Author: Seongbo Shim
Publisher: Springer
ISBN: 331976294X
Category : Technology & Engineering
Languages : en
Pages : 144
Book Description
This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology.
Physical Design and Mask Synthesis for Directed Self-Assembly Lithography
Author: Seongbo Shim
Publisher: Springer
ISBN: 331976294X
Category : Technology & Engineering
Languages : en
Pages : 144
Book Description
This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology.
Publisher: Springer
ISBN: 331976294X
Category : Technology & Engineering
Languages : en
Pages : 144
Book Description
This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology.
Design for Manufacturability with Advanced Lithography
Author: Bei Yu
Publisher: Springer
ISBN: 3319203851
Category : Technology & Engineering
Languages : en
Pages : 173
Book Description
This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL). The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms.
Publisher: Springer
ISBN: 3319203851
Category : Technology & Engineering
Languages : en
Pages : 173
Book Description
This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL). The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms.
Directed Self-assembly of Block Co-polymers for Nano-manufacturing
Author: Roel Gronheid
Publisher: Woodhead Publishing
ISBN: 0081002610
Category : Technology & Engineering
Languages : en
Pages : 328
Book Description
The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology. Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new processing methods for DSA. Part 2 then goes on to outline the key modelling and characterization principles of DSA, reviewing templates and patterning using topographical and chemically modified surfaces, line edge roughness and dimensional control, x-ray scattering for characterization, and nanoscale driven assembly. Finally, Part 3 discusses application areas and related issues for DSA in nano-manufacturing, including for basic logic circuit design, the inverse DSA problem, design decomposition and the modelling and analysis of large scale, template self-assembly manufacturing techniques. - Authoritative outlining of theoretical principles and modeling techniques to give a thorough introdution to the topic - Discusses a broad range of practical applications for directed self-assembly in nano-manufacturing - Highlights the importance of this technology to both the present and future of nano-manufacturing by exploring its potential use in a range of fields
Publisher: Woodhead Publishing
ISBN: 0081002610
Category : Technology & Engineering
Languages : en
Pages : 328
Book Description
The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology. Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new processing methods for DSA. Part 2 then goes on to outline the key modelling and characterization principles of DSA, reviewing templates and patterning using topographical and chemically modified surfaces, line edge roughness and dimensional control, x-ray scattering for characterization, and nanoscale driven assembly. Finally, Part 3 discusses application areas and related issues for DSA in nano-manufacturing, including for basic logic circuit design, the inverse DSA problem, design decomposition and the modelling and analysis of large scale, template self-assembly manufacturing techniques. - Authoritative outlining of theoretical principles and modeling techniques to give a thorough introdution to the topic - Discusses a broad range of practical applications for directed self-assembly in nano-manufacturing - Highlights the importance of this technology to both the present and future of nano-manufacturing by exploring its potential use in a range of fields
Microlithography
Author: Bruce W. Smith
Publisher: CRC Press
ISBN: 1351643444
Category : Technology & Engineering
Languages : en
Pages : 913
Book Description
The completely revised Third Edition to the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from fundamental principles to advanced topics of nanoscale lithography. The book is divided into chapters covering all important aspects related to the imaging, materials, and processes that have been necessary to drive semiconductor lithography toward nanometer-scale generations. Renowned experts from the world’s leading academic and industrial organizations have provided in-depth coverage of the technologies involved in optical, deep-ultraviolet (DUV), immersion, multiple patterning, extreme ultraviolet (EUV), maskless, nanoimprint, and directed self-assembly lithography, together with comprehensive descriptions of the advanced materials and processes involved. New in the Third Edition In addition to the full revision of existing chapters, this new Third Edition features coverage of the technologies that have emerged over the past several years, including multiple patterning lithography, design for manufacturing, design process technology co-optimization, maskless lithography, and directed self-assembly. New advances in lithography modeling are covered as well as fully updated information detailing the new technologies, systems, materials, and processes for optical UV, DUV, immersion, and EUV lithography. The Third Edition of Microlithography: Science and Technology authoritatively covers the science and engineering involved in the latest generations of microlithography and looks ahead to the future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current technology, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to better understand the complex world of microlithography science and technology.
Publisher: CRC Press
ISBN: 1351643444
Category : Technology & Engineering
Languages : en
Pages : 913
Book Description
The completely revised Third Edition to the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from fundamental principles to advanced topics of nanoscale lithography. The book is divided into chapters covering all important aspects related to the imaging, materials, and processes that have been necessary to drive semiconductor lithography toward nanometer-scale generations. Renowned experts from the world’s leading academic and industrial organizations have provided in-depth coverage of the technologies involved in optical, deep-ultraviolet (DUV), immersion, multiple patterning, extreme ultraviolet (EUV), maskless, nanoimprint, and directed self-assembly lithography, together with comprehensive descriptions of the advanced materials and processes involved. New in the Third Edition In addition to the full revision of existing chapters, this new Third Edition features coverage of the technologies that have emerged over the past several years, including multiple patterning lithography, design for manufacturing, design process technology co-optimization, maskless lithography, and directed self-assembly. New advances in lithography modeling are covered as well as fully updated information detailing the new technologies, systems, materials, and processes for optical UV, DUV, immersion, and EUV lithography. The Third Edition of Microlithography: Science and Technology authoritatively covers the science and engineering involved in the latest generations of microlithography and looks ahead to the future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current technology, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to better understand the complex world of microlithography science and technology.
Microlithography
Author: Bruce W. Smith
Publisher: CRC Press
ISBN: 1420051539
Category : Technology & Engineering
Languages : en
Pages : 864
Book Description
This new edition of the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from elementary concepts to advanced aspects of modern submicron microlithography. Each chapter reflects the current research and practices from the world's leading academic and industrial laboratories detailed by a stellar panel of international experts. New in the Second Edition In addition to updated information on existing material, this new edition features coverage of technologies developed over the last decade since the first edition appeared, including: Immersion Lithography 157nm Lithography Electron Projection Lithography (EPL) Extreme Ultraviolet (EUV) Lithography Imprint Lithography Photoresists for 193nm and Immersion Lithography Scatterometry Microlithography: Science and Technology, Second Edition authoritatively covers the physics, chemistry, optics, metrology tools and techniques, resist processing and materials, and fabrication methods involved in the latest generations of microlithography such as immersion lithography and extreme ultraviolet (EUV) lithography. It also looks ahead to the possible future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current literature, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to achieve robust, accurate, and cost-effective microlithography processes and systems.
Publisher: CRC Press
ISBN: 1420051539
Category : Technology & Engineering
Languages : en
Pages : 864
Book Description
This new edition of the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from elementary concepts to advanced aspects of modern submicron microlithography. Each chapter reflects the current research and practices from the world's leading academic and industrial laboratories detailed by a stellar panel of international experts. New in the Second Edition In addition to updated information on existing material, this new edition features coverage of technologies developed over the last decade since the first edition appeared, including: Immersion Lithography 157nm Lithography Electron Projection Lithography (EPL) Extreme Ultraviolet (EUV) Lithography Imprint Lithography Photoresists for 193nm and Immersion Lithography Scatterometry Microlithography: Science and Technology, Second Edition authoritatively covers the physics, chemistry, optics, metrology tools and techniques, resist processing and materials, and fabrication methods involved in the latest generations of microlithography such as immersion lithography and extreme ultraviolet (EUV) lithography. It also looks ahead to the possible future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current literature, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to achieve robust, accurate, and cost-effective microlithography processes and systems.
Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology
Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1351831003
Category : Technology & Engineering
Languages : en
Pages : 893
Book Description
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Publisher: CRC Press
ISBN: 1351831003
Category : Technology & Engineering
Languages : en
Pages : 893
Book Description
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Extending Moore's Law through Advanced Semiconductor Design and Processing Techniques
Author: Wynand Lambrechts
Publisher: CRC Press
ISBN: 1351248650
Category : Computers
Languages : en
Pages : 345
Book Description
This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles: Traditional and modern photolithography, the primary limiting factor of Moore’s law Innovations in semiconductor manufacturing that makes current generation CMOS processing possible Multi-disciplinary technologies that could drive Moore's law forward significantly Design principles for microelectronic circuits and components that take advantage of technology miniaturization The semiconductor industry economic market trends and technical driving factors The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.
Publisher: CRC Press
ISBN: 1351248650
Category : Computers
Languages : en
Pages : 345
Book Description
This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles: Traditional and modern photolithography, the primary limiting factor of Moore’s law Innovations in semiconductor manufacturing that makes current generation CMOS processing possible Multi-disciplinary technologies that could drive Moore's law forward significantly Design principles for microelectronic circuits and components that take advantage of technology miniaturization The semiconductor industry economic market trends and technical driving factors The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.
Handbook of Integrated Circuit Industry
Author: Yangyuan Wang
Publisher: Springer Nature
ISBN: 9819928362
Category : Technology & Engineering
Languages : en
Pages : 2006
Book Description
Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.
Publisher: Springer Nature
ISBN: 9819928362
Category : Technology & Engineering
Languages : en
Pages : 2006
Book Description
Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.
2D Semiconducting Materials for Electronic, Photonic, and Optoelectronic Devices
Author: Anuj Kumar
Publisher: CRC Press
ISBN: 104011363X
Category : Science
Languages : en
Pages : 433
Book Description
Two-dimensional semiconducting materials (2D-SCMs) are the subject of intensive study in the fields of photonics and optoelectronics because of their unusual optical, electrical, thermal, and mechanical properties. The main objective of 2D Semiconducting Materials for Electronic, Photonic, and Optoelectronic Devices is to provide current, state-of-the-art knowledge of two-dimensional semiconducting materials for various applications. Two-dimensional semiconducting materials are the basic building blocks for making photodiodes, light-emitting diodes, light-detecting devices, data storage, telecommunications, and energy-storage devices. When it comes to two-dimensional semiconducting materials, electronic, photonic, and optoelectronic applications, as well as future plans for improving performance, no modern book covers as much ground. The planned book will fill such gaps by offering a comprehensive analysis of two-dimensional semiconducting materials. This book covers a range of advanced 2D materials, their fundamentals, and the chemistry for many emerging applications. All the chapters are covered by experts in these areas around the world, making this a suitable textbook for students and providing new guidelines to researchers and industries. • Covers topics such as fundamentals and advanced knowledge of two-dimensional semiconducting materials • Provides details about the recent methods used for the synthesis, characterization, and applications of two-dimensional semiconducting materials • Covers the state-of-the-art development in two-dimensional semiconducting materials and their emerging applications This book provides directions to students, scientists, and researchers in semiconductors and related disciplines to help them better understand the physics, characteristics, and applications of 2D semiconductors.
Publisher: CRC Press
ISBN: 104011363X
Category : Science
Languages : en
Pages : 433
Book Description
Two-dimensional semiconducting materials (2D-SCMs) are the subject of intensive study in the fields of photonics and optoelectronics because of their unusual optical, electrical, thermal, and mechanical properties. The main objective of 2D Semiconducting Materials for Electronic, Photonic, and Optoelectronic Devices is to provide current, state-of-the-art knowledge of two-dimensional semiconducting materials for various applications. Two-dimensional semiconducting materials are the basic building blocks for making photodiodes, light-emitting diodes, light-detecting devices, data storage, telecommunications, and energy-storage devices. When it comes to two-dimensional semiconducting materials, electronic, photonic, and optoelectronic applications, as well as future plans for improving performance, no modern book covers as much ground. The planned book will fill such gaps by offering a comprehensive analysis of two-dimensional semiconducting materials. This book covers a range of advanced 2D materials, their fundamentals, and the chemistry for many emerging applications. All the chapters are covered by experts in these areas around the world, making this a suitable textbook for students and providing new guidelines to researchers and industries. • Covers topics such as fundamentals and advanced knowledge of two-dimensional semiconducting materials • Provides details about the recent methods used for the synthesis, characterization, and applications of two-dimensional semiconducting materials • Covers the state-of-the-art development in two-dimensional semiconducting materials and their emerging applications This book provides directions to students, scientists, and researchers in semiconductors and related disciplines to help them better understand the physics, characteristics, and applications of 2D semiconductors.
Microfabrication and Nanofabrication
Author: Kanak Kalita
Publisher: Walter de Gruyter GmbH & Co KG
ISBN: 3111335534
Category : Technology & Engineering
Languages : en
Pages : 184
Book Description
This book unravels the intriguing interplay between macroscopic manufacturing processes and microscopic fabrication techniques. It dives into the sophisticated world of precision manufacturing, where high accuracy, controlled processes enable the production of complex components and products. It covers micro and nano fabrication, which revolutionizes conventional manufacturing by creating minuscule yet highly functional parts, some even smaller than the width of a human hair. This book explores various topics, from precise machining techniques to nanoimprint technology, reflecting the vast breadth and depth of this field. The aim is to provide readers with a comprehensive understanding of how these micro and macro scales intertwine, opening new frontiers in manufacturing. By showcasing the latest research findings and their practical applications, this book elucidates the enormous potential and implications of this burgeoning field. The contents are laid out in a user-friendly manner to communicate complex ideas in an accessible, engaging way, making it a valuable resource for anyone curious about the next big leap in manufacturing technology.
Publisher: Walter de Gruyter GmbH & Co KG
ISBN: 3111335534
Category : Technology & Engineering
Languages : en
Pages : 184
Book Description
This book unravels the intriguing interplay between macroscopic manufacturing processes and microscopic fabrication techniques. It dives into the sophisticated world of precision manufacturing, where high accuracy, controlled processes enable the production of complex components and products. It covers micro and nano fabrication, which revolutionizes conventional manufacturing by creating minuscule yet highly functional parts, some even smaller than the width of a human hair. This book explores various topics, from precise machining techniques to nanoimprint technology, reflecting the vast breadth and depth of this field. The aim is to provide readers with a comprehensive understanding of how these micro and macro scales intertwine, opening new frontiers in manufacturing. By showcasing the latest research findings and their practical applications, this book elucidates the enormous potential and implications of this burgeoning field. The contents are laid out in a user-friendly manner to communicate complex ideas in an accessible, engaging way, making it a valuable resource for anyone curious about the next big leap in manufacturing technology.