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Author: Jitendra B Khare
Publisher:
ISBN: 9781461313786
Category :
Languages : en
Pages : 172
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Book Description
Author: Jitendra B Khare
Publisher:
ISBN: 9781461313786
Category :
Languages : en
Pages : 172
Get Book Here
Book Description
Author: Jitendra B. Khare
Publisher: Springer Science & Business Media
ISBN: 1461313775
Category : Technology & Engineering
Languages : en
Pages : 162
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Book Description
Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing. From Contamination to Defects, Faults and Yield Loss: Simulation and Applications focuses on the core of the interface between manufacturing and testing, i.e., the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modeling and design manufacturing.
Author: Stephen W. Director
Publisher: Springer Science & Business Media
ISBN: 1461315212
Category : Technology & Engineering
Languages : en
Pages : 299
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Book Description
One of the keys to success in the IC industry is getting a new product to market in a timely fashion and being able to produce that product with sufficient yield to be profitable. There are two ways to increase yield: by improving the control of the manufacturing process and by designing the process and the circuits in such a way as to minimize the effect of the inherent variations of the process on performance. The latter is typically referred to as "design for manufacture" or "statistical design". As device sizes continue to shrink, the effects of the inherent fluctuations in the IC fabrication process will have an even more obvious effect on circuit performance. And design for manufacture will increase in importance. We have been working in the area of statistically based computer aided design for more than 13 years. During the last decade we have been working with each other, and individually with our students, to develop methods and CAD tools that can be used to improve yield during the design and manufacturing phases of IC realization. This effort has resulted in a large number of publications that have appeared in a variety of journals and conference proceedings. Thus our motivation in writing this book is to put, in one place, a description of our approach to IC yield enhancement. While the work that is contained in this book has appeared in the open literature, we have attempted to use a consistent notation throughout this book.
Author: Xiaolei Li
Publisher:
ISBN:
Category : Contamination (Technology)
Languages : en
Pages : 12
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Book Description
Abstract: "Particulate contamination deposited on silicon wafers is typically the dominant reason for yield loss in VLSI manufacturing. The transformation of contaminating particles into defects and then electrical faults is a very complex process which depends on the defect location, size, material and the underlying IC topography. A rigorous topography simulator, METROPOLE, has been developed to allow the prediction and correlation of the critical physical parameters (material, size and location) of contamination in the manufacturing process to device defects. The results for a large number of defect samples simulated using the above approach were compared with data gathered from the AMD-Sunnyvale fabline. A good match was obtained indicating the accuracy of this method which provided a framework for developing contamination to defect propagation/growth macromodels. We have demonstrated that the understanding of defect transformation can be applied to early yield impact prediction."
Author: C.H. Stapper
Publisher: Springer Science & Business Media
ISBN: 1475799578
Category : Technology & Engineering
Languages : en
Pages : 313
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Book Description
Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an "International Workshop on Designing for Yield" at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the "IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems" in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.
Author: Hans-Joachim Wunderlich
Publisher: Springer Science & Business Media
ISBN: 9048132827
Category : Computers
Languages : en
Pages : 263
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Book Description
Model based testing is the most powerful technique for testing hardware and software systems. Models in Hardware Testing describes the use of models at all the levels of hardware testing. The relevant fault models for nanoscaled CMOS technology are introduced, and their implications on fault simulation, automatic test pattern generation, fault diagnosis, memory testing and power aware testing are discussed. Models and the corresponding algorithms are considered with respect to the most recent state of the art, and they are put into a historical context by a concluding chapter on the use of physical fault models in fault tolerance.
Author: Alfredo Benso
Publisher: Springer Science & Business Media
ISBN: 030648711X
Category : Technology & Engineering
Languages : en
Pages : 242
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Book Description
This is a comprehensive guide to fault injection techniques used to evaluate the dependability of a digital system. The description and the critical analysis of different fault injection techniques and tools are authored by key scientists in the field of system dependability and fault tolerance.
Author: Manoj Sachdev
Publisher: Springer Science & Business Media
ISBN: 0387465472
Category : Technology & Engineering
Languages : en
Pages : 343
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Book Description
The 2nd edition of defect oriented testing has been extensively updated. New chapters on Functional, Parametric Defect Models and Inductive fault Analysis and Yield Engineering have been added to provide a link between defect sources and yield. The chapter on RAM testing has been updated with focus on parametric and SRAM stability testing. Similarly, newer material has been incorporated in digital fault modeling and analog testing chapters. The strength of Defect Oriented Testing for nano-Metric CMOS VLSIs lies in its industrial relevance.
Author: Angela Krstic
Publisher: Springer Science & Business Media
ISBN: 1461555973
Category : Technology & Engineering
Languages : en
Pages : 201
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Book Description
In the early days of digital design, we were concerned with the logical correctness of circuits. We knew that if we slowed down the clock signal sufficiently, the circuit would function correctly. With improvements in the semiconductor process technology, our expectations on speed have soared. A frequently asked question in the last decade has been how fast can the clock run. This puts significant demands on timing analysis and delay testing. Fueled by the above events, a tremendous growth has occurred in the research on delay testing. Recent work includes fault models, algorithms for test generation and fault simulation, and methods for design and synthesis for testability. The authors of this book, Angela Krstic and Tim Cheng, have personally contributed to this research. Now they do an even greater service to the profession by collecting the work of a large number of researchers. In addition to expounding such a great deal of information, they have delivered it with utmost clarity. To further the reader's understanding many key concepts are illustrated by simple examples. The basic ideas of delay testing have reached a level of maturity that makes them suitable for practice. In that sense, this book is the best x DELAY FAULT TESTING FOR VLSI CIRCUITS available guide for an engineer designing or testing VLSI systems. Tech niques for path delay testing and for use of slower test equipment to test high-speed circuits are of particular interest.
Author: Manoj Sachdev
Publisher: Springer Science & Business Media
ISBN: 1475749260
Category : Technology & Engineering
Languages : en
Pages : 317
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Book Description
Defect oriented testing is expected to play a significant role in coming generations of technology. Smaller feature sizes and larger die sizes will make ICs more sensitive to defects that can not be modeled by traditional fault modeling approaches. Furthermore, with increased level of integration, an IC may contain diverse building blocks. Such blocks include, digital logic, PLAs, volatile and non-volatile memories, and analog interfaces. For such diverse building blocks, traditional fault modeling and test approaches will become increasingly inadequate. Defect oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits (ICs) have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of highest possible quality. Testing, in general and, defect oriented testing, in particular, help in realizing these objectives. Defect Oriented Testing for CMOS Analog and Digital Circuits is the first book to provide a complete overview of the subject. It is essential reading for all design and test professionals as well as researchers and students working in the field. `A strength of this book is its breadth. Types of designs considered include analog and digital circuits, programmable logic arrays, and memories. Having a fault model does not automatically provide a test. Sometimes, design for testability hardware is necessary. Many design for testability ideas, supported by experimental evidence, are included.' ... from the Foreword by Vishwani D. Agrawal
