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Author: Geoffrey Momanyi
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 0
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Book Description
Metal oxide semiconductor materials such as tungsten oxide are promising candidates for use as photoanodes in solar water splitting. Tungsten oxide is an n-type semiconductor that was prepared on stainless steel 304 substrate and subsequently studied for water-splitting applications. This study investigated the effect of the annealing temperature and substrate cleaning reagents on the photoelectrochemical (PEC) properties of tungsten oxide thin films. The main method of synthesis employed was the sol-gel method. Tungsten oxide thin films were deposited from a precursor solution of peroxotungstic acid by doctor blading. The as-deposited amorphous WO3 films were further subjected to heat treatment at various annealing temperatures (200 °C, 300 °C, 400 °C, and 500 °C) to transform the amorphous material into polycrystalline WO3 nanostructures. Surface morphology, the crystallinity of the film, the thickness of the film, and photoelectrochemical properties were investigated using scanning electron microscopy, (SEM), X-ray diffractometry (XRD), stylus profilometry, cyclic voltammetry (CV), and linear sweep voltammetry (LSV). The optimal WO3 film, at a thickness of 5 μm and annealed at 400 °C, achieved a photocurrent density of 98.0 μA/cm2 at an applied voltage of 0.53 V vs Ag/AgCl. It is essential to treat the substrate with HNO3 to passivate the surface of the stainless-steel substrate with the Cr2O3 layer.
Author: Geoffrey Momanyi
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 0
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Book Description
Metal oxide semiconductor materials such as tungsten oxide are promising candidates for use as photoanodes in solar water splitting. Tungsten oxide is an n-type semiconductor that was prepared on stainless steel 304 substrate and subsequently studied for water-splitting applications. This study investigated the effect of the annealing temperature and substrate cleaning reagents on the photoelectrochemical (PEC) properties of tungsten oxide thin films. The main method of synthesis employed was the sol-gel method. Tungsten oxide thin films were deposited from a precursor solution of peroxotungstic acid by doctor blading. The as-deposited amorphous WO3 films were further subjected to heat treatment at various annealing temperatures (200 °C, 300 °C, 400 °C, and 500 °C) to transform the amorphous material into polycrystalline WO3 nanostructures. Surface morphology, the crystallinity of the film, the thickness of the film, and photoelectrochemical properties were investigated using scanning electron microscopy, (SEM), X-ray diffractometry (XRD), stylus profilometry, cyclic voltammetry (CV), and linear sweep voltammetry (LSV). The optimal WO3 film, at a thickness of 5 μm and annealed at 400 °C, achieved a photocurrent density of 98.0 μA/cm2 at an applied voltage of 0.53 V vs Ag/AgCl. It is essential to treat the substrate with HNO3 to passivate the surface of the stainless-steel substrate with the Cr2O3 layer.
Author: Xiao-Yu Yang
Publisher: John Wiley & Sons
ISBN: 1119580471
Category : Science
Languages : en
Pages : 636
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Book Description
This book provides the latest research & developments and future trends in photoenergy and thin film materials—two important areas that have the potential to spearhead the future of the industry. Photoenergy materials are expected to be a next generation class of materials to provide secure, safe, sustainable and affordable energy. Photoenergy devices are known to convert the sunlight into electricity. These types of devices are simple in design with a major advantage as they are stand-alone systems able to provide megawatts of power. They have been applied as a power source for solar home systems, remote buildings, water pumping, megawatt scale power plants, satellites, communications, and space vehicles. With such a list of enormous applications, the demand for photoenergy devices is growing every year. On the other hand, thin films coating, which can be defined as the barriers of surface science, the fields of materials science and applied physics are progressing as a unified discipline of scientific industry. A thin film can be termed as a very fine, or thin layer of material coated on a particular surface, that can be in the range of a nanometer in thickness to several micrometers in size. Thin films are applied in numerous areas ranging from protection purposes to electronic semiconductor devices. The 16 chapters in this volume, all written by subject matter experts, demonstrate the claim that both photoenergy and thin film materials have the potential to be the future of industry.
Author: Chi Dong Park
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
ABSTRACT: This dissertation is comprised with two main research projects: fabrication of thin films through an epoxide-catalyzed sol-gel process, and the dynamics of the photothermal initiation of Al/Fe2O3 metastable interstitial composite (MIC) materials.
Author: Per A. Askeland
Publisher:
ISBN:
Category : Metal catalysts
Languages : en
Pages : 260
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Book Description
Author:
Publisher: Academic Press
ISBN: 008054293X
Category : Science
Languages : en
Pages : 268
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Book Description
This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips.For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verified numerical models that provide in-depth insight into the design and operation I-PVD tools.Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference.Key Features:The first comprehensive volume on ionized physical vapor depositionCombines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVDEmphasizes practical applications in the area of IC fabrication and interconnect technologyServes as a guide to select the most appropriate technology for any deposition application*This single source saves time and effort by including comprehensive information at one's finger tips*The integration of tool design, process development, and fundamental physics allows the reader to quickly understand all of the issues important to I-PVD*The numerous practical applications assist the working engineer to select and refine thin film processes
Author: Y. Djaoued
Publisher:
ISBN:
Category :
Languages : en
Pages : 8
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Book Description
Author:
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2676
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Book Description
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 704
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Book Description
Author: Thokozani Mpanza
Publisher:
ISBN:
Category : Gas sensing mechanism
Languages : en
Pages : 81
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Book Description
Author: John B. Wachtman
Publisher: John Wiley & Sons
ISBN: 0470315210
Category : Technology & Engineering
Languages : en
Pages : 477
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Book Description
This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.
