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Author: S Nihtianov
Publisher: Woodhead Publishing
ISBN: 0857099299
Category : Technology & Engineering
Languages : en
Pages : 563
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Book Description
Smart sensors and MEMS can include a variety of devices and systems that have a high level of functionality. They do this either by integrating multiple sensing and actuating modes into one device, or else by integrating sensing and actuating with information processing, analog-to-digital conversion and memory functions.Part one outlines the industrial applications for smart sensors, covering direct interface circuits for sensors, capacitive sensors for displacement measurement in the sub-nanometer range, integrated inductive displacement sensors for harsh industrial environments, advanced silicon radiation detectors in the vacuum ultraviolet (VUV) and extreme ultraviolet (EUV) spectral range, and advanced optical incremental sensors (encoders and interferometers), among other topics. The second part of the book describes the industrial applications of smart micro-electro-mechanical systems (MEMS). Some of the topics covered in this section include microfabrication technologies used for creating smart devices for industrial applications, microactuators, dynamic behaviour of smart MEMS in industrial applications, MEMS integrating motion and displacement sensors, MEMS print heads for industrial printing, Photovoltaic and fuel cells in power MEMS for smart energy management, and radio frequency (RF)-MEMS for smart communication microsystems.Smart sensors and MEMS is invaluable reference for academics, materials scientists and electrical engineers working in the microelectronics, sensors and micromechanics industry, and engineers looking for industrial sensing, monitoring and automation solutions. - Outlines industrial applications for smart sensors and smart MEMS - Covers smart sensors including capacitive, inductive, resistive and magnetic sensors and sensors to detect radiation and measure temperature - Covers smart MEMS including power MEMS, radio frequency MEMS, optical MEMS, inertial MEMS, and microreaction chambers
Author: S Nihtianov
Publisher: Woodhead Publishing
ISBN: 0857099299
Category : Technology & Engineering
Languages : en
Pages : 563
Get Book Here
Book Description
Smart sensors and MEMS can include a variety of devices and systems that have a high level of functionality. They do this either by integrating multiple sensing and actuating modes into one device, or else by integrating sensing and actuating with information processing, analog-to-digital conversion and memory functions.Part one outlines the industrial applications for smart sensors, covering direct interface circuits for sensors, capacitive sensors for displacement measurement in the sub-nanometer range, integrated inductive displacement sensors for harsh industrial environments, advanced silicon radiation detectors in the vacuum ultraviolet (VUV) and extreme ultraviolet (EUV) spectral range, and advanced optical incremental sensors (encoders and interferometers), among other topics. The second part of the book describes the industrial applications of smart micro-electro-mechanical systems (MEMS). Some of the topics covered in this section include microfabrication technologies used for creating smart devices for industrial applications, microactuators, dynamic behaviour of smart MEMS in industrial applications, MEMS integrating motion and displacement sensors, MEMS print heads for industrial printing, Photovoltaic and fuel cells in power MEMS for smart energy management, and radio frequency (RF)-MEMS for smart communication microsystems.Smart sensors and MEMS is invaluable reference for academics, materials scientists and electrical engineers working in the microelectronics, sensors and micromechanics industry, and engineers looking for industrial sensing, monitoring and automation solutions. - Outlines industrial applications for smart sensors and smart MEMS - Covers smart sensors including capacitive, inductive, resistive and magnetic sensors and sensors to detect radiation and measure temperature - Covers smart MEMS including power MEMS, radio frequency MEMS, optical MEMS, inertial MEMS, and microreaction chambers
Author: Hao Yu
Publisher: John Wiley & Sons
ISBN: 1119218357
Category : Technology & Engineering
Languages : en
Pages : 290
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Book Description
A thorough examination of lab-on-a-chip circuit-level operations to improve system performance A rapidly aging population demands rapid, cost-effective, flexible, personalized diagnostics. Existing systems tend to fall short in one or more capacities, making the development of alternatives a priority. CMOS Integrated Lab-on-a-Chip System for Personalized Biomedical Diagnosis provides insight toward the solution, with a comprehensive, multidisciplinary reference to the next wave of personalized medicine technology. A standard complementary metal oxide semiconductor (CMOS) fabrication technology allows mass-production of large-array, miniaturized CMOS-integrated sensors from multi-modal domains with smart on-chip processing capability. This book provides an in-depth examination of the design and mechanics considerations that make this technology a promising platform for microfluidics, micro-electro-mechanical systems, electronics, and electromagnetics. From CMOS fundamentals to end-user applications, all aspects of CMOS sensors are covered, with frequent diagrams and illustrations that clarify complex structures and processes. Detailed yet concise, and designed to help students and engineers develop smaller, cheaper, smarter lab-on-a-chip systems, this invaluable reference: Provides clarity and insight on the design of lab-on-a-chip personalized biomedical sensors and systems Features concise analyses of the integration of microfluidics and micro-electro-mechanical systems Highlights the use of compressive sensing, super-resolution, and machine learning through the use of smart SoC processing Discusses recent advances in complementary metal oxide semiconductor-integrated lab-on-a-chip systems Includes guidance on DNA sequencing and cell counting applications using dual-mode chemical/optical and energy harvesting sensors The conventional reliance on the microscope, flow cytometry, and DNA sequencing leaves diagnosticians tied to bulky, expensive equipment with a central problem of scale. Lab-on-a-chip technology eliminates these constraints while improving accuracy and flexibility, ushering in a new era of medicine. This book is an essential reference for students, researchers, and engineers working in diagnostic circuitry and microsystems.
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
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Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author: Thomas J. Mueller
Publisher: Springer Science & Business Media
ISBN: 3662050587
Category : Technology & Engineering
Languages : en
Pages : 327
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Book Description
The book describes recent developments in aeroacoustic measurements in wind tunnels and the interpretation of the resulting data. The reader will find the latest measurement techniques described along with examples of the results.
Author: P. T. Moseley
Publisher: CRC Press
ISBN:
Category : Art
Languages : en
Pages : 266
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Book Description
An overview of the principles & current technology of the main sensor types used for flammable gas detection, oxygen monitoring in combustion & car-exhaust control. Also includes toxic gas monitoring. A companion volume to Techniques & Mechanisms in Gas Sensing.
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 1259861562
Category : Technology & Engineering
Languages : en
Pages : 849
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Book Description
A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field
Author: Subhas Chandra Mukhopadhyay
Publisher: Springer Nature
ISBN: 3030626849
Category : Technology & Engineering
Languages : en
Pages : 407
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Book Description
The book highlights the research contributions of the interdigitated (IDT) sensors over a period of two decades in the field of sensing technology. It presents theory, design, and practical realization of the IDT sensors working over wide frequency rage for scientific, industrial, and consumer applications. The IDT sensors have been widely investigated for wide range of sensing applications including agriculture, environmental monitoring, structural health monitoring, health care, food and beverage testing, testing of dielectric material, proximity sensing, microfluidic application, automatic dispensing system etc. Hence, importance of IDT sensors is growing continuously for future applications. As such, it offers a key reference guide on IDT sensors for students, applied physicists, material scientists, engineers, sensors designers and technicians.
Author: Warren Perry Mason
Publisher:
ISBN:
Category : Electric circuits
Languages : en
Pages : 442
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Book Description
Author: Yung-cheng Lee
Publisher: World Scientific
ISBN: 9813229373
Category : Technology & Engineering
Languages : en
Pages : 363
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Book Description
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Author: Jyotsna Kumar Mandal
Publisher: Springer
ISBN: 9811313431
Category : Computers
Languages : en
Pages : 749
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Book Description
This book constitutes the refereed proceedings of the 52nd Annual Convention of the Computer Society of India, CSI 2017, held in Kolkata, India, in January 2018. The 59 revised papers presented were carefully reviewed and selected from 157 submissions. The theme of CSI 2017, Social Transformation – Digital Way, was selected to highlight the importance of technology for both central and state governments at their respective levels to achieve doorstep connectivity with its citizens. The papers are organized in the following topical sections: Signal processing, microwave and communication engineering; circuits and systems; data science and data analytics; bio computing; social computing; mobile, nano, quantum computing; data mining; security and forensics; digital image processing; and computational intelligence.
