Author: N.F. Kazakov
Publisher: Elsevier
ISBN: 1483150550
Category : Technology & Engineering
Languages : en
Pages : 305
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Book Description
Diffusion Beading of Materials is an attempt to pool the experience in vacuum diffusion bonding accumulated by a number of mechanical engineering works, research establishments, and colleges. The book discusses the principal bonding variables and recommended procedures for diffusion bonding in vacuum; the equipment for diffusion bonding and production rate; and the mechanization and automation of equipment. The text also describes the diffusion bonding of steels; the bonding of cast iron and cast iron to steel; and the bonding of dissimilar metals and alloys. The bonding of refractory and active metals and their alloys; the bonding of high-temperature alloys, nickel and nickel alloys; and the bonding of cemented carbides and of a cemented carbide to steel are also considered. The book further tackles the repair and reconditioning by diffusion bonding; the bonding of porous materials; and diffusion metallurgy. The text also encompasses nonmetals and their joining to metals; quality control of diffusion-bonded joints; accident prevention; and cleanliness in vacuum diffusion bonding.
Author: D.J. Stephenson
Publisher: Springer Science & Business Media
ISBN: 9401136742
Category : Technology & Engineering
Languages : en
Pages : 326
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Book Description
There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations. Diffusion bonding has also led to reduced manufacturing costs and weight savings in conventional materials and developments in hot isostatic pressing have allowed greater design flexibility. Since the first conference on Diffusion Bonding, held at Cranfield in 1987, considerable advances have been made and it was therefore considered appropriate to organise the Second International Conference on Diffusion Bonding which was held at Cranfield Institute of Technology on 28 and 29 March 1990. The meeting provided a forum for the presentation and discussion of recent developments in Diffusion Bonding and was divided into four main subject areas: steel bonding and quality control, diffusion bonding of aluminium alloys, bonding of high temperature materials and general applications. This structure is retained in the proceedings. DAVID STEPHENSON vii CONTENTS v Preface ......................... .
Author: Robert Edward Monroe
Publisher:
ISBN:
Category : Adhesives
Languages : en
Pages : 86
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Book Description
This report supplies information on joining processes applicable to titanium and its alloys in sheet metal applications, primarily related directly to airframe construction. Although the material presented here does not cover all titanium joining processes, and omits such processes as plasma-arc, submerged-arc, electroslag, flash, and high-frequency resistance welding, the data presented cover materials up to 2-inches thick in some cases and the report should be useful to anyone seeking titanium joining information. The joining processes covered fall into five categories: welding, brazing, metallurgical bonding (diffusion and deformation bonding), adhesive bonding, and mechanical fastening. The fusion welding processes that are discussed in detail include gas tungsten arc, gas metal arc, arc spot, and electron beam. The resistance processes give extended coverage are spot, roll spot, and seam welding. (Author).
Author: M.G. Nicholas
Publisher: Springer Science & Business Media
ISBN: 9780412793608
Category : Technology & Engineering
Languages : en
Pages : 360
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Book Description
Joining Processes is aimed at scientists and engineers who need to specify effective means of joining metals and ceramics, and also for undergraduates whose studies encompass joining processes. Joining Processes provides a brief review of the spectrum of joining processes ranging from fusion welding to adhesive bonding, followed by a detailed introduction to brazing, diffusion bonding and their hybrid processes. This book also describes the scientific principles of the joining processes and provides practical information about the optimum selection of joining materials, joint designs and processing parameters. The effects of both similarities and significant differences of the processes on joint properties are emphasised and illustrated by descriptions of case histories of successful applications.
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
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Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author: The Minerals, Metals & Materials Society
Publisher: Springer Nature
ISBN: 3030362965
Category : Technology & Engineering
Languages : en
Pages : 2046
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Book Description
This collection presents papers from the 149th Annual Meeting & Exhibition of The Minerals, Metals & Materials Society.
Author: Walter Brockmann
Publisher: John Wiley & Sons
ISBN: 3527318984
Category : Technology & Engineering
Languages : en
Pages : 433
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Book Description
Both solid knowledge of the basics as well as expert knowledge is needed to create rigid, long-lasting and material-specific adhesions in the industrial or trade sectors. Information that is extremely difficult and time-consuming to find in the current literature. Written by specialists in various disciplines from both academia and industry, this handbook is the very first to provide such comprehensive knowledge in a compact and well-structured form. Alongside such traditional fields as the properties, chemistry and characteristic behavior of adhesives and adhesive joints, it also treats in detail current practical questions and the manifold applications for adhesives.
Author: R. M. Evans
Publisher:
ISBN:
Category : Diffusion bonding (Metals)
Languages : en
Pages : 12
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Book Description
Author: Sina Ebnesajjad
Publisher: William Andrew
ISBN: 0323265049
Category : Technology & Engineering
Languages : en
Pages : 360
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Book Description
Aimed at engineers and materials scientists in a wide range of sectors, this book is a unique source of surface preparation principles and techniques for plastics, thermosets, elastomers, ceramics and metals bonding. With emphasis on the practical, it draws together the technical principles of surface science and surface treatments technologies to enable practitioners to improve existing surface preparation processes to improve adhesion and, as a result, enhance product life. This book describes and illustrates the surface preparations and operations that must be applied to a surface before acceptable adhesive bonding is achieved. It is meant to be an exhaustive overview, including more detailed explanation where necessary, in a continuous and logical progression. The book provides a necessary grounding in the science and practice of adhesion, without which adequate surface preparation is impossible. Surface characterization techniques are included, as is an up-to-date assessment of existing surface treatment technologies such as Atmospheric Plasma, Degreasing, Grit blasting, laser ablation and more. Fundamental material considerations are prioritised over specific applications, making this book relevant to all industries using adhesives, such as medical, automotive, aerospace, packaging and electronics. This second edition represents a full and detailed update, with all major developments in the field included and three chapters added to cover ceramic surface treatment, plasma treatment of non-metallic materials, and the effect of additives on surface properties of plastics. A vital resource for improving existing surface treatment processes to increase product life by creating stronger, more durable adhesive bonds Relevant across a variety of industries, including medical, automotive and packaging Provides essential grounding in the science of surface adhesion, and details how this links with the practice of surface treatment
Author: Mahesh Chaturvedi
Publisher: Elsevier
ISBN: 0857095161
Category : Technology & Engineering
Languages : en
Pages : 448
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Book Description
Welding and joining techniques play an essential role in both the manufacture and in-service repair of aerospace structures and components, and these techniques become more advanced as new, complex materials are developed. Welding and joining of aerospace materials provides an in-depth review of different techniques for joining metallic and non-metallic aerospace materials.Part one opens with a chapter on recently developed welding techniques for aerospace materials. The next few chapters focus on different types of welding such as inertia friction, laser and hybrid laser-arc welding. The final chapter in part one discusses the important issue of heat affected zone cracking in welded superalloys. Part two covers other joining techniques, including chapters on riveting, composite-to-metal bonding, diffusion bonding and recent improvements in bonding metals. Part two concludes with a chapter focusing on the use of high-temperature brazing in aerospace engineering. Finally, an appendix to the book covers the important issue of linear friction welding.With its distinguished editor and international team of contributors, Welding and joining of aerospace materials is an essential reference for engineers and designers in the aerospace, materials and welding and joining industries, as well as companies and other organisations operating in these sectors and all those with an academic research interest in the subject. Provides an in-depth review of different techniques for joining metallic and non-metallic aerospace materials Discusses the important issue of heat affected zone cracking in welded superalloys Covers many joining techniques, including riveting, composite-to-metal bonding and diffusion bonding
