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Author: Aida Todri-Sanial
Publisher: CRC Press
ISBN: 1351830198
Category : Technology & Engineering
Languages : en
Pages : 409
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Book Description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author: Aida Todri-Sanial
Publisher: CRC Press
ISBN: 1351830198
Category : Technology & Engineering
Languages : en
Pages : 409
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Book Description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author: Brajesh Kumar Kaushik
Publisher: Springer
ISBN: 9811074704
Category : Computers
Languages : en
Pages : 820
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Book Description
This book constitutes the refereed proceedings of the 21st International Symposium on VLSI Design and Test, VDAT 2017, held in Roorkee, India, in June/July 2017. The 48 full papers presented together with 27 short papers were carefully reviewed and selected from 246 submissions. The papers were organized in topical sections named: digital design; analog/mixed signal; VLSI testing; devices and technology; VLSI architectures; emerging technologies and memory; system design; low power design and test; RF circuits; architecture and CAD; and design verification.
Author: Nabendu Chaki
Publisher: Springer
ISBN: 9811364591
Category : Technology & Engineering
Languages : en
Pages : 258
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Book Description
The book presents high-quality research work on cutting-edge technologies and the most-happening areas of computational intelligence and data engineering. It includes selected papers from the International Conference on Computational Intelligence and Data Engineering (ICCIDE 2018). The conference was conceived as a forum for researchers from academia and industry to present and share ideas and results and allow them to develop a comprehensive understanding of the challenges of technological advancements from different viewpoints. As such, this book helps foster strong links between academia and industry. It covers various topics, including collective intelligence, intelligent transportation systems, fuzzy systems, Bayesian network, ant colony optimization, data privacy and security, data mining, data warehousing, big data analytics, cloud computing, natural language processing, swarm intelligence, and speech processing.
Author: Ajith Abraham
Publisher: Springer Nature
ISBN: 3030711870
Category : Technology & Engineering
Languages : en
Pages : 1440
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Book Description
This book highlights recent research on intelligent systems and nature-inspired computing. It presents 130 selected papers from the 19th International Conference on Intelligent Systems Design and Applications (ISDA 2020), which was held online. The ISDA is a premier conference in the field of computational intelligence, and the latest installment brought together researchers, engineers and practitioners whose work involves intelligent systems and their applications in industry. Including contributions by authors from 40 countries, the book offers a valuable reference guide for all researchers, students and practitioners in the fields of Computer Science and Engineering.
Author: Srikanta Patnaik
Publisher: Springer Science & Business Media
ISBN: 8132217594
Category : Technology & Engineering
Languages : en
Pages : 858
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Book Description
The main objective of CSAIT 2013 is to provide a forum for researchers, educators, engineers and government officials involved in the general areas of Computational Sciences and Information Technology to disseminate their latest research results and exchange views on the future research directions of these fields. A medium like this provides an opportunity to the academicians and industrial professionals to exchange and integrate practice of computer science, application of the academic ideas, improve the academic depth. The in-depth discussions on the subject provide an international communication platform for educational technology and scientific research for the world's universities, engineering field experts, professionals and business executives.
Author: Guangyu Sun
Publisher: Springer Science & Business Media
ISBN: 3319006819
Category : Technology & Engineering
Languages : en
Pages : 126
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Book Description
This book equips readers with tools for computer architecture of high performance, low power, and high reliability memory hierarchy in computer systems based on emerging memory technologies, such as STTRAM, PCM, FBDRAM, etc. The techniques described offer advantages of high density, near-zero static power, and immunity to soft errors, which have the potential of overcoming the “memory wall.” The authors discuss memory design from various perspectives: emerging memory technologies are employed in the memory hierarchy with novel architecture modification; hybrid memory structure is introduced to leverage advantages from multiple memory technologies; an analytical model named “Moguls” is introduced to explore quantitatively the optimization design of a memory hierarchy; finally, the vulnerability of the CMPs to radiation-based soft errors is improved by replacing different levels of on-chip memory with STT-RAMs.
Author: Luc Claesen
Publisher: Springer
ISBN: 3319252798
Category : Computers
Languages : en
Pages : 255
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Book Description
This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
Author: Christoph Böhm
Publisher: Springer Science & Business Media
ISBN: 146145039X
Category : Technology & Engineering
Languages : en
Pages : 279
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Book Description
In Physical Unclonable Functions in Theory and Practice, the authors present an in-depth overview of various topics concerning PUFs, providing theoretical background and application details. This book concentrates on the practical issues of PUF hardware design, focusing on dedicated microelectronic PUF circuits. Additionally, the authors discuss the whole process of circuit design, layout and chip verification. The book also offers coverage of: Different published approaches focusing on dedicated microelectronic PUF circuits Specification of PUF circuits General design issues Minimizing error rate from the circuit’s perspective Transistor modeling issues of Montecarlo mismatch simulation and solutions Examples of PUF circuits including an accurate description of the circuits and testing/measurement results Different error rate reducing pre-selection techniques This monograph gives insight into PUFs in general and provides knowledge in the field of PUF circuit design and implementation. It could be of interest for all circuit designers confronted with PUF design, and also for professionals and students being introduced to the topic.
Author: Ibrahim (Abe) M. Elfadel
Publisher: Springer
ISBN: 3319204815
Category : Technology & Engineering
Languages : en
Pages : 354
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Book Description
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Author: Christos Koulamas
Publisher: MDPI
ISBN: 3038975095
Category : Computers
Languages : en
Pages : 189
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Book Description
This book is a printed edition of the Special Issue "Real-Time Embedded Systems" that was published in Electronics
