment of the subject matter with a special focus on the microstructure-property relationship. Richly illustrated and thoroughly referenced, it is the ideal adoption for an entire undergraduate, and even graduate, course of study in materials science and engineering. It delivers a solid background against which more specialized texts can be studied, covering the necessary breadth of key topics such as crystallography, structure defects, phase equilibria and transformations, diffusion and kinetics, and mechanical properties. The success of the first edition has led to this updated and extended second edition, featuring detailed discussion of electron microscopy, supermicroscopy and diffraction methods, an extended treatment of diffusion in solids, and a separate chapter on phase transformation kinetics. “In a lucid and masterly manner, the ways in which the microstructure can affect a host of basic phenomena in metals are described.... By consistently staying with the postulated topic of the microstructure - property relationship, this book occupies a singular position within the broad spectrum of comparable materials science literature .... it will also be of permanent value as a reference book for background refreshing, not least because of its unique annotated intermezzi; an ambitious, remarkable work.” G. Petzow in International Journal of Materials Research. “The biggest strength of the book is the discussion of the structure-property relationships, which the author has accomplished admirably.... In a nutshell, the book should not be looked at as a quick ‘cook book’ type text, but as a serious, critical treatise for some significant time to come.” G.S. Upadhyaya in Science of Sintering. “The role of lattice defects in deformation processes is clearly illustrated using excellent diagrams . Included are many footnotes, ‘Intermezzos’, ‘Epilogues’ and asides within the text from the author’s experience. This ..... soon becomes valued for the interesting insights into the subject and shows the human side of its history. Overall this book provides a refreshing treatment of this important subject and should prove a useful addition to the existing text books available to undergraduate and graduate students and researchers in the field of materials science.” M. Davies in Materials World.

Author: Helmut Mehrer
Publisher: Springer Science & Business Media
ISBN: 354071488X
Category : Technology & Engineering
Languages : en
Pages : 645

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Book Description
This book describes the central aspects of diffusion in solids, and goes on to provide easy access to important information about diffusion in metals, alloys, semiconductors, ion-conducting materials, glasses and nanomaterials. Coverage includes diffusion-controlled phenomena including ionic conduction, grain-boundary and dislocation pipe diffusion. This book will benefit graduate students in such disciplines as solid-state physics, physical metallurgy, materials science, and geophysics, as well as scientists in academic and industrial research laboratories.

Author: Francois D'heurle
Publisher: World Scientific
ISBN: 9814492183
Category : Science
Languages : en
Pages : 390

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Book Description
Silicides were introduced into the technology of electronic devices some thirty years ago; since then, they have been continuously used to form both ohmic and rectifying contacts to silicon. Silicides are also important for other applications (thermoelectric devices and structural applications, such as jet engines), but it is not easy to find an updated reference containing both their basic properties, either chemical or physical, and the latest applications.The 16th Course of the International School of Solid State Physics, held in Erice (Italy) in the late spring of 1999, was intended to break artificial barriers between disciplines, and to gather people concerned with the properties and applications of silicides, regardless of the formal fields to which they belong, or of the practical goals they pursue. This book is therefore concerned with theory as well as applications, metallurgy as well as physics, and materials science as well as microelectronics.

Author: Yosi Shacham-Diamand
Publisher: Springer Science & Business Media
ISBN: 0387958681
Category : Science
Languages : en
Pages : 545

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Book Description
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Author: Yu R. Kolobov
Publisher: Cambridge Int Science Publishing
ISBN: 1904602177
Category : Technology & Engineering
Languages : en
Pages : 247

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Book Description
The authors examine the main relationships of the process of grain boundary diffusion in bicrystals, coarse-grained polycrystals and nanostructured materials. The results of investigations of diffusion-related processes of recovery, recystallisation and development of plastic deformation in creep, static and cyclic loading in bulk nanostructured materials produced by high-intensity plastic deformation are presented.

Author: Pavel Lejcek
Publisher: Springer Science & Business Media
ISBN: 3642125050
Category : Technology & Engineering
Languages : en
Pages : 249

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Book Description
Grain boundaries are important structural components of polycrystalline materials used in the vast majority of technical applications. Because grain boundaries form a continuous network throughout such materials, their properties may limit their practical use. One of the serious phenomena which evoke these limitations is the grain boundary segregation of impurities. It results in the loss of grain boundary cohesion and consequently, in brittle fracture of the materials. The current book deals with fundamentals of grain boundary segregation in metallic materials and its relationship to the grain boundary structure, classification and other materials properties.