Author: Eric Garfunkel
Publisher: Springer Science & Business Media
ISBN: 9780792350071
Category : Technology & Engineering
Languages : en
Pages : 528
Book Description
An extrapolation of ULSI scaling trends indicates that minimum feature sizes below 0.1 mu and gate thicknesses of Audience: Both expert scientists and engineers who wish to keep up with cutting edge research, and new students who wish to learn more about the exciting basic research issues relevant to next-generation device technology.
Fundamental Aspects of Ultrathin Dielectrics on Si-based Devices
Author: Eric Garfunkel
Publisher: Springer Science & Business Media
ISBN: 9780792350071
Category : Technology & Engineering
Languages : en
Pages : 528
Book Description
An extrapolation of ULSI scaling trends indicates that minimum feature sizes below 0.1 mu and gate thicknesses of Audience: Both expert scientists and engineers who wish to keep up with cutting edge research, and new students who wish to learn more about the exciting basic research issues relevant to next-generation device technology.
Publisher: Springer Science & Business Media
ISBN: 9780792350071
Category : Technology & Engineering
Languages : en
Pages : 528
Book Description
An extrapolation of ULSI scaling trends indicates that minimum feature sizes below 0.1 mu and gate thicknesses of Audience: Both expert scientists and engineers who wish to keep up with cutting edge research, and new students who wish to learn more about the exciting basic research issues relevant to next-generation device technology.
Monitoring and Control of Plasma-enhanced Processing of Semiconductors
Author: James E. Griffiths
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 164
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 164
Book Description
Proceedings of the ... European Conference on Chemical Vapor Deposition
Author:
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 640
Book Description
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 640
Book Description
ULSI Process Integration III
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566773768
Category : Technology & Engineering
Languages : en
Pages : 620
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566773768
Category : Technology & Engineering
Languages : en
Pages : 620
Book Description
Fundamentals of Semiconductor Processing Technology
Author: Badih El-Kareh
Publisher: Springer Science & Business Media
ISBN: 1461522099
Category : Technology & Engineering
Languages : en
Pages : 605
Book Description
The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster, and more reliable circuits with lower power consumption. The development of new processing tools and technologies is aimed at optimizing one or more of these requirements. This goal can, however, only be achieved by a concerted effort between scientists, engineers, technicians, and operators in research, development, and manufac turing. It is therefore important that experts in specific disciplines, such as device and circuit design, understand the principle, capabil ities, and limitations of tools and processing technologies. It is also important that those working on specific unit processes, such as lithography or hot processes, be familiar with other unit processes used to manufacture the product. Several excellent books have been published on the subject of process technologies. These texts, however, cover subjects in too much detail, or do not cover topics important to modem tech nologies. This book is written with the need for a "bridge" between different disciplines in mind. It is intended to present to engineers and scientists those parts of modem processing technologies that are of greatest importance to the design and manufacture of semi conductor circuits. The material is presented with sufficient detail to understand and analyze interactions between processing and other semiconductor disciplines, such as design of devices and cir cuits, their electrical parameters, reliability, and yield.
Publisher: Springer Science & Business Media
ISBN: 1461522099
Category : Technology & Engineering
Languages : en
Pages : 605
Book Description
The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster, and more reliable circuits with lower power consumption. The development of new processing tools and technologies is aimed at optimizing one or more of these requirements. This goal can, however, only be achieved by a concerted effort between scientists, engineers, technicians, and operators in research, development, and manufac turing. It is therefore important that experts in specific disciplines, such as device and circuit design, understand the principle, capabil ities, and limitations of tools and processing technologies. It is also important that those working on specific unit processes, such as lithography or hot processes, be familiar with other unit processes used to manufacture the product. Several excellent books have been published on the subject of process technologies. These texts, however, cover subjects in too much detail, or do not cover topics important to modem tech nologies. This book is written with the need for a "bridge" between different disciplines in mind. It is intended to present to engineers and scientists those parts of modem processing technologies that are of greatest importance to the design and manufacture of semi conductor circuits. The material is presented with sufficient detail to understand and analyze interactions between processing and other semiconductor disciplines, such as design of devices and cir cuits, their electrical parameters, reliability, and yield.
Proceedings of the 16th Annual Conference on the Physics and Chemistry of Semiconductor Interfaces
Author:
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 376
Book Description
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 376
Book Description
Interlayer Dielectrics for Semiconductor Technologies
Author: Shyam P Muraka
Publisher: Elsevier
ISBN: 0080521959
Category : Science
Languages : en
Pages : 459
Book Description
Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package.* Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume* written by renowned experts in the field* Provides an up-to-date starting point in this young research field.
Publisher: Elsevier
ISBN: 0080521959
Category : Science
Languages : en
Pages : 459
Book Description
Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package.* Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume* written by renowned experts in the field* Provides an up-to-date starting point in this young research field.
Atomic Layer Deposition for Semiconductors
Author: Cheol Seong Hwang
Publisher: Springer Science & Business Media
ISBN: 146148054X
Category : Science
Languages : en
Pages : 266
Book Description
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Publisher: Springer Science & Business Media
ISBN: 146148054X
Category : Science
Languages : en
Pages : 266
Book Description
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
ULSI Process Integration II
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 9781566773089
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566773089
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Rapid Thermal and Other Short-time Processing Technologies II
Author: Dim-Lee Kwong
Publisher: The Electrochemical Society
ISBN: 9781566773157
Category : Technology & Engineering
Languages : en
Pages : 458
Book Description
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
Publisher: The Electrochemical Society
ISBN: 9781566773157
Category : Technology & Engineering
Languages : en
Pages : 458
Book Description
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."