Author: Kien Mun Lau
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Fabrication and Characterization of High Frequency Devices for Monolithic Microwave Integrated Circuits (MMICs)
Author: Kien Mun Lau
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Advances in Monolithic Microwave Integrated Circuits for Wireless Systems: Modeling and Design Technologies
Author: Marzuki, Arjuna
Publisher: IGI Global
ISBN: 1605668877
Category : Technology & Engineering
Languages : en
Pages : 380
Book Description
Monolithic Microwave Integrated Circuit (MMIC) is an electronic device that is widely used in all high frequency wireless systems. In developing MMIC as a product, understanding analysis and design techniques, modeling, measurement methodology, and current trends are essential.Advances in Monolithic Microwave Integrated Circuits for Wireless Systems: Modeling and Design Technologies is a central source of knowledge on MMIC development, containing research on theory, design, and practical approaches to integrated circuit devices. This book is of interest to researchers in industry and academia working in the areas of circuit design, integrated circuits, and RF and microwave, as well as anyone with an interest in monolithic wireless device development.
Publisher: IGI Global
ISBN: 1605668877
Category : Technology & Engineering
Languages : en
Pages : 380
Book Description
Monolithic Microwave Integrated Circuit (MMIC) is an electronic device that is widely used in all high frequency wireless systems. In developing MMIC as a product, understanding analysis and design techniques, modeling, measurement methodology, and current trends are essential.Advances in Monolithic Microwave Integrated Circuits for Wireless Systems: Modeling and Design Technologies is a central source of knowledge on MMIC development, containing research on theory, design, and practical approaches to integrated circuit devices. This book is of interest to researchers in industry and academia working in the areas of circuit design, integrated circuits, and RF and microwave, as well as anyone with an interest in monolithic wireless device development.
Fabrication and Characterization of Monolithic Microwave Integrated Circuits
Author: Herbert Michael Harris
Publisher:
ISBN:
Category : Electronic circuits
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category : Electronic circuits
Languages : en
Pages :
Book Description
MMIC--monolithic Microwave Integrated Circuits
Author: Yasuo Mitsui
Publisher: CRC Press
ISBN: 9782881242861
Category : Microwave integrated circuits
Languages : en
Pages : 144
Book Description
Status of GaAs MMIC developmental and technological trends and several application areas during the last five years are covered. Section one deals with the status of active and passive elements typically used in monolithic ICs. Section two introduces a considerable number of up- to-date circuit and subsystem examples. Acidic paper. Book club price $28. Annotation copyrighted by Book News, Inc., Portland, OR
Publisher: CRC Press
ISBN: 9782881242861
Category : Microwave integrated circuits
Languages : en
Pages : 144
Book Description
Status of GaAs MMIC developmental and technological trends and several application areas during the last five years are covered. Section one deals with the status of active and passive elements typically used in monolithic ICs. Section two introduces a considerable number of up- to-date circuit and subsystem examples. Acidic paper. Book club price $28. Annotation copyrighted by Book News, Inc., Portland, OR
Characterization of Vertical Interconnects in 3-D Monolithic Microwave Integrated Circuits (3-D MMIC)
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
In this research, a unique fabrication technology to build high-aspect-ratio via interconnects in 3D MMIC multilayer integration was developed from a combination of microelectronic and traditional MEMS microfabrication technologies. Based on these techniques, a set of test structures have been successfully fabricated to facilitate the vertical interconnect characterization. Fully cured polyimide thin films possess favorable electric and mechanical properties for the 3D MMIC applications. Using quarter wavelength T-junction resonator structure, polyimide was characterized for its microwave properties. High-frequency characterization of polyimide thin films was obtained in a wide frequency range. Experimental results have shown the feasibility of this method. In order to correctly evaluate the conductor loss in thin planar transmission lines, a modified conductor loss model was derived from conventional Wheeler's incremental inductance rule to account for the field penetration as the physical strip thickness approaches the skin depth or even smaller. The closed-form formulas or simplified equations have been developed for microstrip and stripline with wide strip cases, and for general coplanar waveguide including SCPWG line. Meanwhile, experimental results verified the validity of the modified conductor loss model in evaluating the losses in thin transmission lines. It has been shown that as the conductor thickness becomes approximately greater than four times of the skin depth, both conventional Wheeler's rule and its modified model agree with each other very well on the conductor loss estimation. Experimental results have revealed that at RF frequency, e.g. X band (8-12 GHz), the vertical interconnection discontinuities may contribute significantly to the insertion loss and the phase change. With the advanced conductor loss models for evaluating the characteristics in the test structures, lumped-element equivalent circuit models can be derived from the via module measurement results. These models are of great practical importance in a complex circuit design.
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
In this research, a unique fabrication technology to build high-aspect-ratio via interconnects in 3D MMIC multilayer integration was developed from a combination of microelectronic and traditional MEMS microfabrication technologies. Based on these techniques, a set of test structures have been successfully fabricated to facilitate the vertical interconnect characterization. Fully cured polyimide thin films possess favorable electric and mechanical properties for the 3D MMIC applications. Using quarter wavelength T-junction resonator structure, polyimide was characterized for its microwave properties. High-frequency characterization of polyimide thin films was obtained in a wide frequency range. Experimental results have shown the feasibility of this method. In order to correctly evaluate the conductor loss in thin planar transmission lines, a modified conductor loss model was derived from conventional Wheeler's incremental inductance rule to account for the field penetration as the physical strip thickness approaches the skin depth or even smaller. The closed-form formulas or simplified equations have been developed for microstrip and stripline with wide strip cases, and for general coplanar waveguide including SCPWG line. Meanwhile, experimental results verified the validity of the modified conductor loss model in evaluating the losses in thin transmission lines. It has been shown that as the conductor thickness becomes approximately greater than four times of the skin depth, both conventional Wheeler's rule and its modified model agree with each other very well on the conductor loss estimation. Experimental results have revealed that at RF frequency, e.g. X band (8-12 GHz), the vertical interconnection discontinuities may contribute significantly to the insertion loss and the phase change. With the advanced conductor loss models for evaluating the characteristics in the test structures, lumped-element equivalent circuit models can be derived from the via module measurement results. These models are of great practical importance in a complex circuit design.
Micro- and Nanotechnology for Space Systems
Author: Henry Helvajian
Publisher: AIAA
ISBN: 9781884989049
Category : Science
Languages : en
Pages : 144
Book Description
Microengineering and microelectromechanical systems (MEMS) are a subject of considerable current interest involving research and development throughout the world. This first volume of a series on this topic reviews and evaluates micro- and nanotechnologies applicable to U.S. Air Force and commercial space systems. It introduces the concept of application-specific integrated microinstrument (ASIM), an intelligent microinstrument.
Publisher: AIAA
ISBN: 9781884989049
Category : Science
Languages : en
Pages : 144
Book Description
Microengineering and microelectromechanical systems (MEMS) are a subject of considerable current interest involving research and development throughout the world. This first volume of a series on this topic reviews and evaluates micro- and nanotechnologies applicable to U.S. Air Force and commercial space systems. It introduces the concept of application-specific integrated microinstrument (ASIM), an intelligent microinstrument.
Characterization of MMIC (Monolithic Microwave Integrated Circuit) Devices for Active Array Antennas
Author: J. Smetana
Publisher:
ISBN:
Category :
Languages : en
Pages : 24
Book Description
It has become evident from NASA's active array technology development activities that more attention to the characterization of MMIC devices is needed. Having been fabricated using lithographic techniques, the MMIC has some inherently reproducible RF characteristics. NASA is currently sponsoring studies by the University of Illinois to investigate certain aspects of MMIC interconnectivity. These investigations are expected to contribute to a data base that will lead to providing for reproducible test results by the user as well as the manufacturer. Some considerations are proposed that lead to preserving the inherently reproducible characteristics of the MMIC. It is highlighted that at frequencies greater than 20 GHz, the transition from the MMIC device to other transmission media must be an accurate RF match. It is proposed that the RF match is sufficiently critical to include the transition as part of the delivered MMIC package. The model for analyzing several transitions will be presented. This model consists of a succesion of abrupt discontinuities in printed circuit transmission lines. The analysis of these discontinuities is achieved to generate the generalized S-parameters of the individual discontinuities. Preliminary results achieved with this method are presented.
Publisher:
ISBN:
Category :
Languages : en
Pages : 24
Book Description
It has become evident from NASA's active array technology development activities that more attention to the characterization of MMIC devices is needed. Having been fabricated using lithographic techniques, the MMIC has some inherently reproducible RF characteristics. NASA is currently sponsoring studies by the University of Illinois to investigate certain aspects of MMIC interconnectivity. These investigations are expected to contribute to a data base that will lead to providing for reproducible test results by the user as well as the manufacturer. Some considerations are proposed that lead to preserving the inherently reproducible characteristics of the MMIC. It is highlighted that at frequencies greater than 20 GHz, the transition from the MMIC device to other transmission media must be an accurate RF match. It is proposed that the RF match is sufficiently critical to include the transition as part of the delivered MMIC package. The model for analyzing several transitions will be presented. This model consists of a succesion of abrupt discontinuities in printed circuit transmission lines. The analysis of these discontinuities is achieved to generate the generalized S-parameters of the individual discontinuities. Preliminary results achieved with this method are presented.
University of Michigan Official Publication
Author: University of Michigan
Publisher: UM Libraries
ISBN:
Category : Education, Higher
Languages : en
Pages : 822
Book Description
Each number is the catalogue of a specific school or college of the University.
Publisher: UM Libraries
ISBN:
Category : Education, Higher
Languages : en
Pages : 822
Book Description
Each number is the catalogue of a specific school or college of the University.
Chemical Abstracts
Author:
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2540
Book Description
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2540
Book Description
Microwave Integrated Circuits
Author: Konishi
Publisher: CRC Press
ISBN: 9780824781996
Category : Technology & Engineering
Languages : en
Pages : 628
Book Description
Presents to a wide range of students and engineers up-to-date techniques of MICs, with readily comprehensible explanations, providing a unified description of MICs, clarifying physical content, including sufficient data to be directly useful to active engineers, and providing a path of entry into th
Publisher: CRC Press
ISBN: 9780824781996
Category : Technology & Engineering
Languages : en
Pages : 628
Book Description
Presents to a wide range of students and engineers up-to-date techniques of MICs, with readily comprehensible explanations, providing a unified description of MICs, clarifying physical content, including sufficient data to be directly useful to active engineers, and providing a path of entry into th