Effect of Cyclic Thermo-Mechanical Loads on Fatigue Reliability in Polymer Matrix Composites PDF Download
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Author: A. R. Shah
Publisher:
ISBN:
Category : Composite materials
Languages : en
Pages : 20
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Book Description
Author: A. R. Shah
Publisher:
ISBN:
Category : Composite materials
Languages : en
Pages : 20
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Book Description
Author: A. R. Shah
Publisher:
ISBN:
Category : Composite materials
Languages : en
Pages : 16
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Author: Rui Miranda Guedes
Publisher: Woodhead Publishing
ISBN: 0081026021
Category : Technology & Engineering
Languages : en
Pages : 590
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Book Description
Creep and Fatigue in Polymer Matrix Composites, Second Edition, updates the latest research in modeling and predicting creep and fatigue in polymer matrix composites. The first part of the book reviews the modeling of viscoelastic and viscoplastic behavior as a way of predicting performance and service life. Final sections discuss techniques for modeling creep rupture and failure and how to test and predict long-term creep and fatigue in polymer matrix composites. - Reviews the latest research in modeling and predicting creep and fatigue in polymer matrix composites - Puts a specific focus on viscoelastic and viscoplastic modeling - Features the time-temperature-age superposition principle for predicting long-term response - Examines the creep rupture and damage interaction, with a particular focus on time-dependent failure criteria for the lifetime prediction of polymer matrix composite structures that are illustrated using experimental cases
Author: Steven J. Hooper
Publisher: ASTM International
ISBN: 0803124783
Category : Composite materials
Languages : en
Pages : 286
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Author:
Publisher:
ISBN:
Category : Mechanics, Applied
Languages : en
Pages : 348
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Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 704
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Author:
Publisher:
ISBN:
Category : Airplanes
Languages : en
Pages : 776
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Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: I. Milne
Publisher: Elsevier
ISBN: 0080441556
Category : Technology & Engineering
Languages : en
Pages : 539
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Author:
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 280
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Book Description
