Effects of Transport and Additives on Electroless Copper Plating PDF Download
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Author: Ronald Anthony Zeszut (Jr)
Publisher:
ISBN:
Category : Electroless plating
Languages : en
Pages : 131
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Book Description
Metal deposition in electroless plating can be advantageously used to metalize non-conducting substrates and electrically isolated features. This research focuses on the metallization of nanometer-scale interconnects in semiconductor devices, which are rapidly approaching sizes too narrow for electroplating. A number of challenges still exist for the application of electroless plating to feature fill: (i) identifying an additives mixture that provides bottom-up fill in electroless plating; (ii) developing an experimental technique for rapid screening of such additives; (iii) quantification of transport in the electroless system; (iv) a comprehensive, quantitative model for electroless plating rates as a function of the important system parameters must be developed in order to enable predictive design. This research addresses all the above listed items.A technique for simulation of feature fill by electroless plating on a flat, non-patterned rotating disk electrode (RDE) is presented. Using deposition experiments performed at two different rotation speeds to simulate the feature top and bottom. This technique that provides a rapid and inexpensive method for additives screening, was used to identify promising additives for bottom-up fill. 3-mercaptopropanesulfonic acid (MPS) was identified as a promising additive for bottom-up fill, with polypropylene glycol (PPG) and 2’-2’-dipyridyl included in an additive mixture to provide a bright and uniform deposit.A model that provides electroless plating rates and accounts for the reactants and additives concentrations and for the effects of transport, has been developed. The model is based on experimental data and the electrochemical rate equations for both the oxidation and reduction reactions to provide the plating rate and operating potential as a function of the bulk reactants concentrations and the RDE rotation rate. The additives activity has been accounted for through the determination of their surface concentration, as determined by a balance of their transport, adsorption, and removal by inclusion into the deposited metal. It is shown that MPS is the critical, rate determining suppressor. The effect of dipyridyl is also included to model a multi-additive system. The model predictions match the observed data well, over reactants bulk concentrations, as well as rotation rates in the range of interest.
Author: Ronald Anthony Zeszut (Jr)
Publisher:
ISBN:
Category : Electroless plating
Languages : en
Pages : 131
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Book Description
Metal deposition in electroless plating can be advantageously used to metalize non-conducting substrates and electrically isolated features. This research focuses on the metallization of nanometer-scale interconnects in semiconductor devices, which are rapidly approaching sizes too narrow for electroplating. A number of challenges still exist for the application of electroless plating to feature fill: (i) identifying an additives mixture that provides bottom-up fill in electroless plating; (ii) developing an experimental technique for rapid screening of such additives; (iii) quantification of transport in the electroless system; (iv) a comprehensive, quantitative model for electroless plating rates as a function of the important system parameters must be developed in order to enable predictive design. This research addresses all the above listed items.A technique for simulation of feature fill by electroless plating on a flat, non-patterned rotating disk electrode (RDE) is presented. Using deposition experiments performed at two different rotation speeds to simulate the feature top and bottom. This technique that provides a rapid and inexpensive method for additives screening, was used to identify promising additives for bottom-up fill. 3-mercaptopropanesulfonic acid (MPS) was identified as a promising additive for bottom-up fill, with polypropylene glycol (PPG) and 2’-2’-dipyridyl included in an additive mixture to provide a bright and uniform deposit.A model that provides electroless plating rates and accounts for the reactants and additives concentrations and for the effects of transport, has been developed. The model is based on experimental data and the electrochemical rate equations for both the oxidation and reduction reactions to provide the plating rate and operating potential as a function of the bulk reactants concentrations and the RDE rotation rate. The additives activity has been accounted for through the determination of their surface concentration, as determined by a balance of their transport, adsorption, and removal by inclusion into the deposited metal. It is shown that MPS is the critical, rate determining suppressor. The effect of dipyridyl is also included to model a multi-additive system. The model predictions match the observed data well, over reactants bulk concentrations, as well as rotation rates in the range of interest.
Author: Milan Paunovic
Publisher:
ISBN:
Category : Alloys
Languages : en
Pages : 324
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Book Description
Author: Erik Gretler Lindberg
Publisher:
ISBN:
Category : Chemical engineering
Languages : en
Pages : 169
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Book Description
Commercial plating systems typically utilize an electrolyte containing the plated ion in combination with additive mixtures consisting of multiple organic surface active species. These additives adsorb on the plated electrode, modifying the deposit properties, texture, and distribution. While some of the mechanistic details of the additives adsorption and interactions have been characterized, the effects of convective flow and particularly of complex current waveforms remain uncharted. A specific motivation for the research reported herein, is the preferential fill, by electroplated copper, of blind and open vias in printed circuit boards that is achieved utilizing special additives in combination with the application of periodic reverse current waveform in the presence of ferric ions and complex flow. The process, which is widely utilized, has been developed empirically. Its optimization requires understanding the effects of each process parameter, its quantification, and the development of a comprehensive quantitative model. The additives utilized in this study are polyethylene glycol (PEG) which is a copper deposition inhibitor, and bis-sodiumsulfopropyl-disulfide (SPS), which is a weak accelerator. Those very same additives enable the bottom-up metallization of semiconductor interconnects; however, due to the much larger metallized features (hundreds of microns vs. few nanometers) and much longer deposition time (order of hour instead of a few seconds), the challenges facing the plating process herein, are different and, in many cases, more complex. A quantitative model describing competitive adsorption of additives and polarization effects was developed to address deficiencies in current theories. This model, invoking heterogeneous adsorption energy sites, accounts for the steady-state additives (SPS and polyethylene glycol, `PEG') coverages, subject to competitive adsorption, as a function of additives concentration in solution, and accurately predicts polarization as a function of time. An extension of this model has been applied to periodic reverse plating, explaining and quantitatively modeling the preservation of increased polarization associated with pulsing as compared to DC. This maintained polarization, which is generated by the periodic reverse current, is the key to enabling the continued bottom-up plating over time periods exceeding a few minutes. The model qualitatively explains the polarization dependence on the magnitude of the anodic pulse potential or current, and lack of dependence on the anodic pulse length. Another effect of the periodic reverse pulsed current is in enhancing the deposit thickness uniformity. This is achieved due to the preferential dissolution at the short high current anodic pulses, of any deposit asperities produced during the regular longer term deposition at the lower cathodic current densities of the pulse waveform. This effect has been quantified and modeled. The significance of the addition of ferrous/ferric ions to the process has been analyzed. The ferrous ions depolarize the dimensionally stable anodes, preventing the rapid oxidation of the sulfur-containing additive bis-sodiumsulfopropyl-disulfide (SPS). Perhaps more importantly, the ferric ions etch the plated copper through a transport limited reaction. Determining quantitatively the transport dependence of this reaction, and applying this to analyze current efficiency data obtained in a commercial plating machine which incorporates complex flow, it was possible to determine quantitatively the average transport rates prevailing in the industrial scale machine. This determination allows the use of lab-scale rotating disk electrodes (RDE) to simulate industrially relevant plating conditions. Furthermore, this transport information enabled the detailed simulation of the flow and transport rates in and around the plated vias, an essential component for quantitative modeling of the process. A computer implemented model has been used to simulate feature fill incorporating the effects of periodic pulse reverse plating, the additives induced polarization effects, and the transport dependent etching of the plated copper. The simulation results agree well with via fill plating experiments conducted in the lab, using a PCB coupon mounted on a RDE.
Author: Yosi Shacham-Diamand
Publisher: Springer Science & Business Media
ISBN: 0387958681
Category : Science
Languages : en
Pages : 545
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Book Description
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Author: RAMONA YUN-CHING YING
Publisher:
ISBN:
Category :
Languages : en
Pages : 250
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Book Description
Based on the rate laws obtained in this study and mechanisms proposed in the literature, mechanisms for formaldehyde oxidation and copper deposition were suggested.
Author: M.S.J. Hashmi
Publisher: Elsevier
ISBN: 0128032502
Category : Technology & Engineering
Languages : en
Pages : 1467
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Book Description
Finish Manufacturing Processes are those final stage processing techniques which are deployed to bring a product to readiness for marketing and putting in service. Over recent decades a number of finish manufacturing processes have been newly developed by researchers and technologists. Many of these developments have been reported and illustrated in existing literature in a piecemeal manner or in relation only to specific applications. For the first time, Comprehensive Materials Finishing, Three Volume Set integrates a wide body of this knowledge and understanding into a single, comprehensive work. Containing a mixture of review articles, case studies and research findings resulting from R & D activities in industrial and academic domains, this reference work focuses on how some finish manufacturing processes are advantageous for a broad range of technologies. These include applicability, energy and technological costs as well as practicability of implementation. The work covers a wide range of materials such as ferrous, non-ferrous and polymeric materials. There are three main distinct types of finishing processes: Surface Treatment by which the properties of the material are modified without generally changing the physical dimensions of the surface; Finish Machining Processes by which a small layer of material is removed from the surface by various machining processes to render improved surface characteristics; and Surface Coating Processes by which the surface properties are improved by adding fine layer(s) of materials with superior surface characteristics. Each of these primary finishing processes is presented in its own volume for ease of use, making Comprehensive Materials Finishing an essential reference source for researchers and professionals at all career stages in academia and industry. Provides an interdisciplinary focus, allowing readers to become familiar with the broad range of uses for materials finishing Brings together all known research in materials finishing in a single reference for the first time Includes case studies that illustrate theory and show how it is applied in practice
Author: Nasser Yahoudaye Tehrani
Publisher:
ISBN:
Category : Copper plating
Languages : en
Pages : 48
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Author:
Publisher:
ISBN:
Category : Electroplating
Languages : en
Pages : 408
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Author: Lubomyr Taras Romankiw
Publisher:
ISBN:
Category : Electrochemistry, Industrial
Languages : en
Pages : 832
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Author: Dawn Michelle Fuqua
Publisher:
ISBN:
Category :
Languages : en
Pages : 228
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