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Author: Allan D. Kraus
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . . Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities. Other topics covered include: Fundamentals of heat transfer Thermal modeling of electronic packages Mathematical tools for heat-sink analysis and design Prevailing thermal transport processes Models for a variety of fin geometries Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks Thermal characterization and optimization of plate-fin heat sinks Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
Author: Allan D. Kraus
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
Get Book Here
Book Description
A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . . Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities. Other topics covered include: Fundamentals of heat transfer Thermal modeling of electronic packages Mathematical tools for heat-sink analysis and design Prevailing thermal transport processes Models for a variety of fin geometries Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks Thermal characterization and optimization of plate-fin heat sinks Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
Author: H. S. Lee
Publisher: John Wiley & Sons
ISBN: 1118004701
Category : Science
Languages : en
Pages : 656
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Book Description
Thermal Design: Heat Sinks, Thermoelectrics, Heat Pipes, Compact Heat Exchangers, and Solar Cells, Second Edition, is a significantly updated new edition which now includes a chapter on thermoelectrics It covers thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. The underlying concepts in this book cover the understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and also the design of the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. This new edition includes more examples, problems and tutorials, and a solutions manual is available on a companion website.
Author: Yong Zhan
Publisher: Now Publishers Inc
ISBN: 1601981708
Category : Integrated circuits
Languages : en
Pages : 131
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Book Description
Provides an overview of analysis and optimization techniques for thermally-aware chip design.
Author: Adrian Bejan
Publisher: Springer Science & Business Media
ISBN: 0387476814
Category : Science
Languages : en
Pages : 360
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Book Description
Constructal Theory of Social Dynamics brings together for the first time social scientists and engineers who present predictive theory of social organization, as a conglomerate of mating flows that morph in time to flow more easily. The book offers a new way to look at social phenomena as part of natural phenomena, and examines a new domain of application of engineering such as thermodynamic optimization, thermoeconomics and "design as science".
Author: Malay Kumar Das
Publisher: CRC Press
ISBN: 1000853314
Category : Science
Languages : en
Pages : 424
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Book Description
Exclusive book integrating thermal sciences and computational approaches Covers both philosophical concepts related to systems and design, to numerical methods, to design of specific systems, to computational fluid dynamics strategies Focus on solving complex real-world thermal system design problems instead of just designing a single component or simple systems Introduces usage of statistics and machine learning methods to optimize the system Includes sample PYTHON codes, exercise problems, special projects
Author:
Publisher: Advanced Thermal Solutions
ISBN: 061523660X
Category :
Languages : en
Pages : 186
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Book Description
Author: Hengyun Zhang
Publisher: Woodhead Publishing
ISBN: 0081025335
Category : Technology & Engineering
Languages : en
Pages : 436
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Book Description
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
Author: Pradip Majumdar
Publisher: John Wiley & Sons
ISBN: 1118956931
Category : Technology & Engineering
Languages : en
Pages : 708
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Book Description
Design of Thermal Energy Systems Pradip Majumdar, Northern Illinois University, USA A comprehensive introduction to the design and analysis of thermal energy systems Design of Thermal Energy Systems covers the fundamentals and applications in thermal energy systems and components, including conventional power generation and cooling systems, renewable energy systems, heat recovery systems, heat sinks and thermal management. Practical examples are used throughout and are drawn from solar energy systems, fuel cell and battery thermal management, electrical and electronics cooling, engine exhaust heat and emissions, and manufacturing processes. Recent research topics such as steady and unsteady state simulation and optimization methods are also included. Key features: Provides a comprehensive introduction to the design and analysis of thermal energy systems, covering fundamentals and applications. Includes a wide range of industrial application problems and worked out example problems. Applies thermal analysis techniques to generate design specification and ratings. Demonstrates how to design thermal systems and components to meet engineering specifications. Considers alternative options and allows for the estimation of cost and feasibility of thermal systems. Accompanied by a website including software for design and analysis, a solutions manual, and presentation files with PowerPoint slides. The book is essential reading for: practicing engineers in energy and power industries; consulting engineers in mechanical, electrical and chemical engineering; and senior undergraduate and graduate engineering students.
Author: Arun K. Saha
Publisher: Springer
ISBN: 8132227433
Category : Technology & Engineering
Languages : en
Pages : 1638
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Book Description
This volume comprises the proceedings of the 42nd National and 5th International Conference on Fluid Mechanics and Fluid Power held at IIT Kanpur in December, 2014.The conference proceedings encapsulate the best deliberations held during the conference. The diversity of participation in the conference, from academia, industry and research laboratories reflects in the articles appearing in the volume. This contributed volume has articles from authors who have participated in the conference on thematic areas such as Fundamental Issues and Perspectives in Fluid Mechanics; Measurement Techniques and Instrumentation; Computational Fluid Dynamics; Instability, Transition and Turbulence; Turbomachinery; Multiphase Flows; Fluid‐Structure Interaction and Flow‐Induced Noise; Microfluidics; Bio‐inspired Fluid Mechanics; Internal Combustion Engines and Gas Turbines; and Specialized Topics. The contents of this volume will prove useful to researchers from industry and academia alike.
Author: Mourad Rebay
Publisher: CRC Press
ISBN: 1498736319
Category : Science
Languages : en
Pages : 499
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Book Description
Microscale and Nanoscale Heat Transfer: Analysis, Design, and Applications features contributions from prominent researchers in the field of micro- and nanoscale heat transfer and associated technologies and offers a complete understanding of thermal transport in nano-materials and devices. Nanofluids can be used as working fluids in thermal system
