Development of 4H-SiC High Voltage Unipolar Power Switching Devices PDF Download
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Author: Petre Alexandrov
Publisher:
ISBN:
Category : High voltages
Languages : en
Pages : 139
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Book Description
4H-SiC is a promising material for switching high power and high temperature device applications. The superior properties of SiC, such as wider band-gap and higher value of critical electric field allow significant reduction in device on-resistance compared to Si power devices of similar voltage ratings. In addition the excellent thermal conductivity of SiC alleviates the device cooling requirements and allows design of smaller and more efficient systems. Several advantages of the unipolar power switches over the bipolar switches make them desirable for fast switching applications. Voltage-controlled normally-off devices are particularly attractive for practical applications because of simpler gate-drive circuitry. The advantages of the vertical JFET device being free of the problems related to oxide reliability, as compared to the MOSFET, recognize it as an excellent candidate for high power, high temperature switching applications. Device designs for normally-off and normally-on unipolar switches with blocking voltages from 400V to 11kV are proposed, based on a pure vertical trenched and implanted structure. Two different junction termination structures (junction termination extension and guard rings) are designed and successfully implemented. A fabrication process is designed to achieve a simple and reliable self-aligned fabrication process. The fabrication challenges are discussed and ways to improve the process are identified. Three different devices were designed and fabricated. The world's first normally-off 4H-SiC TIVJFET with a blocking voltage of 11kV was demonstrated, showing low specific on-resistance of 124mOhm.cm2. Normally-off and normally-on 4H-SiC High Frequency TIVJFETs with blocking voltages up to 400V were demonstrated. 3.3A-397V normally-off capability was achieved for a single die, corresponding to a high power of 1310 W/die. This corresponds to a class B operation RF power of 164W for a single die. Cut-off frequency fT= 0.9 to 1.5 GHz was reached. In the 1200V class devices a normally-on 4H-SiC TIVJFET with guard ring termination and substantially simplified processing was also demonstrated. The highest blocking voltage achieved was 1562V with a specific on-resistance of 2.8mOhm.cm2 at VDS=0.5V and VGS=2.5V and a current gain of 1495. The lowest specific on resistance achieved was 2.2mOhm.cm2 at VDS=0.5V and VGS=2.5V with a current gain of 1454 and a blocking voltage of 1232V.
Author: Petre Alexandrov
Publisher:
ISBN:
Category : High voltages
Languages : en
Pages : 139
Get Book Here
Book Description
4H-SiC is a promising material for switching high power and high temperature device applications. The superior properties of SiC, such as wider band-gap and higher value of critical electric field allow significant reduction in device on-resistance compared to Si power devices of similar voltage ratings. In addition the excellent thermal conductivity of SiC alleviates the device cooling requirements and allows design of smaller and more efficient systems. Several advantages of the unipolar power switches over the bipolar switches make them desirable for fast switching applications. Voltage-controlled normally-off devices are particularly attractive for practical applications because of simpler gate-drive circuitry. The advantages of the vertical JFET device being free of the problems related to oxide reliability, as compared to the MOSFET, recognize it as an excellent candidate for high power, high temperature switching applications. Device designs for normally-off and normally-on unipolar switches with blocking voltages from 400V to 11kV are proposed, based on a pure vertical trenched and implanted structure. Two different junction termination structures (junction termination extension and guard rings) are designed and successfully implemented. A fabrication process is designed to achieve a simple and reliable self-aligned fabrication process. The fabrication challenges are discussed and ways to improve the process are identified. Three different devices were designed and fabricated. The world's first normally-off 4H-SiC TIVJFET with a blocking voltage of 11kV was demonstrated, showing low specific on-resistance of 124mOhm.cm2. Normally-off and normally-on 4H-SiC High Frequency TIVJFETs with blocking voltages up to 400V were demonstrated. 3.3A-397V normally-off capability was achieved for a single die, corresponding to a high power of 1310 W/die. This corresponds to a class B operation RF power of 164W for a single die. Cut-off frequency fT= 0.9 to 1.5 GHz was reached. In the 1200V class devices a normally-on 4H-SiC TIVJFET with guard ring termination and substantially simplified processing was also demonstrated. The highest blocking voltage achieved was 1562V with a specific on-resistance of 2.8mOhm.cm2 at VDS=0.5V and VGS=2.5V and a current gain of 1495. The lowest specific on resistance achieved was 2.2mOhm.cm2 at VDS=0.5V and VGS=2.5V with a current gain of 1454 and a blocking voltage of 1232V.
Author: B. Jayant Baliga
Publisher: Woodhead Publishing
ISBN: 0081023073
Category : Technology & Engineering
Languages : en
Pages : 420
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Book Description
Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior to existing silicon devices. The book lays the groundwork for an understanding of an array of applications and anticipated benefits in energy savings. Authored by the Founder of the Power Semiconductor Research Center at North Carolina State University (and creator of the IGBT device), Dr. B. Jayant Baliga is one of the highest regarded experts in the field. He thus leads this team who comprehensively review the materials, device physics, design considerations and relevant applications discussed. - Comprehensively covers power electronic devices, including materials (both gallium nitride and silicon carbide), physics, design considerations, and the most promising applications - Addresses the key challenges towards the realization of wide bandgap power electronic devices, including materials defects, performance and reliability - Provides the benefits of wide bandgap semiconductors, including opportunities for cost reduction and social impact
Author: Tsunenobu Kimoto
Publisher: John Wiley & Sons
ISBN: 1118313526
Category : Technology & Engineering
Languages : en
Pages : 565
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Book Description
A comprehensive introduction and up-to-date reference to SiC power semiconductor devices covering topics from material properties to applications Based on a number of breakthroughs in SiC material science and fabrication technology in the 1980s and 1990s, the first SiC Schottky barrier diodes (SBDs) were released as commercial products in 2001. The SiC SBD market has grown significantly since that time, and SBDs are now used in a variety of power systems, particularly switch-mode power supplies and motor controls. SiC power MOSFETs entered commercial production in 2011, providing rugged, high-efficiency switches for high-frequency power systems. In this wide-ranging book, the authors draw on their considerable experience to present both an introduction to SiC materials, devices, and applications and an in-depth reference for scientists and engineers working in this fast-moving field. Fundamentals of Silicon Carbide Technology covers basic properties of SiC materials, processing technology, theory and analysis of practical devices, and an overview of the most important systems applications. Specifically included are: A complete discussion of SiC material properties, bulk crystal growth, epitaxial growth, device fabrication technology, and characterization techniques. Device physics and operating equations for Schottky diodes, pin diodes, JBS/MPS diodes, JFETs, MOSFETs, BJTs, IGBTs, and thyristors. A survey of power electronics applications, including switch-mode power supplies, motor drives, power converters for electric vehicles, and converters for renewable energy sources. Coverage of special applications, including microwave devices, high-temperature electronics, and rugged sensors. Fully illustrated throughout, the text is written by recognized experts with over 45 years of combined experience in SiC research and development. This book is intended for graduate students and researchers in crystal growth, material science, and semiconductor device technology. The book is also useful for design engineers, application engineers, and product managers in areas such as power supplies, converter and inverter design, electric vehicle technology, high-temperature electronics, sensors, and smart grid technology.
Author: B Jayant Baliga
Publisher: World Scientific
ISBN: 9811284296
Category : Technology & Engineering
Languages : en
Pages : 671
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Book Description
Silicon Carbide power devices are being increasingly adopted for many applications such as electric vehicles and charging stations. There is a large demand for a resource to learn and understand the basic physics of operation of these devices to create engineers with in depth knowledge about them.This unique compendium provides a comprehensive design guide for Silicon Carbide power devices. It systematically describes the device structures and analytical models for computing their characteristics. The device structures included are the Schottky diode, JBS rectifier, power MOSFET, JBSFET, IGBT and BiDFET. Unique structures that address achieving excellent voltage blocking and on-resistance are emphasized.This useful textbook and reference innovations for achieving superior high frequency operation and highlights manufacturing technology for the devices. The book will benefit professionals, academics, researchers and graduate students in the fields of electrical and electronic engineering, circuits and systems, semiconductors, and energy studies.
Author: Meng-Chia Lee
Publisher:
ISBN:
Category :
Languages : en
Pages : 148
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Book Description
Author: Herb Goronkin
Publisher: CRC Press
ISBN: 9780750302265
Category : Technology & Engineering
Languages : en
Pages : 946
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Book Description
Compound Semiconductors 1994 provides a comprehensive overview of research and applications of gallium arsenide, indium phosphide, silicon carbide, and other compound semiconducting materials. Contributed by leading experts, the book discusses growth, characterization, processing techniques, device applications, high-power, high-temperature semiconductor devices, visible emitters and optoelectronic integrated circuits (OEICs), heterojunction transistors, nanoelectronics, and nanophotonics, and simulation and modeling. The book is an essential reference for researchers working on the fabrication of semiconductors, characterization of materials, and their applications for devices, such as lasers, photodiodes, sensors, and transistors, particularly in the high-speed telecommunications industries.
Author: B. Jayant Baliga
Publisher: World Scientific
ISBN: 9812774521
Category : Technology & Engineering
Languages : en
Pages : 526
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Book Description
Power semiconductor devices are widely used for the control and management of electrical energy. The improving performance of power devices has enabled cost reductions and efficiency increases resulting in lower fossil fuel usage and less environmental pollution. This book provides the first cohesive treatment of the physics and design of silicon carbide power devices with an emphasis on unipolar structures. It uses the results of extensive numerical simulations to elucidate the operating principles of these important devices. Sample Chapter(s). Chapter 1: Introduction (72 KB). Contents: Material Properties and Technology; Breakdown Voltage; PiN Rectifiers; Schottky Rectifiers; Shielded Schottky Rectifiers; Metal-Semiconductor Field Effect Transistors; The Baliga-Pair Configuration; Planar Power MOSFETs; Shielded Planar MOSFETs; Trench-Gate Power MOSFETs; Shielded Trendch-Gate MOSFETs; Charge Coupled Structures; Integral Diodes; Lateral High Voltage FETs; Synopsis. Readership: For practising engineers working on power devices, and as a supplementary textbook for a graduate level course on power devices.
Author: B Jayant Baliga
Publisher: World Scientific Publishing Company
ISBN: 9813109424
Category : Technology & Engineering
Languages : en
Pages : 592
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Book Description
During the last 30 years, significant progress has been made to improve our understanding of gallium nitride and silicon carbide device structures, resulting in experimental demonstration of their enhanced performances for power electronic systems. Gallium nitride power devices made by the growth of the material on silicon substrates have gained a lot of interest. Power device products made from these materials have become available during the last five years from many companies.This comprehensive book discusses the physics of operation and design of gallium nitride and silicon carbide power devices. It can be used as a reference by practicing engineers in the power electronics industry and as a textbook for a power device or power electronics course in universities.
Author: Robin Karhu
Publisher: Linköping University Electronic Press
ISBN: 9176851494
Category :
Languages : en
Pages : 55
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Book Description
Silicon Carbide (SiC) is a wide bandgap semiconductor that has attracted a lot of interest for electronic applications due to its high thermal conductivity, high saturation electron drift velocity and high critical electric field strength. In recent years commercial SiC devices have started to make their way into high and medium voltage applications. Despite the advancements in SiC growth over the years, several issues remain. One of these issues is that the bulk grown SiC wafers are not suitable for electronic applications due to the high background doping and high density of basal plane dislocations (BPD). Due to these problems SiC for electronic devices must be grown by homoepitaxy. The epitaxial growth is performed in chemical vapor deposition (CVD) reactors. In this work, growth has been performed in a horizontal hot-wall CVD (HWCVD) reactor. In these reactors it is possible to produce high-quality SiC epitaxial layers within a wide range of doping, both n- and p-type. SiC is a well-known example of polytypism, where the different polytypes exist as different stacking sequences of the Si-C bilayers. Polytypism makes polytype stability a problem during growth of SiC. To maintain polytype stability during homoepitaxy of the hexagonal polytypes the substrates are usually cut so that the angle between the surface normal and the c-axis is a few degrees, typically 4 or 8°. The off-cut creates a high density of micro-steps at the surface. These steps allow for the replication of the substrates polytype into the growing epitaxial layer, the growth will take place in a step-flow manner. However, there are some drawbacks with step-flow growth. One is that BPDs can replicate from the substrate into the epitaxial layer. Another problem is that 4H-SiC is often used as a substrate for growth of GaN epitaxial layers. The epitaxial growth of GaN has been developed on on-axis substrates (surface normal coincides with c-axis), so epitaxial 4H-SiC layers grown on off-axis substrates cannot be used as substrates for GaN epitaxial growth. In efforts to solve the problems with off-axis homoepitaxy of 4H-SiC, on-axis homoepitaxy has been developed. In this work, further development of wafer-scale on-axis homoepitaxy has been made. This development has been made on a Si-face of 4H-SiC substrates. The advances include highly resistive epilayers grown on on-axis substrates. In this thesis the ability to control the surface morphology of epitaxial layers grown on on-axis homoepitaxy is demonstrated. This work also includes growth of isotopically enriched 4H-SiC on on-axis substrates, this has been done to increase the thermal conductivity of the grown epitaxial layers. In (paper 1) on-axis homoepitaxy of 4H-SiC has been developed on 100 mm diameter substrates. This paper also contains comparisons between different precursors. In (paper 2) we have further developed on-axis homoepitaxy on 100 mm diameter wafers, by doping the epitaxial layers with vanadium. The vanadium doping of the epitaxial layers makes the layers highly resistive and thus suitable to use as a substrate for III-nitride growth. In (paper 3) we developed a method to control the surface morphology and reduce the as-grown surface roughness in samples grown on on-axis substrates. In (paper 4) we have increased the thermal conductivity of 4H-SiC epitaxial layers by growing the layers using isotopically enriched precursors. In (paper 5) we have investigated the role chlorine have in homoepitaxial growth of 4H-SiC. In (paper 6) we have investigated the charge carrier lifetime in as-grown samples and traced variations in lifetime to structural defects in the substrate. In (paper 7) we have investigated the formation mechanism of a morphological defect in homoepitaxial grown 4H-SiC.
Author: Tsunenobu Kimoto
Publisher: John Wiley & Sons
ISBN: 1118313550
Category : Technology & Engineering
Languages : en
Pages : 565
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Book Description
A comprehensive introduction and up-to-date reference to SiC power semiconductor devices covering topics from material properties to applications Based on a number of breakthroughs in SiC material science and fabrication technology in the 1980s and 1990s, the first SiC Schottky barrier diodes (SBDs) were released as commercial products in 2001. The SiC SBD market has grown significantly since that time, and SBDs are now used in a variety of power systems, particularly switch-mode power supplies and motor controls. SiC power MOSFETs entered commercial production in 2011, providing rugged, high-efficiency switches for high-frequency power systems. In this wide-ranging book, the authors draw on their considerable experience to present both an introduction to SiC materials, devices, and applications and an in-depth reference for scientists and engineers working in this fast-moving field. Fundamentals of Silicon Carbide Technology covers basic properties of SiC materials, processing technology, theory and analysis of practical devices, and an overview of the most important systems applications. Specifically included are: A complete discussion of SiC material properties, bulk crystal growth, epitaxial growth, device fabrication technology, and characterization techniques. Device physics and operating equations for Schottky diodes, pin diodes, JBS/MPS diodes, JFETs, MOSFETs, BJTs, IGBTs, and thyristors. A survey of power electronics applications, including switch-mode power supplies, motor drives, power converters for electric vehicles, and converters for renewable energy sources. Coverage of special applications, including microwave devices, high-temperature electronics, and rugged sensors. Fully illustrated throughout, the text is written by recognized experts with over 45 years of combined experience in SiC research and development. This book is intended for graduate students and researchers in crystal growth, material science, and semiconductor device technology. The book is also useful for design engineers, application engineers, and product managers in areas such as power supplies, converter and inverter design, electric vehicle technology, high-temperature electronics, sensors, and smart grid technology.
