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Author: Dwight Cooke
Publisher:
ISBN:
Category : Ebullition
Languages : en
Pages : 152
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Book Description
"Pool boiling is of interest in heat transfer applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is still not comparable to the cooling ability provided by enhanced microchannels operating under single-phase conditions. This investigation focuses on the bubble dynamics and heat transfer on plain and structured microchanneled surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism through the use of a high speed camera. In a preliminary study, silicon chips have been tested in the nucleate boiling regime, and beneficial microchannel geometries have been identified. It is determined that heat transfer enhancement occurs because of (i) an increase in surface area and (ii) an improvement in the heat transfer mechanism through the channels functioning as liquid conduits for three side heating. The range for channel size in which the greatest enhancement occurs has been identified as being 200 - 400 [micron] width and 300 - 500 [micron] depth. The second study has been investigated with copper chips, with improvements to the test setup for accurate measurement of surface temperature. Ten chips, in addition to a plain chip have been evaluated for heat transfer performance. It has been determined that surfaces with many, small hydraulic diameter channels enhance the heat transfer as well as surfaces with wide and deep channels. The best performing chip had a record heat transfer coefficient of 269 kW/m2K. The large heat fluxes of over 240 W/cm2 were attained without reaching the critical heat flux condition, because of the open channels on the surface acting as conduits for liquid supply to the nucleation sites. The microchannels prevent surface dryout and critical heat flux (CHF), while the channel width controls the size of the departing bubbles."--Abstract.
Author: Dwight Cooke
Publisher:
ISBN:
Category : Ebullition
Languages : en
Pages : 152
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Book Description
"Pool boiling is of interest in heat transfer applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is still not comparable to the cooling ability provided by enhanced microchannels operating under single-phase conditions. This investigation focuses on the bubble dynamics and heat transfer on plain and structured microchanneled surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism through the use of a high speed camera. In a preliminary study, silicon chips have been tested in the nucleate boiling regime, and beneficial microchannel geometries have been identified. It is determined that heat transfer enhancement occurs because of (i) an increase in surface area and (ii) an improvement in the heat transfer mechanism through the channels functioning as liquid conduits for three side heating. The range for channel size in which the greatest enhancement occurs has been identified as being 200 - 400 [micron] width and 300 - 500 [micron] depth. The second study has been investigated with copper chips, with improvements to the test setup for accurate measurement of surface temperature. Ten chips, in addition to a plain chip have been evaluated for heat transfer performance. It has been determined that surfaces with many, small hydraulic diameter channels enhance the heat transfer as well as surfaces with wide and deep channels. The best performing chip had a record heat transfer coefficient of 269 kW/m2K. The large heat fluxes of over 240 W/cm2 were attained without reaching the critical heat flux condition, because of the open channels on the surface acting as conduits for liquid supply to the nucleation sites. The microchannels prevent surface dryout and critical heat flux (CHF), while the channel width controls the size of the departing bubbles."--Abstract.
Author: R. C. Noyes
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 42
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Book Description
Author:
Publisher: Springer
ISBN: 9783319266947
Category : Science
Languages : en
Pages : 0
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Book Description
This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena.
Author: Satish Kandlikar
Publisher: Elsevier
ISBN: 9780080445274
Category : Science
Languages : en
Pages : 492
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Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Author: N. Zuber
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 216
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Author: Aniket M. Rishi
Publisher:
ISBN:
Category : Ebullition
Languages : en
Pages : 194
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Book Description
"The miniaturization of electronic devices requires advanced thermal management techniques. The two-phase heat transfer process offers more effective and sustainable approach compared to the presently used single-phase cooling techniques. The boiling heat transfer is a two-phase cooling technique, that dissipates a high heat flux while maintaining the low surface temperature thereby, offering an efficient heat transfer mechanism compared to the single-phase process. Furthermore, the surface enhancement techniques such as micro/nano porous coatings help to maintain the low surface temperature thus improving the overall heat transfer performance. Electrodeposition is a simple technique that enhances this performance by creating the porous structure on the surface. This research focuses on developing an enhanced microscale structures on plain copper surfaces to improve the pool boiling performance. Additionally, the longevity (or the long-term stability) and aging of these enhanced structures, and their effects on the pool-boiling performance is also investigated. Initially the pool boiling performance of enhanced surfaces is studied. The enhanced surfaces were prepared using electrodeposition of copper and graphene oxide. Later, the effects of repetitive boiling on the morphology of the surfaces were examined using various characterization techniques such as Scanning Electron Microscope (SEM), X-Ray Diffraction (XRD), and Fourier Transform Infrared (FTIR). The chips coated with electrodeposition method rendered a high pool boiling performance for GS-4 (2.5% GO-Cu electrodeposited chip) with CHF of 220 W/cm2 at wall superheat of 14°C, giving ~76% improvement in CHF compared to plain copper chip. While, copper on copper electrodeposited chip, deposited with a different technique, performed better in both CHF and aging. CHF of 192 W/cm2 at wall superheat of 18.8°C was achieved for copper electrodeposited chip, giving ~30% enhancement compared to literature and ~54% enhancement when compared to plain copper chip. Moreover, surface characterization techniques including Scanning Electron Microscope (SEM) with Energy- Dispersive X-Ray Spectroscopy (EDS), Fourier Transform Infrared (FTIR), and X-Ray Diffraction (XRD) were employed to study the morphologies, elemental species, and to confirm the presence of graphene and graphene oxide on the test surfaces."--Abstract.
Author: Michele David
Publisher:
ISBN:
Category : Bubbles
Languages : en
Pages : 76
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Book Description
Boiling heat transfer is studied for its ability to dissipate high fluxes and achieve heat transfer coefficients two orders of magnitude greater than single-phase heat transfer systems. Heater surface enhancement with increased surface area, varied geometry, wettability contrast and micro/nano-structures can further enhance boiling heat transfer performance through bubble nucleation augmentation. Bubble nucleation control, growth and departure dynamics is important in understanding boiling phenomena and enhancing nucleate boiling heat transfer performance. Bi-functional surfaces for enhanced boiling heat transfer were fabricated and studied through investigation of bubble dynamics and pool boiling experiments. For the fabrication of the surface, hydrophobic polymer dot arrays are first printed on a substrate, followed by hydrophilic ZnO nanostructure deposition via microreactor-assisted nanomaterial deposition (MAND) processing. Wettability contrast between the hydrophobic polymer dot arrays and aqueous ZnO solution allows for the fabrication of surfaces with distinct wettability regions. Bi-functional surfaces with various configurations were fabricated and their bubble dynamics were examined at elevated heat flux, revealing various nucleate boiling phenomena. In particular, aligned and patterned bubbles with a tunable departure frequency and diameter were demonstrated in a boiling experiment for the first time. A pool boiling experimental facility has been designed and built to investigate nucleate pool boiling in water at atmospheric pressure. Resulting boiling curves of enhanced surfaces showed up to 3X enhancement in heat transfer coefficients at the same surface superheat using bi-functional surfaces, compared to a bare stainless steel surface. The surfaces show promising results for energy savings in two-phase change applications.
Author: Ankit Kalani
Publisher:
ISBN:
Category : Heat sinks (Electronics)
Languages : en
Pages : 170
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Book Description
"The growing trend in miniaturization of electronics has generated a need for efficient thermal management of these devices. Boiling has the ability to dissipate large quantity of heat while maintaining a small temperature difference. Vapor chamber with pool boiling offers an effective way to provide cooling and maintaining temperature uniformity. The objective of the current work is to investigate pool boiling performance of ethanol and FC-87 on microchannel surfaces. Ethanol is an attractive working fluid due to its better heat transfer performance and higher heat of vaporization compared to refrigerants, and lower boiling point compared to water. The saturation temperature of ethanol can be further reduced to temperatures suitable for electronics cooling by lowering the system pressure. Fluorocarbons are considered to be ideal fluids for electronics cooling due to their low normal boiling point, dielectric and inert nature. FC-87 is selected for the current work. Ethanol is tested at four different absolute pressures, 101.3 kPa, 66.7 kPa, 33.3 kPa and 16.7 kPa using different microchannel surface configurations. Heat dissipation in excess of 900 kW/m2 was obtained while maintaining the wall surface below 85°C at 33 kPa. Flammability, toxicity and temperature overshoot issues need to be addressed before practical implementation of ethanol-based cooling systems in electronics cooling application. FC-87 with microchannel yields average performance when compared to literature. Effect of surface area is identified as the key reason for performance enhancement. A new finned structure is developed, which gave a heat flux value 1.25 MW/m2 at 40°C wall superheat for FC-87 at atmospheric conditions."--Abstract.
Author: Mehmet Arik
Publisher:
ISBN:
Category :
Languages : en
Pages : 462
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Book Description
Author: Colin Charles Thomas
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 192
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