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Author: Ahmad Reza Tavakoli Hosseinabadi
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
A fully integrated CMOS 0 0́3 900 phase shifter in 0.18um TSMC technology is presented. With the increasing use of wireless systems in GHz range, there is high demand for integrated phase shifters in phased arrays and MIMO on chip systems. Integrated phase shifters have quite a high number of integrated inductors which consume a lot of area and introduce a huge amount of loss which make them impractical for on chip applications. Also tuning the phase shift is another concern which seems difficult with use of passive elements for integrated applications. This work is presents a new method for implementing phase shifters using only active CMOS elements which dramatically reduce the occupied area and make the tuning feasible. Also a fully integrated millimeter-wave VCO is implemented using the same technology. This VCO can be part of a 24 GHz frequency synthesizer for 24 GHz ISM band transceivers. The 24 GHz ISM band is the unlicensed band and available for commercial communication and automotive radar use, which is becoming attractive for high bandwidth data rate.
Author: Ahmad Reza Tavakoli Hosseinabadi
Publisher:
ISBN:
Category :
Languages : en
Pages :
Get Book Here
Book Description
A fully integrated CMOS 0 0́3 900 phase shifter in 0.18um TSMC technology is presented. With the increasing use of wireless systems in GHz range, there is high demand for integrated phase shifters in phased arrays and MIMO on chip systems. Integrated phase shifters have quite a high number of integrated inductors which consume a lot of area and introduce a huge amount of loss which make them impractical for on chip applications. Also tuning the phase shift is another concern which seems difficult with use of passive elements for integrated applications. This work is presents a new method for implementing phase shifters using only active CMOS elements which dramatically reduce the occupied area and make the tuning feasible. Also a fully integrated millimeter-wave VCO is implemented using the same technology. This VCO can be part of a 24 GHz frequency synthesizer for 24 GHz ISM band transceivers. The 24 GHz ISM band is the unlicensed band and available for commercial communication and automotive radar use, which is becoming attractive for high bandwidth data rate.
Author: Jaco du Preez
Publisher: Springer
ISBN: 3319350684
Category : Technology & Engineering
Languages : en
Pages : 165
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Book Description
This book comprehensively reviews the state of the art in millimeter-wave antennas, traces important recent developments and provides information on a wide range of antenna configurations and applications. While fundamental theoretical aspects are discussed whenever necessary, the book primarily focuses on design principles and concepts, manufacture, measurement techniques, and practical results. Each of the various antenna types scalable to millimeter-wave dimensions is considered individually, with coverage of leaky-wave and surface-wave antennas, printed antennas, integrated antennas, and reflector and lens systems. The final two chapters address the subject from a systems perspective, providing an overview of supporting circuitry and examining in detail diverse millimeter-wave applications, including high-speed wireless communications, radio astronomy, and radar. The vast amount of information now available on millimeter-wave systems can be daunting for researchers and designers entering the field. This book offers readers essential guidance, helping them to gain a thorough understanding based on the most recent research findings and serving as a sound basis for informed decision-making.
Author: Gabriel M. Rebeiz
Publisher: John Wiley & Sons
ISBN: 0471462888
Category : Technology & Engineering
Languages : en
Pages : 512
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Book Description
Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.
Author: Sorin Voinigescu
Publisher: Cambridge University Press
ISBN: 0521873029
Category : Technology & Engineering
Languages : en
Pages : 921
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Book Description
A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave, and optical fibre circuits using nanoscale CMOS, SiGe BiCMOS, and III-V technologies. Step-by-step design methodologies, end-of chapter problems, and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.
Author: Andreas F. Molisch
Publisher: John Wiley & Sons
ISBN: 1118355687
Category : Technology & Engineering
Languages : en
Pages : 883
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Book Description
"Professor Andreas F. Molisch, renowned researcher and educator, has put together the comprehensive book, Wireless Communications. The second edition, which includes a wealth of new material on important topics, ensures the role of the text as the key resource for every student, researcher, and practitioner in the field." —Professor Moe Win, MIT, USA Wireless communications has grown rapidly over the past decade from a niche market into one of the most important, fast moving industries. Fully updated to incorporate the latest research and developments, Wireless Communications, Second Edition provides an authoritative overview of the principles and applications of mobile communication technology. The author provides an in-depth analysis of current treatment of the area, addressing both the traditional elements, such as Rayleigh fading, BER in flat fading channels, and equalisation, and more recently emerging topics such as multi-user detection in CDMA systems, MIMO systems, and cognitive radio. The dominant wireless standards; including cellular, cordless and wireless LANs; are discussed. Topics featured include: wireless propagation channels, transceivers and signal processing, multiple access and advanced transceiver schemes, and standardised wireless systems. Combines mathematical descriptions with intuitive explanations of the physical facts, enabling readers to acquire a deep understanding of the subject. Includes new chapters on cognitive radio, cooperative communications and relaying, video coding, 3GPP Long Term Evolution, and WiMax; plus significant new sections on multi-user MIMO, 802.11n, and information theory. Companion website featuring: supplementary material on 'DECT', solutions manual and presentation slides for instructors, appendices, list of abbreviations and other useful resources.
Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556635
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: Kiyoo Itoh
Publisher: Springer Science & Business Media
ISBN: 0387688536
Category : Technology & Engineering
Languages : en
Pages : 351
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Book Description
Ultra-low voltage large-scale integrated circuits (LSIs) in nano-scale technologies are needed both to meet the needs of a rapidly growing mobile cell phone market and to offset a significant increase in the power dissipation of high-end microprocessor units. The goal of this book is to provide a detailed explanation of the state-of-the-art nanometer and sub-1-V memory LSIs that are playing decisive roles in power conscious systems. Emerging problems between the device, circuit, and system levels are systematically discussed in terms of reliable high-speed operations of memory cells and peripheral logic circuits. The effectiveness of solutions at device and circuit levels is also described at length through clarifying noise components in an array, and even essential differences in ultra-low voltage operations between DRAMs and SRAMs.
Author: Roger Woods
Publisher: John Wiley & Sons
ISBN: 1119077958
Category : Technology & Engineering
Languages : en
Pages : 356
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Book Description
An important working resource for engineers and researchers involved in the design, development, and implementation of signal processing systems The last decade has seen a rapid expansion of the use of field programmable gate arrays (FPGAs) for a wide range of applications beyond traditional digital signal processing (DSP) systems. Written by a team of experts working at the leading edge of FPGA research and development, this second edition of FPGA-based Implementation of Signal Processing Systems has been extensively updated and revised to reflect the latest iterations of FPGA theory, applications, and technology. Written from a system-level perspective, it features expert discussions of contemporary methods and tools used in the design, optimization and implementation of DSP systems using programmable FPGA hardware. And it provides a wealth of practical insights—along with illustrative case studies and timely real-world examples—of critical concern to engineers working in the design and development of DSP systems for radio, telecommunications, audio-visual, and security applications, as well as bioinformatics, Big Data applications, and more. Inside you will find up-to-date coverage of: FPGA solutions for Big Data Applications, especially as they apply to huge data sets The use of ARM processors in FPGAs and the transfer of FPGAs towards heterogeneous computing platforms The evolution of High Level Synthesis tools—including new sections on Xilinx's HLS Vivado tool flow and Altera's OpenCL approach Developments in Graphical Processing Units (GPUs), which are rapidly replacing more traditional DSP systems FPGA-based Implementation of Signal Processing Systems, 2nd Edition is an indispensable guide for engineers and researchers involved in the design and development of both traditional and cutting-edge data and signal processing systems. Senior-level electrical and computer engineering graduates studying signal processing or digital signal processing also will find this volume of great interest.
Author: IEEE Staff
Publisher:
ISBN: 9781665430364
Category :
Languages : en
Pages :
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Book Description
The conference will be geared for students as well as young researchers and is co sponsored by the IEEE Electron Devices Society (EDS) Its main goal is to bring together specialists from all Electron Device related fields We are convinced that thanks to your significant accomplishments your presence will significantly add to the value of this growing conference
Author: Biswanath Mukherjee
Publisher: Springer Nature
ISBN: 3030162508
Category : Technology & Engineering
Languages : en
Pages : 1169
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Book Description
This handbook is an authoritative, comprehensive reference on optical networks, the backbone of today’s communication and information society. The book reviews the many underlying technologies that enable the global optical communications infrastructure, but also explains current research trends targeted towards continued capacity scaling and enhanced networking flexibility in support of an unabated traffic growth fueled by ever-emerging new applications. The book is divided into four parts: Optical Subsystems for Transmission and Switching, Core Networks, Datacenter and Super-Computer Networking, and Optical Access and Wireless Networks. Each chapter is written by world-renown experts that represent academia, industry, and international government and regulatory agencies. Every chapter provides a complete picture of its field, from entry-level information to a snapshot of the respective state-of-the-art technologies to emerging research trends, providing something useful for the novice who wants to get familiar with the field to the expert who wants to get a concise view of future trends.
