Electronic Packaging Materials Science VII: PDF Download
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Author: Peter Børgesen
Publisher: Cambridge University Press
ISBN: 9781107409422
Category : Technology & Engineering
Languages : en
Pages : 470
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Peter Børgesen
Publisher: Cambridge University Press
ISBN: 9781107409422
Category : Technology & Engineering
Languages : en
Pages : 470
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Peter Børgesen
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 480
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 344
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Book Description
Author: Robert C. Sundahl
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.
Author: Ralph Jaccodine
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 514
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Steven K. Groothuis
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 344
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Book Description
While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
Author: Marvin J. Weber
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 548
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 392
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Book Description
Author: Edwin D. Lillie
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 488
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Woodhead Publishing, Limited
Publisher: Woodhead Publishing
ISBN: 9781855733565
Category : Technology & Engineering
Languages : en
Pages : 862
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Book Description
