Chemical Aspects of Electronic Ceramics Processing: Volume 495 PDF Download
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Author: Prashant N. Kumta
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 496
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Book Description
Containing 65 papers from the symposium titled Chemical Aspects of Electronic Ceramics Processing held in November- December 1997 in Boston, the contents of this volume are divided into five sections: chemical vapor deposition of oxide ceramics; chemical vapor deposition of nonoxide ceramics; solution routes to ceramic materials; characterization and application of ceramic materials; and process characterization as a form of novel processing of ceramic materials. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Prashant N. Kumta
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 496
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Book Description
Containing 65 papers from the symposium titled Chemical Aspects of Electronic Ceramics Processing held in November- December 1997 in Boston, the contents of this volume are divided into five sections: chemical vapor deposition of oxide ceramics; chemical vapor deposition of nonoxide ceramics; solution routes to ceramic materials; characterization and application of ceramic materials; and process characterization as a form of novel processing of ceramic materials. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Parshant Kumta
Publisher:
ISBN:
Category :
Languages : en
Pages : 461
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Book Description
This volume contains 65 papers from a symposium entitled "Chemical Aspects of Electronic Ceramics Processing," held over four days at the 1997 MRS?all Meeting in Boston. This symposium is the "merger" of two previously held symposia, "Non- Oxide Ceramics" and "Metal Organic Chemical Vapor Deposition of Electronic Ceramics," both held twice before in the Fall of 1993 and the l"all of 1995. The considerable overlap, between the two symposia, especially in the area of chemical vapor deposition of non-oxide electronic ceramics, suggested that combining the two would attract a wider audience without unduly sacrificing the focus of the symposium. The common themes in all of the research presented in this volume are the creative use of chemistry principles for ceramic fabrication and a multidisciplinary approach to materials research. Inorganic chemistry, solid-state chemistry, chemical engineering, materials science and engineering, and electrical engineering have all been skillfully combined to produce materials which will play an increasingly more important part in our lives. As in prior years, chemical vapor deposition (CVD) continues to be a popular area of research and was the subject of approximately half of the papers in this volume. Farticularly "hot" areas of research are new and improved precursors, delivery systems for low-vapor pressure precursors, and improved processing and materials properties.?apers are evenly divided between oxide ceramics and non- oxide ceramics.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 5
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Book Description
Author: B. Mulder
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 248
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Book Description
The 34 papers investigate the processing routes and properties of the complex molecular and macromolecular structures that hold biological cells together, both to reveal some of the mysteries of cell function and to identify natural solutions for optimizing membranes that might be adapted for applications in materials science. They cover the mechanics of DNA; the cytoskeleton, semiflexible polymers, polyelectrolytes, and motor proteins; properties and models of membranes and their interactions with macromolecules; biomaterials; and cells and cellular processes. Annotation copyrighted by Book News, Inc., Portland, OR
Author: David Mitzi
Publisher: John Wiley & Sons
ISBN: 0470407611
Category : Science
Languages : en
Pages : 522
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Book Description
Discover the materials set to revolutionize the electronics industry The search for electronic materials that can be cheaply solution-processed into films, while simultaneously providing quality device characteristics, represents a major challenge for materials scientists. Continuous semiconducting thin films with large carrier mobilities are particularly desirable for high-speed microelectronic applications, potentially providing new opportunities for the development of low-cost, large-area, flexible computing devices, displays, sensors, and solar cells. To date, the majority of solution-processing research has focused on molecular and polymeric organic films. In contrast, this book reviews recent achievements in the search for solution-processed inorganic semiconductors and other critical electronic components. These components offer the potential for better performance and more robust thermal and mechanical stability than comparable organic-based systems. Solution Processing of Inorganic Materials covers everything from the more traditional fields of sol-gel processing and chemical bath deposition to the cutting-edge use of nanomaterials in thin-film deposition. In particular, the book focuses on materials and techniques that are compatible with high-throughput, low-cost, and low-temperature deposition processes such as spin coating, dip coating, printing, and stamping. Throughout the text, illustrations and examples of applications are provided to help the reader fully appreciate the concepts and opportunities involved in this exciting field. In addition to presenting the state-of-the-art research, the book offers extensive background material. As a result, any researcher involved or interested in electronic device fabrication can turn to this book to become fully versed in the solution-processed inorganic materials that are set to revolutionize the electronics industry.
Author: Kwang-Leong Choy
Publisher: CRC Press
ISBN: 1000691071
Category : Science
Languages : en
Pages : 492
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Book Description
This book offers a timely and complete overview on chemical vapour deposition (CVD) and its variants for the processing of nanoparticles, nanowires, nanotubes, nanocomposite coatings, thin and thick films, and composites. Chapters discuss key aspects, from processing, material structure and properties to practical use, cost considerations, versatility, and sustainability. The author presents a comprehensive overview of CVD and its potential in producing high performance, cost-effective nanomaterials and thin and thick films. Features Provides an up-to-date introduction to CVD technology for the fabrication of nanomaterials, nanostructured films, and composite coatings Discusses processing, structure, functionalization, properties, and use in clean energy, engineering, and biomedical grand challenges Covers thin and thick films and composites Compares CVD with other processing techniques in terms of structure/properties, cost, versatility, and sustainability Kwang-Leong Choy is the Director of the UCL Centre for Materials Discovery and Professor of Materials Discovery in the Institute for Materials Discovery at the University College London. She earned her D.Phil. from the University of Oxford, and is the recipient of numerous honors including the Hetherington Prize, Oxford Metallurgical Society Award, and Grunfeld Medal and Prize from the Institute of Materials (UK). She is an elected fellow of the Institute of Materials, Minerals and Mining, and the Royal Society of Chemistry.
Author: Anthony F. Flannery (Jr.)
Publisher: Stanford University
ISBN:
Category :
Languages : en
Pages : 146
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Book Description
around the gaskets.
Author: S. J. Pearton
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 478
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Daniel J. Belton
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 288
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Book Description
Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR
Author: John C. Bravman
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 392
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Book Description
